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This standard is applicable to manual soldering and machine soldering processes utilizing controlled soldering devices, for electrical connections for wiring and cabling used in aerospace vehicles. Description of a component or device herein is not to be construed as...
This standard is applicable to manual soldering and machine soldering processes utilizing controlled soldering devices, for electrical connections for wiring and cabling used in aerospace vehicles. Description of a component or device herein is not to be construed as...
This standard is applicable to manual soldering and machine soldering processes utilizing controlled soldering devices, for electrical connections for wiring and cabling used in aerospace vehicles. Description of a component or device herein is not to be construed as...
This standard is applicable to manual soldering and machine soldering processes utilizing controlled soldering devices, for electrical connections for wiring and cabling used in aerospace vehicles. Description of a component or device herein is not to be construed as...
This standard is a collection of visual quality acceptability criteria for solder paste printing. Purpose The purpose of this guideline document is to support the user in the visual evaluation of the solder paste printing process, which makes subsequent process optimizing...
This part of IEC 61190 specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and...
This part of IEC 61190 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly...
IEC 61190-1-2:2014-02(en
Lists the inspection requirements and supplementary information for solder-sealed quartz crystal units of assessed quality which are intended for oscillator applications. The requirements of the schedule are the minimum mandatory requirements for the general application category of BS...
This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force/energy testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force, fracture...
This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered by wave soldering machine methods or other soldering devices. The...
This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball shear force/energy testing prior to end-use attachment. Solder balls are sheared individually; force, fracture energy and failure...
1. SCOPE The material defined by this specification is a paste solder consisting of prealloyed powdered solder metal and an organic-type flux.
Purpose The purpose of this handbook is to provide additional supporting information for IPC-SM-840 regarding solder mask types, processes, characteristics and properties in order to assist with the correct selection and use of the most appropriate material for the intended application. It...
This test is to determine the ability of a printed pattern of solder paste to retain a probe placed in the solder paste by measuring the force required to separate the probe from the paste. Time between printing and probe placement are progressively increased to simulate variables in...
This specification covers wire, strip, bars, pigs, or as ordered. Alloy: 1.5 Sn Solder UNS Number: L50131
This test method is to determine the physical endurance of applied polymer solder mask to sudden changes of high and low temperature excursions to cause physical fatigue.
