Standards Library

7,501-8,000 of 21,454 results for "Electronics"

DIN IEC 62453-301
Title: Field Device Tool Interface Specification - Part 301: Communication profile integration - IEC 61784 CPF 1; English version IEC 65E/7/CD:2007
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 56/432/CD
Title: Guide for reliability stress screening - Part 2: Electronic components (IEC 56/432/CD)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 39/239/CD
Title: Preparation of outline drawings for cathode ray tubes, their components, connection and gauges (IEC 39/239/CD:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN EN 140100
Title: Sectional specification: Fixed low power film resistors; German version prEN 140100:2006
Organization: DIN
Year: 2007
Status: Inactive
VDI/VDE 3710
Title: Fertigung von Leiterplatten; Uebersicht und Verfahrenszusammenstellung
Organization: VDI
Year: 1979
Status: Inactive
DIN IEC 47A(Sec)292
Title: Interface integrated circuits; amendments and additions to IEC 60748-4, clauses 2 and 3; identical with IEC 47A(Secretariat)292
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 40(CO)621
Title: Fixed resistors for use in electronic equipment; sectional specification: fixed chip resistors
Organization: DIN
Year: 1985
Status: Inactive
DIN EN 60191-2-50
Title: Mechanical standardization for semiconductor devices - Plastic low profile quad flatpack (HLQFP) - Outline family, heat slug down (IEC 47D/407/CDV:2000); German version prEN 60191-2-50:2000
Organization: DIN
Year: 2001
Status: Inactive
DIN EN 50216-2
Title: Power transformer and reactor fittings - Part 2: Gas and oil actuated relay for liquid immersed transformers and reactors with conservator; German version prEN 50216-2:1997
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 61747-2-2
Title: Liquid crystal and solid-state display devices - Part 2-2: Matrix colour LCD modules; Blank detail specification (IEC 47C/274/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 61249-4-17
Title: Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated...
Organization: DIN
Year: 2007
Status: Inactive
DIN EN ISP 12063-2
Title: Information technology - International standardized profiles AMH3n - Message handling systems, EDI messaging - Part 2: AMH31 EDIMG content (regional version of ISO/IEC ISP 12063-2:1995); English ve...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60512-16-11
Title: Connectors for electronic equipment - Tests and measurements - Part 16-11: Mechanical tests on contacts and terminations - Test 16k: Stripping force, solderless wrapped connections (IEC 48B/1570/CD...
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 47A(CO)179
Title: Integrated circuits; pre-cap internal visual examination; identical with IEC 47A(Central Office)179
Organization: DIN
Year: 1988
Status: Inactive
DIN IEC 48D/142/CD
Title: Sectional specification for outdoor enclosures (IEC 48D/142/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN EN ISP 11185-10
Title: Information technology - International Standardized Profiles FVT2nn - Virtual Terminal Basic Class; register of control object type definitions - Part 10: FVT231; forms FEPCO (Field Entry Pilot Con...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 62227
Title: Multimedia home server systems - Digital rights permission code (IEC 100/1160/CD:2006)
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 60738-1/A1
Title: Thermistors - Directly heated positive temperature coefficient - Part 1: Generic specification (IEC 40/1904/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN EN ISP 12062-5
Title: Information technology - International Standardized Profiles AMH2n, message handling systems, interpersonal messaging - Part 5: AMH24-IPM requirements for enhanced MS access (P7) (ISO/IEC ISP 12062...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 62453-315
Title: Field Device Tool Interface Specification - Part 315: Communication profile integration - IEC 61784 CPF 15; English version IEC 65E/13/CD:2007
Organization: DIN
Year: 2008
Status: Inactive
DIN CWA 13937-7
Title: J/eXtensions for Financial Service (J/XFS) for the Java Platform - Part 7: Alarm Device Interface; Programmer's Reference
Organization: DIN
Year: 2000
Status: Inactive
DIN EN ISO/IEC 9316
Title: Information technology - Small Computer System Interface-2 (ISO/IEC 9316:1995); German version EN ISO/IEC 9316:1996
Organization: DIN
Year: 1997
Status: Inactive
DIN EN 60749-14
Title: Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 47/1615/CDV:2002); German version prEN 60749-14:2002
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 60191-2-51
Title: Mechanical standardization of semiconductor devices - Plastic enhanced thin profile quad flatpack (HTQFP) - Outline family, heat slug up T-PQFP-G (IEC 47D/418/CDV:2001); German version prEN 60191-2...
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 49/365/CD
Title: Glossary for piezoelectric and dielectric devices for frequency control and selection - Part 2: Piezoelectric and dielectric filters (IEC 49/365/CD:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN EN ISP 10611-3
Title: Information technology - International standardized profiles AMH1n - Message handling systems; common messaging - Part 3: AMH11 (P1) message transfer (ISO/IEC ISP 10611-3:1994); English version EN ...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 49/359/CD
Title: Draft IEC 862-2: Surface acoustic wave (SAW) filters - Part 2: Guide to the use of surface acoustic wave filters (IEC 49/359/CD:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 61163-1
Title: Reliability stress screening - Part 1: Repairable items manufactured in lots (IEC 56/845/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN ISO/IEC 14763-2
Title: Information technology - Implementation and operation of customer premises cabling - Part 2: Planning and installation (ISO/IEC PDTR 14763-2:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 60512-7-1
Title: Connectors for electronic equipment - Tests and measurements - Part 7-1: Impact tests (free components) - Test 7a: Free fall (repeated) (IEC 48B/1850/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN EN ISO 11146
Title: Lasers and laser-related equipment - Test methods for laser beam parameters - Beam widths, divergence angle and beam propagation factor (ISO 11146:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 91/158/CD
Title: Printed board assemblies - Part 2: Sectional specification: Workmanship requirements and guidelines for soldered surface mount electronic assemblies (IEC 91/158/CD:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN 50443-2
Title: Testing of materials for semiconductor technology; recognition of defects and inhomogeneities in semiconductor single crystals by X-ray topography; III-V-semiconductor compounds
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 40(Sec)616
Title: Potentiometers for use in electronic equipment; detail specification: lead-screw actuated preset potentiometers; stability class 5%; assessment level E; identical with IEC 40(Secretariat)616
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 40/1172/CD
Title: Fixed resistors for use in electronic equipment - Part 9-1: Blanc detail specification: Fixed surface mount resistor networks with individually measurable resistors; assessment level EZ (IEC 40/117...
