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This document establishes metrology guidelines to electrically and reliably detect solder joint opens on Flip-Chip Ball Grid Array (FCBGA) SMT board assemblies during the mechanical shock or drop event. In-situ metrology can monitor not only FCBGA assembly with daisy-chain components...
This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some test methods that can help...
This test method is used to determine whether solid state devices can withstand the effect of the temperature shock to which they will be subjected during soldering of their leads in a solderwave process and/or solder fountain (rework/replacement)
Soldering of SMT components is performed, in general, at a relatively low soldering temperature (215°C). Thus, the reflow characteristics of the finish must be carefully considered. In addition, the solder joint itself is less forgiving to marginal conditions which may...
This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force/energy testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force, fracture...
This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures....
This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered by wave soldering machine methods or other soldering devices. The...
This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball shear force/energy testing prior to end-use attachment. Solder balls are sheared individually; force, fracture energy and failure...
1. SCOPE The material defined by this specification is a paste solder consisting of prealloyed powdered solder metal and an organic-type flux.
Purpose The purpose of this handbook is to provide additional supporting information for IPC-SM-840 regarding solder mask types, processes, characteristics and properties in order to assist with the correct selection and use of the most appropriate material for the intended application. It...
This Handbook addresses the removal of solder paste and uncured/unreacted SMT adhesives from stencils, misprinted printed circuit boards (PCBs) and application tools connected to the soldering paste application processes. Purpose The purpose of this handbook is to provide a...
This test is to determine the ability of a printed pattern of solder paste to retain a probe placed in the solder paste by measuring the force required to separate the probe from the paste. Time between printing and probe placement are progressively increased to simulate variables in...
This specification covers wire, strip, bars, pigs, or as ordered. Alloy: 1.5 Sn Solder UNS Number: L50131
This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-
This test method is to determine the physical endurance of applied polymer solder mask to sudden changes of high and low temperature excursions to cause physical fatigue.
This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-
This specification covers solder metal alloys (commonly known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony- copper-silver, tin-antimony-copper-
The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take full advantage of this phenomenon, it is necessary to understand the conditions under...
This specification covers solder metal alloys (also known as soft solders) used in non-electronic applications, including but not limited to, tin-lead, tin-antimony, tin-antimony-copper-
This specification covers a tin-lead solder in the form of wire, strip, bars, and pigs.
