Wave IPC Solder Standards

This document is intended to provide a recommended test method, which may be used by both vendor and user to determine solderability of PWBs, with or without surface coatings, which will be soldered by wave soldering machine methods or other soldering devices. The...

FOREWORD The material published in this document is a compilation of contributions from members of several comnittees coordinated by the Soldering Solderability Specification Task Group. The objective of this document is to provide a checklist of causes and recommended corrective...

Purpose The purpose of this handbook is to provide additional supporting information for IPC-SM-840 regarding solder mask types, processes, characteristics and properties in order to assist with the correct selection and use of the most appropriate material for the intended...

This test is to determine the ability of a printed pattern of solder paste to retain a probe placed in the solder paste by measuring the force required to separate the probe from the paste. Time between printing and probe placement are progressively increased to simulate variables in...

This document describes manufacturing solder process limits that components subjected to IPC-9501, IPC-9503, IPC-9504 and J-STD-020 would survive. It does not include optimum conditions for assembly, but rather guides to assure components are not damaged. This document...

This test method is to determine the physical endurance of applied polymer solder mask to sudden changes of high and low temperature excursions to cause physical fatigue.

This handbook is a companion to the solder paste standard J-STD-005 and should be considered to be a guide to help assess the applicability of a solder paste for its use in surface mount technology (SMT) processes. This document also suggests some test methods that can help with...

This standard is a collection of visual quality acceptability criteria for solder paste printing. Purpose The purpose of this guideline document is to support the user in the visual evaluation of the solder paste printing process, which makes subsequent process optimizing possible....

This handbook addresses solvent cleaning of electrical/ electronic assemblies, parts and application tools after soldering.

This test method defines the procedure for determining the adhesion of solder resists (masks) used over melting metals, (such as solder plated and reflowed solder printed boards both prior to and after soldering), nonmelting metals, and printed board substrates.

This handbook addresses aqueous cleaning of electrical/ electronic parts and application tools after soldering. Purpose The content of this text is intended to provide a basic understanding of the subject and to serve as a guide to users or prospective users of aqueous cleaning technology,...

The dielectric strength test (also called highpotential [Hi-Pot], over potential, or voltage breakdown) consists of the application of a test voltage for a specific time between mutually insulated portions of a printed board or between insulated portions and ground. This is used to prove that the...

Introduction This Trough-Hole Solder Joint Evaluation Desk Reference Manual provides visual exmples of acceptaility requirements, defects and conditions found in through-hole solder joints on electronic assemblies. This manual is intended for use as an illustrated support document to...

This document is intended to cover all aspects, both method and degree, of cleaning associated with the preparation of bare printed circuit boards prior to solder mask application. It continues with the prudent control of the cleanliness level during the solder mask application and...

This document describes manufacturing process simulations for use with applicable component specifications to assure that electronic components can meet expected reliability requirements after exposure to assembly factory processes. It is not intended as an assembly production specification or a...

This handbook addresses semi-aqueous cleaning of electrical/electronic assemblies, parts and application tools after soldering. Semi-aqueous cleaning or hydrocarbon surfactant cleaning is a process in which flux residues and other contaminants are removed from printed wiring assemblies by...

This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask material under evaluation with the minimum of test redundancy. This specification shall establish the requirements for: • The evaluation of...