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47D/58/CDV
Title: Semiconductor devices, mechanical standardization; Amendment 2 to IEC 60191-2 (IEC 47D/58/CDV:1995)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 60384-18-1
Title: Fixed capacitors for use in electronic equipment - Part 18-1: Blank detail specification: Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) electrolyte - Assessment level EZ (...
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 62345
Title: iD Format for 50 mm magneto-optical disc system (IEC 100/573/CD:2002), text in English
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 60384-17-1
Title: Fixed capacitors for use in electronic equipment - Part 17-1: Blank detail specification - Fixed metallized polypropylene film dielectric a.c. and pulse capacitors - Assessment levels E and EZ (IEC...
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 48D/193/CD
Title: Draft IEC 61969-3: Outdoor enclosures - Part 3: Climatic, mechanical tests and safety aspects for cabinets and cases (IEC 48D/193/CD:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 62137-1-2
Title: Surface mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test (IEC 91/523/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN EN ISO/IEC 7501-1
Title: Identification cards - Machine-readable travel documents - Machine-readable passport (ISO/IEC 7501-1:1993)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 62150-1-2
Title: Basic standards for discrete/integrated optoelectronic semiconductor devices for fibre optic communications including hybrid devices - Performance standards - Part 1-2: Fibre optic transmitters; Pe...
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 48B/824/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 2-1: Electrical continuity and contact resistance tests; Test 2a: Contact resistance, M...
Organization: DIN
Year: 2000
Status: Inactive
DIN EN ISP 12061-7
Title: Information technology - Open Systems Interconnection - International standardized profiles: OSI distributed transaction processing - Part 7: Provider supported unchained transaction, polarized con...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60539-1
Title: Directly heated negative temperature coefficient thermistors - Part 1: Generic specification (IEC 40/1769/CD:2006)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 40/1182/CD
Title: Potentiometers for use in electronic equipment - Part 6: Sectional specification: Surface mount preset potentiometers (IEC 40/1182/CD:2000)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47A(Sec)247
Title: Integrated circuits; crosstalk between data channels; specifications and terminology; identical with IEC 47A(Secretariat)247
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 52/676/CD
Title: IEC 62326-3: Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections; sectional specification (IEC 52/676/CD:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN EN 28632-3/A1
Title: Information technology - Computer graphics, metafile for the storage and transfer of picture description information - Part 3: Binary encoding, Amendment A1: Rules for profiles (ISO/IEC 8632-3:1992...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47A/497/CDV
Title: Amendments to IEC 60748-11:1990 and to its Amendment 1:1995 (IEC 47A/497/CDV:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 3B(Sec)109
Title: Information technology - Control functions for coded character sets used in the presentation of character strings in electrotechnical diagrams; identical with IEC 3B(Secretariat)109
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 62A/244/CD
Title: Graphical symbols for use on equipment - Amendment to IEC 60417 and revision (or new edition) of IEC 60878; functions of imaging systems (IEC 62A/244/CD:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 40(CO)623
Title: Fixed resistors for use in electronic equipment; blank detail specification: fixed chip resistors; assessment: level E
Organization: DIN
Year: 1985
Status: Inactive
DIN IEC 47A(Sec)269
Title: Integrated circuits; blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memories; identical with IEC 47A(Secretariat)269
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 61076-3-106
Title: Connectors for electronic equipment - Part 3-106: 8 way connectors for industrial environments (IEC 48B/1165/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN EN ISP 10612-8
Title: Information technology - International standardized profile RD; relaying the MAC service using transparent bridging - Part 8: Profile RD53.53 (Token Ring LAN - Token Ring LAN) (ISO/IEC ISP 10612-8:...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 62147
Title: IEC 62147: Integrated circuits - Unified qualification standard to meet IECQ and end-user certification (IEC 47A/593/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 47E/110/CDV
Title: Amendment 1 to IEC 60747-5-1: Additional new terms and definitions for photocouplers/optocouplers (IEC 47E/110/CDV:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 61988-4
Title: Plasma display panels - Part 4: Environmental, endurance and mechanical test methods (IEC 110/02/CD:2003)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 60749-21
Title: Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 47/1591/CD:2001)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 60286-6
Title: Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components (IEC 40/1219/CD:2001)
Organization: DIN
Year: 2001
Status: Inactive
DIN 50446
Title: Testing of materials for semiconductor technology - Determination of defect types and defect densities of silicon epitaxial layers
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 60728-7-3
Title: Cable Networks for television signals, sound signals and interactice services - Part 7-3: Hybrid fibre coax outside plant status monitoring - Power supply to transponder interface bus (PSTIB) speci...
