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IPC-DVD-47 - WAVE SOLDERING
IPC
A description is not available for this item.
SAE ARP1332 - Wave Soldering Procedure
August 1, 2013 - SAE

The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering. The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fabricating...

IPC-TM-650 2.4.14.1 - Solderability, Wave Solder Method
March 1, 1979 - IPC

This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered by wave soldering machine methods or other soldering devices. The...

IPC-TR-460 - Trouble Shooting Checklist for Wave Soldering of Printed Wiring Boards
February 1, 1984 - IPC

FOREWORD The material published in this document is a compilation of contributions from members of several comnittees coordinated by the Soldering Solderability Specification Task Group. The objective of this document is to provide a checklist of causes and recommended corrective...

DI-T-5451 - WAVE SOLDER BATH ANALYSIS
NPFC
A description is not available for this item.
DS/EN 14612 - Space product assurance - Verification and approval of automatic machine wave soldering
November 12, 2003 - DS

This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of double-sided and multilayer boards are also defined.

DIN EN 16602-70-07 - Space product assurance - Verification and approval of automatic machine wave soldering; English version EN 16602-70-07:2014
January 1, 2015 - DIN

This specification defines the basic requirements for the verification and approval of automatic machine wave soldering for use in spacecraft hardware. The process requirements for wave soldering of doublesided and multilayer boards are also defined. This standard may be...

IEC 62739-3 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 3: Selection guidance of erosion test methods
January 1, 2017 - IEC

This part of IEC 62739 describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which...

CEI EN 62739-1 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy Part 1: Erosion test method for metal materials without surface processing
April 1, 2014 - CEI

This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten...

DS/EN 62739-1 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
September 30, 2013 - DS

IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

IEC 62739-1 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 1: Erosion test method for metal materials without surface processing
June 1, 2013 - IEC

This part of the IEC 62739 series provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten...

IPC-S-803 - SOLDERABILITY TEST 4 WAVE SOLDERED PRNTD WIRG BRDS
IPC
A description is not available for this item.
DS/EN 62739-3 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 3: Selection guidance of erosion test methods
April 4, 2017 - DS

IEC 62739-3:2017(E) describes the selection methodology of an appropriate evaluating test method for the erosion of the metal materials without or with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and...

DS/EN 62739-2 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 2: Erosion test method for metal materials with surface processing
October 11, 2016 - DS

IEC 62739-2:2016 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It aims at...

IEC 62739-2 - Test method for erosion of wave soldering equipment using molten lead-free solder alloy – Part 2: Erosion test method for metal materials with surface processing
July 1, 2016 - IEC

This part of IEC 62739 provides an evaluating test method for the erosion of the metallic materials with surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder. It...

BS EN 14612 - Space product assurance Verification and approval of automatic machine wave soldering
January 19, 2004 - BSI
A description is not available for this item.
EIA-364-71 - TP-71C Solder Wicking (Wave Solder Technique) Test Procedure for Electrical Connectors and Sockets
May 1, 2008 - ECIA

This standard applies to connectors and sockets that are mounted to printed wiring boards (PWB) employing through mount technology.

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