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 47(Sec)1246
Title: Semiconductor devices; category of assessed quality; term and definition; identical with IEC 47(Secretariat)1246
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 60512-12-2
Title: Connectors for electronic equipment - Basic testing and measurements: Part 12-2: Test 12b: Solderability, wetting, iron method (IEC 48B/1260/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 61158-2
Title: Digital data communication for measurement and control - Fieldbus for use in industrial control systems - Part 2: Physical layer specification, 3rd Edition (IEC 65C/262/CDV:2001, text in English)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 47A(Sec)350
Title: Amendment to IEC 60748-20 - Generic specification for film integrated circuits and hybrid film integrated circuits (IEC 47A(Sec)350:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN EN 130800/A1
Title: Sectional Specification - Tantalum surface mounting capacitors; Amendment A1; German version EN 130800:2002/prA1:2002
Organization: DIN
Year: 2002
Status: Inactive
DIN ISO/IEC 2382-8
Title: Information technology - Vocabulary - Part 8: Security (ISO/IEC 2382-8:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 48B/579/CD
Title: Connectors with assessed quality, for use in d.c., low frequency analogue and in digital high-speed data applications - Part 1: Generic specification; addition of interchangeability requirement(s) ...
Organization: DIN
Year: 1997
Status: Inactive
DIN EN 61920/A11
Title: Infrared transmission systems - Free air applications; Amendment A11; German version EN 61920:1998/prA11:2000
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 60191-6-18
Title: Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid ...
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 61076-7-001
Title: Connectors for electronic equipment - Part 7-001: Cable outlet accessories; Blanc detail specification (IEC 48B/1010/CD:2001)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 48B/803/CD
Title: Connectors with assessed quality for use in d.c., low frequency analogue and digital high speed data applications - Part 2: Detail specification for circular connectors with screw and snap-in coupl...
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47D(Sec)36
Title: Semiconductor devices, mechanical standardization - Plastic shrink small outline package (SSOP), 5,3 mm body width, 0,65 mm pitch, 1,25 mm lead length (IEC 47D(Sec)36:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 47A(Sec)262
Title: Integrated circuits; blank detail specification for film integrated circuits and hybrid film integrated circuits, capability approval procedure; identical with IEC 47A(Secretariat)262
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 1/1685/CD-447
Title: International Electrotechnical Vocabulary - Chapter 447: Measuring relays (Revision of IEV-Chapter 446: Electrical relays) (IEC 1/1685/CD-447:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 47A/423/CD
Title: QML for integrated circuits - Guide 2: Guide for methodology and failure analysis (IEC 47A/423/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 52/573/CD
Title: Design and use of printed board assemblies - Part 5: Sectional design and use requirements - Attachment (Land/joint) considerations; section 2: Discrete components (IEC 52/573/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 52/639/CD
Title: Guidance on the use of IEC/ISO publications and quality assessment systems - Part 1: Guide to the use of the IECQ system for quality assessment for printed boards and printed board assemblies (IEC ...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47E/81/CDV
Title: Amendment to IEC 60747-2:1983 (IEC 47E/81/CDV:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN CWA 14174-6
Title: Financial transactional IC card reader (FINREAD) - Part 6: Definition of the virtual machine; English version CWA 14174-6:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 62149-3-2
Title: Basic standards for discrete/integrated optoelectronic semiconductor devices for fibre optic communications including hybrid devices - Package interface standards - Part 3-2: Fibre optic transceive...
Organization: DIN
Year: 2001
Status: Inactive
DIN ISO/IEC 15205
Title: Microprocessor systems - Standard for chip and module interconnect bus: SBus (ISO/IEC DIS 15205:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 40/1116/CD
Title: Amendment 1 to IEC 60115-1:1999: Fixed resistor for use in electronic equipment - Part 1: Generic specification (IEC 40/1116/CD:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 40(Sec)699
Title: Fixed capacitors for use in electronic equipment; blanc detail specification: fixed metallized polyphenylene sulfide-film dielectric d.c. chip capacitors; assessment level E; identical with IEC 40(...
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC CMC/462/CD
Title: Draft - Revised rules of procedure - Part 1: Administration (IEC CMC/462/CD:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN EN ISP 10607-1
Title: Information technology - International Standardized Profiles AFTnn; file transfer, access and management - Part 1: Specification of ACSE, presentation and session protocols for the use by FTAM (ISO...
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 48B/741/CD
Title: Connectors with assessed quality for use in d.c., and low-frequency analogue applications and in digital applications with high speed data rates - Part 4: Printed board connectors; Section 110: Det...
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 48B/838/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6-4: Dynamic stress tests; test 6d: Vibration (sinusoidal) (IEC 48B/838/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47D(Sec)16
Title: Semiconductor devices, mechanical standardization - Proposed revision of IEC 60191-5: Recommendations applying to automated bonding (TAB) of integrated circuits (IEC 47D(Secretariat)16:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN EN ISP 12062-2
Title: Information technology - International Standardized Profiles AMH2n, message handling systems, interpersonal messaging - Part 2: AMH21-IPM content (ISO/IEC ISP 12062-2:1995); English version EN ISP ...
Organization: DIN
Year: 1996
Status: Inactive
DIN CWA 14355
Title: Guidelines for the implementation of secure signature-creation devices (English version CWA 14355:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 48B/845/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11-10: Climatic tests; test 11j: Cold (IEC 48B/845/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 48B(CO)189
Title: Rectangular connectors for frequencies below 3 MHz; detail specification for connectors; foursignal contacts and earthing contacts for cable screen; identical with IEC 48B(Central Office)189
Organization: DIN
Year: 1991
Status: Inactive
DIN CWA 14174-2
Title: Financial transactional IC card reader (FINREAD) - Part 2: Functional requirements; English version CWA 14174-2:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 60603-7-7
Title: Connectors for electronic equipment - Part 7-7: Detail specification for 8-way, shielded, free and fixed connectors for data transmission with frequencies up to 600 MHz (IEC 48B/1328/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 47D(Sec)13
Title: Semiconductor devices, mechanical standardization; transistor outline of form E; supplement to IEC 60191-2 (IEC 47D(Secretariat)13:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 52/640/CD
Title: Guidance on the use of IEC/ISO publications and quality assessment systems - Part 2: Guide to the implementation of ISO 9000 quality standards within the IECQ system for printed board and printed b...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN ISP 10613-3
Title: Information technology - International Standardized Profile RA; relaying the connectionless-mode network service - Part 3: CSMA/CD LAN subnetwork-dependent, media-dependent requirements (ISO/IEC IS...
Organization: DIN
Year: 1996
Status: Inactive
DIN CWA 14050-15
Title: Extensions for Financial Services (XFS) interface specification - Release 3.0 - Part 15: Cash in module device class interface (English Version CWA 14050-15:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 60749-20-1
Title: Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices (IEC 47/1775/CD:2004)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 62197-1
Title: Connectors - Quality assessment requirements - Part 1: Generic specification (IEC 48B/879/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN EN 60738-1-3
Title: Thermistors - Directly heated positive step-function temperature coefficient - Part 1-3: Blank detail specification - Inrush current application - Assessment level EZ (IEC 40/1831/CDV:2007); German...
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 40/1090/CDV
Title: Amendment 2 to IEC 60384-10:1989: Fixed capacitors for use in electronic equipment - Part 10: Sectional specification: Fixed multilayer ceramic chip capacitors (IEC 40/1090/CDV:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 86B/1113/CD
Title: IEC 61977-1: Passive optical filters - Part 1: Generic specification (IEC 86B/1113/CD:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN EN ISP 11185-3
Title: Information technology - International standardized profiles FVT2nn - Virtual terminal basic class; register of control object type definitions - Part 3: FVT215, FVT216; application RIO record load...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 62258
Title: Semiconductor die products - Minimum requirements for procurement and use - Part 1: General requirements; Mechanical, material and connectivity (IEC 47/1575/CD:2001), text in English
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 48B/639/CD
Title: Solderless connections - Part 4: Solderless non-accessible insulation displacement connections; general requirements, test methods and practical guidance (IEC 48B/639/CD:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 1/1778/CDV-551
Title: International Electrotechnical Vocabulary - Part 551: Power electronics; supplement to IEC 60050-551:1998; section 551-20: Harmonic analysis in the field of power electronics (IEC 1/1778/CDV:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 60050-551
Title: International Electrotechnical Vocabulary - Part 551: Power electronics (IEC 60050-551:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 47E/120/CDV
Title: Sensor generals and classification for semiconductor sensors (IEC 47E/120/CDV:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN CWA 13937-10
Title: J/eXtensions for Financial Service (J/XFS) for the Java Platform - Part 10: Check Reader/Scanner Device Class Interface; Programmer's Reference
Organization: DIN
Year: 2000
Status: Inactive
DIN EN ISO/IEC 13818-1
Title: Information technology - Generic of coding of moving pictures and associated audio information - Part 1: Systems (ISO/IEC 13818-1:1996); English version EN ISO/IEC 13818-1:1997
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 47A(Sec)329
Title: Amendment to IEC 60748-20 - Generic specification for film integrated circuits and hybrid film integrated circuits (IEC 47A(Sec)329:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 62132-1
Title: Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 1: General and definitions (IEC 47A/618/CD:2001)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 47E/26/CD
Title: Semiconductor devices - Discrete devices - Blanc detail specification for monolithic microwave integrated circuit amplifiers (IEC 47E/26/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN 66389
Title: Information technology; IEEE standard for Scalable Coherent Interface (SCI); identical with ISO/IEC DIS 13961:1994
Organization: DIN
Year: 1994
Status: Inactive
DIN 51076-1
Title: Determination of silicon carbide in ceramic materials containing oxidic constituents and binders
Organization: DIN
Year: 1991
Status: Inactive
DIN ETS 300462-2
Title: Transmission and Multiplexing (TM) - Generic requirements for synchronization networks - Part 2: Synchronization network architecture; English version ETS 300462-2:1996
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 47C/143/CDV
Title: Optoelectronic, display and imaging devices - Definition and measuring method for optical modulation index (IEC 47C/143/CDV:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 61076-2-101
Title: Connectors for electronic equipment - Part 2-101: Circular Connectors - Detail specification for M12 connectors with screw-locking for low voltage applications (IEC 48B/1484/CD:2004)
Organization: DIN
Year: 2005
Status: Inactive
DIN 66376-8
Title: Information technology - Fibre Distributed Data Interface (FDDI) - Part 8: Media Access Control-2 (MAC-2) (ISO/IEC CD 9314-8:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 60384-16-1
Title: Fixed capacitors for use in electronic equipment - Part 16-1: Blank detail specification - Fixed metallized polypropylene film dielectric d.c. capacitors - Assessment levels E and EZ (IEC 40/1390/C...
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 60512-16-6
Title: Connectors for electronic equipment - Tests and measurements - Part 16-6: Mechanical tests on contacts and terminations - Test 16f: Robustness of terminations (IEC 48B/1566/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 60191-1
Title: Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 47D/607A/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 91/183/CD
Title: Package labels for electronic components using bar code and two dimensional symbologies (IEC 91/183/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN EN 61231
Title: International lamp coding system (ILCOS) (IEC 34A/1345/CDV:2009); German version FprEN 61231:2009
Organization: DIN
Year: 2009
Status: Inactive
DIN IEC 47D/148/CD
Title: Semiconductor devices, mechanical standardization - Proposed new plastic quad flatpack outline, 1,0 and 1,4 mm thick body families (Intended for inclusion into IEC 191-2) (IEC 47D/148/CD:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN 24183-5
Title: Determination of the efficiency of high efficiency air filters with particle counting methods - Part 5: Testing the efficiency of the air filter element (Proposal for a European Standard)
Organization: DIN
Year: 1995
Status: Inactive
DIN EN 61967-1
Title: Integrated circuits - Measurement of electromagnetic emissions 150 kHz to 1 GHz - Part 1: General and definitions (IEC 47A/569/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN EN 61810-7
Title: Electromechanical elementary relays - Part 7: Test and measurement procedures (IEC 94/212/CDV:2004); German version prEN 61810-7:2004
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 61076-3-114
Title: Connectors for electronic equipment - Part 3-114: Rectangular connectors - Protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 600 MHz for industrial env...
Organization: DIN
Year: 2006
Status: Inactive
DIN EN 141
Title: Respiratory protective devices - Gas filters and combined filters - Requirements, testing, marking; English version of DIN EN 141
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 48B/835/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6-1: Dynamic stress tests; test 6a: Acceleration, steady state (IEC 48B/835/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 40(CO)716
Title: Inclusion of a definition and a measuring method for microlinearity; amendments to IEC 60393-1 (2nd edition); identical with IEC 40(Central Office)716
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 60384-8
Title: Fixed capacitors for use in electronic equipment - Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, class 1 (IEC 40/1315/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 60297-3-104
Title: Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-104: Connector dependent interface dimensions for subracks and plug-in u...
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 48B/836/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6-2: Dynamic stress tests; test 6b: Bump (IEC 48B/836/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 48B/843/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11-6: Climatic tests; tests 11f: Corrosion, Salt mist (IEC 48B/843/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47A/420/CD
Title: Blank detail specification for Programmable Logic Devices (PLDs) (IEC 47A/420/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 61587-3
Title: Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 3: Electromagnetic shielding performance tests for cabinets, racks and subracks (IEC 48D/310/CD:2004)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 40(CO)696
Title: Potentiometers for use in electronic equipment; blank detail specification; rotary precision potentiometers; assessment level E; identical with IEC 40(Central Office)696
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 40/1183/CD
Title: Potentiometers for use in electronic equipment - Part 6-1: Blank detail specification: Surface mount preset potentiometers; Assessment level E (IEC 40/1183/CD:2000)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 61587-1
Title: Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 1: Climatic, mechanical tests and safety aspects for cabinets, racks and subracks (IEC 48D/325/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 48D/119/CD
Title: Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 5: Subracks and associated plug-in for EMC, ESD, injector/extractor and keying (IEC 48D/119/CD:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 100/68/CD
Title: Colour measurement and management in multimedia systems and equipment - Part 4: Equipment using liquid crystal display panels (IEC 100/68/CD:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 60512-9-1
Title: Connectors for electronic equipment - Tests and measurements - Part 9-1: Endurance tests - Test 9a: Mechanical operation (IEC 48B/1855/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN EN 28632-1/A2
Title: Information technology - Computer graphics, metafile for the storage and transfer of picture description information - Part 1: Functional specification, Amendment A2: Application structuring extens...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 49/328/CD
Title: Piezoelectric filters - A specification in the IEC quality assessment system for electronic components (IECQ) - Sectional specification (capability approval) (IEC 49/328/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 48B/846/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11-11: Climatic tests; tests 11k: Low air pressure (IEC 48B/845/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 62374
Title: Time Dependent Dielectric Breakdown Test (TDDB) (IEC 47/1764/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN 51079-1
Title: Testing of ceramic materials - Chemical analysis of silicon carbide used as raw material and as constituent in materials - Part 1: Decomposition with sodium carbonate and boric acid
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 47D(Sec)31
Title: Semiconductor devices, mechanical standardization - Devices with terminals disposed in three or more rows in each orthogonal direction (IEC 47D(Sec)31:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN EN 60749-25
Title: Semiconductor devices - Mechanical and climatic test methods - Part 25: Rapid change of temperature (air, air) (IEC 47/1616/CDV:2002); German version prEN 60749-25:2002
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 3B/195/CD
Title: Industrial systems, installations and equipment and industrial products - Structuring principles and reference designations - Part 2: Classification of objects and codes for classes (IEC 3B/195/CD:...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 62415
Title: Constant Current Electromigration Test (IEC 47/1954/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 47D/108/CD
Title: Semiconductor devices, mechanical standardization - Plastic Shrink Small Outline Package (SSOP), 1,00 mm lead length, outline family, R-PDSO-G (IEC 47D/108/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60512-12-5
Title: Connectors for electronic equipment - Basic testing and measurements: Part 12-5: Test 12e: Resistance to soldering heat, iron method (IEC 48B/1263/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 62137-1-4
Title: Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-4: Cyclic bending test (IEC 91/694/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 40(CO)698
Title: Potentiometers; sectional specification; single-turn rotary power potentiometers; selection of test and general requirements; adaptation of the standard to the requirements for quality assessment s...
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 62148-15
Title: Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 86C/744/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN EN 60191-6-7
Title: Mechanical standardization of semiconductor devices - Part 6-7: General rules for the dimensions of P-VQFN (IEC 47D/483/CDV:2002); German version prEN 60191-6-7:2002
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 50173-1
Title: Information technology - Generic cabling systems - Part 1: General requirements; German version prEN 50173-1:2005
Organization: DIN
Year: 2005
Status: Inactive
DIN EN ISP 12061-3
Title: Information technology - Open Systems Interconnection - International standardized profiles: OSI distributed transaction processing - Part 3: Support of CCR APDUs (ISO/IEC ISP 12061-3:1995); Englis...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 65C/242/CD
Title: Profile set for continuous and discrete manufacturing (IEC 65C/242/CD:2000, text in English)
Organization: DIN
Year: 2000
Status: Inactive
DIN EN 60512-1
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1: General (IEC 48B/807/CDV:1999); German version prEN 60512-1:1999
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47D/221/CDV
Title: Semiconductor devices, mechanical standardization - QFP measuring method (IEC 47D/221/CDV:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 47A/541/CDV
Title: IEC 61748: Manufacturing line approval for MCM (QML) (IEC 47A/541/CDV:1999, text in English)
Organization: DIN
Year: 1999
Status: Inactive
DIN EN 60738-1-2
Title: Thermistors - Directly heated positive step-function temperature coefficient - Part 1-2: Blank detail specification - Heating element application - Assessment level EZ (IEC 40/1830/CDV:2007); Germa...
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 60297-3-103
Title: Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19-in) series - Part 3-103: Keying and alignment pin (IEC 48D/257/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 48B/912/CD
Title: Connectors for use in d.c., low frequency analogue, and in digital high speed data applications - Unshielded 8-way connectors for frequencies up to 250 MHz (IEC 48B/912/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 52/669/CD
Title: Bow and twist requirements - Amendment to IEC 60249-2-1 to 7, 9, 10, 14, 16, 18; Sub-clause 5.3 und 6.3 (IEC 52/669/CD:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN EN 61158-6
Title: Digital data communication for measurement and control - Fieldbus for use in industrial control systems - Part 6: Application layer protocol specification (IEC 61158-6:2003 + corrigendum 2004); Eng...
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 60512-25-7
Title: Connectors for electronic equipment - Basic tests and measurements - Part 25-7: Test 25g Impedance, reflection coefficient, and voltage standing wave ratio (IEC 48B/1169/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN V ENV 41114
Title: Information technology; functional standard for profile T/A52; local area network; token bus (COTS + CLNS); english version ENV 41114:1992
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 48B/823/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1-2: General examination; Test 1b: Examination of dimension and mass (IEC 48B/823/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN EN 60603-7-2
Title: Connectors for electronic equipment - Part 7-2: Detail specification for 8-way, unshielded, free and fixed connectors, for data transmissions with frequencies up to 100 MHz (IEC 48B/2006/CDV:2009);...
Organization: DIN
Year: 2009
Status: Inactive
DIN IEC 47D/222/CD
Title: Semiconductor devices, mechanical standardization - 4, 5 and 6 leaded SMD (Body size D x E: 2,0 mm x 1,25 mm) (IEC 47D/222/CD:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 47D(Sec)7
Title: Semiconductor devices, mechanical standardization; inclusion of three packages for power modules in IEC 191-2 (IEC 47D(Secretariat)7:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN EN 60862-3
Title: Surface acoustic wave (SAW) filters of assessed quality - Part 3: Standard outlines (IEC 49/539/CDV:2002); German version prEN 60862-3:2002
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 61158-3
Title: Digital data communication for measurement and control - Fieldbus for use in industrial control systems - Part 3: Data link service definition (IEC 65C/263/CDV:2001; text in English)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 52/677/CD
Title: IEC 62326-3-1: Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections; Section 1: Capability detail specification; performance level A, B und C (IEC 52/67...
Organization: DIN
Year: 1997
Status: Inactive
DIN 66376-9
Title: Information technology - Fibre Distributed Data Interface (FDDI) - Part 9: Low-cost fibre physical medium dependent (LCF-PMD) (ISO/IEC CD 9314-9:1995)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 60749-37
Title: Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method of components for handheld electronic products (IEC 47/1824/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN EN ISP 10611-2
Title: Information technology, International Standardized Profiles AMH1n - Message handling systems; common messaging - Part 2: Specification of ROSE, RTSE, ACSE, presentation and session protocols for us...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 60749-1
Title: Semiconductor devices - Mechanical and climatic test methods - General (IEC 47/1571/CDV:2001); German version prEN 60749-1:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 48B(CO)193
Title: Detail specification for a range of connectors with trapezoidal shaped metal shells, and round contacts; fixed solder contact types with assessed quality; identical with IEC 48B(Central Office)193
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 60384-3-1
Title: Fixed capacitors for use in electronic equipment - Part 3-1: Blank detail specification - Fixed surface mount tantalum capacitors - Assessment level E (IEC 40/1450/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN CWA 14174-7
Title: Financial transactional IC card reader (FINREAD) - Part 7: FINREAD card reader application programming interfaces (APIs); English version CWA 14174-7:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 61360 Beiblatt 1
Title: Standard data element types with associated classification scheme for electric components - Maintenance and validation procedures (German translation IEC 61360-3:1995)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 47A(Sec)352
Title: Classification of integrated circuits (IEC 47A(Sec)352:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 60512-11-14
Title: Connetors for electronic equipment - Test and measurements - Part 11-14: Tests 11p: Flowing single gas corrosion test (IEC 48B/1076/CD:2001)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 40(CO)620
Title: Amendment to IEC publication 60115-1 (1982); fixed resistors for use in electronic equipment; part 1: generic specifications; additional terms and methods of test applicable to chip resistors
Organization: DIN
Year: 1985
Status: Inactive
DIN IEC 47C/145/CDV
Title: Optoelectronic, display and imaging devices - Measuring method for carrier to noise ratio of an analogue laser (IEC 47C/145/CDV:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 61076-3-104
Title: Connectors for electronic equipment - Part 3-104: Rectangular Connectors - Detail specification for 8-way, shielded free and fixed connectors for data transmission with frequencies up to 1000 MHz (...
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 40(CO)758
Title: Definitions, measurement and test procedures for heat-sink resistors; amendments to IEC 60115-1:1982; identical with IEC 40(Central Office)758
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 62148-13
Title: Fibre optic active components and devices - Package and interface standards - Part 13: 12-channel pluggable, parallel transmitter and receiver modules with MPO optical connector (IEC 86C/573/CD:2003)
Organization: DIN
Year: 2004
Status: Inactive
DIN EN ISP 10608-1
Title: Information technology - International Standardized Profile TAnnnn; connection-mode transport service over connectionless-mode network service - Part 1: General overview and subnetwork-independent ...
Organization: DIN
Year: 1995
Status: Inactive
DIN EN 61076-3-112
Title: Connectors for electronic equipment - Part 3-112: Rectangular connectors - Detail specification: Rectangular connectors with four contacts for high performance serial bus used for consumer audio/vi...
Organization: DIN
Year: 2005
Status: Inactive
DIN EN ISP 10613-6
Title: Information technology - International standardized profile RA; relaying the connectionless-mode network service - Part 6: Definition of profiles RA51.54, relaying the connectionless-mode network s...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 60603-7-3
Title: Connectors for electronic equipment - Part 7-3: Detail specification for 8-way, shielded, free and fixed connectors, for data transmissions with frequencies up to 100 MHz (IEC 48B/2007/CDV:2009); G...
Organization: DIN
Year: 2009
Status: Inactive
DIN IEC 60191-6
Title: Mechanical standardization of semiconductor devices - Part 6 : General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/694/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN EN ISO 11149
Title: Lasers and laser-related equipment - Fibre optic connectors for non-telecommunication laser applications (ISO 11149:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 62047-2
Title: Microelectromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 47/1759/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 48B/830/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 4-1: Voltage stress tests; test 4a: Voltage proof (IEC 48B/830/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 48B/796/CD
Title: Connectors for use in d.c. and low frequency analogue and digital high speed data applications - Part 2-102: Circular connectors with assessed quality; detail specification for plugs and jacks for ...
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 40(CO)699
Title: Potentiometers for use in electronic equipment; blank detail specification; single-turn rotary power potentiometers; assessment level E; identical with IEC 40(Central Office)699
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 47A(Sec)353
Title: Classification and definition for Programmable Logic Devices (PLDs) (IEC 47A(Sec)353:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN ISO/IEC 15058
Title: Microprocessor systems - VMEbus extensions for instrumentation - VXIbus (ISO/IEC DIS 15058:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 61249-2-5
Title: Materials for printed boards and other interconnection structures - Part 2-5: Sectional specification set for reinforced base materials, clad and unclad; Brominated epoxide cellulose paper reinforc...
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 27816-1
Title: Identification cards; integrated circuit(s) with contacts; part 1: physical characteristics (ISO 7816-1:1987); english version EN 27816-1:1989
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 60512-1-100
Title: Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications (IEC 48B/1421/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN EN 62007-2
Title: Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods (IEC 86C/771/CDV:2007); German version prEN 62007-2:2007
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 62448
Title: Multimedia systems and equipment - Multimedia e-publishing and e-books - Generic format for e-publishing (IEC 100/1017/DC:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 61076-2-104
Title: Connectors for electronic equipment - Part 2-104: Circular connectors - Detail specification for M8 connectors with screw- or snap-locking for low voltage applications (IEC 48B/1485/CD:2004)
Organization: DIN
Year: 2005
Status: Inactive
DIN EN 175301-803
Title: Detail Specification: Rectangular connectors - Flat contacts, 0,8 mm thickness, locking screw not detachable; German version prEN 175301-803:2004
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 48B/837/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6-2: Dynamic stress tests; test 6c: Shock (IEC 48B/837/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 60749-34
Title: Semiconductor devices - Mechanical and climatic test methods - Part 34: Power Cycling (IEC 47/1648/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 48B/839/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11-2: Climatic tests; tests b: Combined/sequential cold, low air pressure and damp heat...
Organization: DIN
Year: 2000
Status: Inactive
DIN ISO/IEC 8802-6
Title: Local and Metropolitan Area Networks - Part 6: DQDB Bus; Identical with ISO/IEC 8802-6:1994
Organization: DIN
Year: 1995
Status: Inactive
DIN EN ISP 12063-5
Title: Information technology - International standardized profiles AMH3n - Message handling systems, EDI messaging - Part 5: AMH34 EDIMG, requirements for enhanced MTS access (P7) (ISO/IEC ISP 12063-5:19...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC CMC/460/CD
Title: Basic rules of the IEC Quality Assessment System for Electronic Components (IECQ) (IEC CMC/460/CD:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN EN 140401-802
Title: Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 1; 2; German version prEN 140401-802:2006
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 91/160/CD
Title: Printed board assemblies - Part 4: Sectional specification: Workmanship requirements for terminal soldered assembly (IEC 91/160/CD:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 47D/275/CDV
Title: Semiconductor devices, mechanical standardization - Package outline for plastic fine pitch quad flat pack (FQFP) family, S-R.QPF XXXE (Intended for inclusion into IEC 60191-2) (IEC 47D/275/CDV:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN EN 28632-4
Title: Information technology - Computer graphics; metafile for the storage and transfer of picture description information - Part 4: Clear text encoding (ISO/IEC 8632-4:1992); English version EN 28632-4:...
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 52/570/CD
Title: IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (IEC 52/570/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60630/A6
Title: Maximum lamp outlines for incandescent lamps (IEC 34A/1241/CD:2007)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 47C/199/CD
Title: Semiconductor devices - Discrete devices and integrated circuits - Part 5: Optoelectronic devices (IEC 47C/199/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 61249-2-41
Title: Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminated she...
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 47D/332/CD
Title: Amendment 2 to IEC 60191-6: Mechanical standardization of semiconductor devices - Pin grid array 2,54 mm pitch outline family (Intended for inclusion into IEC 60191-2) (IEC 47D/332/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN EN 60249-2-17/A3
Title: Amendment to IEC 60249-2-17: Base materials for printed circuits - Part 2: Specifications; specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammabilit...
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 47(Sec)1234
Title: Semiconductor devices; destructive test; term and definition; identical with IEC 47(Secretariat)1234
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 62056-62
Title: Electricity metering - Data exchange for meter reading, tariff and load control - Part 62: Interface classes (IEC 13/1324/CD:2004), text in English
Organization: DIN
Year: 2005
Status: Inactive
DIN EN 28877
Title: Information technology; telecommunications and information exchange between systems; interface connector and contact assignment for ISDN basic access interface located at reference points S and T (...
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 48B/703/CD
Title: Connectors with assessed quality, for use in d.c., low-frequency analogue and digital high speed data applications - Part 4: Two-part connectors for printed boards for basic grid of 2,00 mm, with s...
Organization: DIN
Year: 1998
Status: Inactive
DIN V 66221-5
Title: High-level data link control (HDLC) procedures - Part 5: List of standards that utilize HDLC classes of procedures and list of format identifiers in XID frames; identical with ISO/IEC TR 10171:1994
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 60749-24
Title: Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance; Unbiased HAST (IEC 47/1646/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 62132-3
Title: Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk Current Injection (BCI), 10 kHz to 1 GHz (IEC 47A/670/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 62132-4
Title: Integrated circuits - Measurement of Electromagnetic Immunity, 150 kHz to 1 GHz - Part 4: Direct RF power injection method (IEC 47A/658/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN EN 29070
Title: Information processing; SGML support facilities; registration procedures for public text owner identifiers (ISO/IEC 9070:1991); english version EN 29070:1992
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 60384-11-1
Title: Fixed capacitors for use in electronic equipment - Part 11-1: Blank detail specification: Fixed polyethylene terephthalate film dielectric metal foil d.c. capacitors - Assessment level E (IEC 40/17...
Organization: DIN
Year: 2007
Status: Inactive
DIN EN 13328-1
Title: Breathing system filters for anaesthetic and respiratory use - Part 1: Salt test method to assess filtration performance
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 61249-2-9
Title: Materials for printed boards and other interconnection structures - Part 2-9: Sectional specification set for reinforced base materials, clad and unclad; Bismaleimide/triazine, modified epoxide or ...
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 47A(Sec)276
Title: Integrated circuits; amendment to IEC 748-2-2: family specification for digital integrated circuits, series 54/74 HC, HCT and HCU; identical with IEC 47A(Secretariat)276
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 48B/868/CD
Title: Connectors with assessed quality, for use in d.c., low frequency analogue and digital high speed data applications - Part 2-103: Circular connectors; detail specification for a range of multipole c...
Organization: DIN
Year: 2000
Status: Inactive
DIN EN 50173-4
Title: Information technology - Generic cabling systems - Part 4: Residential premises; German version prEN 50173-4:2005
Organization: DIN
Year: 2005
Status: Inactive
DIN 50449-2
Title: Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 2: Boron in gallium arsenide
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 48B/833/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 5-1: Current-carrying capacity tests; test 5a: Temperature rise (IEC 48B/833/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN ISO/IEC 14776-411
Title: Information technology - Small Computer System Interface-3 - Part 411: SCSI-3 Architecture Model (SCSI-3 SAM) (ISO/IEC DIS 14776-411:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 47D/330/CDV
Title: Semiconductor devices, mechanical standardization - QFN-outline drawings to the outline family 102E (IEC 47D/330/CDV:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 23J/162/CD
Title: Electromechanical switches for use in electronic equipment - Part 1: Generic specification; Amendment (IEC 23J/162/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 40/1119/CD
Title: Amendment 2 to IEC 60384-10: Fixed capacitors for use in electronic equipment - Part 10: Sectional specification; fixed multilayer ceramic chip capacitors (IEC 40/1119/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 48B/486/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Test method for transmission line reflections of connectors in the time domain (IEC 48B/486/...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 48B/523/CD
Title: Connectors for frequencies below 3 MHz - Part 9: Circular connectors for radio and associated sound equipment (IEC 48B/523/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 48B/785/CD
Title: Detail specification for rectangular connectors with non-removable ribbon cable contacts on 1,25 mm pitch single row used with high speed serial data connector (HSSDC) (IEC 48B/785/CD:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 47C/222/CD
Title: Optoelectronic, display and imaging devices - Measuring methods for matrix liquid crystal display modules - Transmissive type (IEC 47C/222/CD:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 61051-1
Title: Varistors for use in electronic equipement - Part 1: Generic specification (IEC 40/1617/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 60512-13-1
Title: Connectors for electronic equipment - Basic testing and measurements: Part 13-1: Test 13a: Engaging and separating forces (IEC 48B/1264/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN EN 29992-1
Title: Financial transaction cards; messages between the integrated circuit card and the card accepting device; part 1: concepts and structures (ISO 9992-1-1990); German version EN 29992-1:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 62194
Title: Method of determining enclosure thermal performance by the influence of internal heat load and sun radiation (IEC 48D/262/CD:2001)
Organization: DIN
Year: 2002
Status: Inactive
DIN EN ISP 12061-9
Title: Information technology - Open Systems Interconnection - International standardized profiles: OSI distributed transaction processing - Part 9: Provider supported chained transactions, polarized cont...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 50254
Title: High efficiency communication subsystem for small data packages; German version of EN 50254:1998, text in English
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 34A(Sec)528
Title: Method of measurement of centre beam intensity and beam angle(s) of reflector lamps (IEC 34A(Sec)528:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 60297-3-100
Title: Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 3-100: Basic dimensions of front panels, subracks, chassis, racks and cabin...
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 34A(Sec)486
Title: Amendment to IEC 60081 and IEC 60901 to increase the starting test voltage, minimum open circuit voltage and non-reclosure voltage (IEC 34A(Secretariat)486:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN CWA 13937-5
Title: J/eXtensions for Financial Service (J/XFS) for the Java Platform - Part 5: Cash Dispenser, Recycler and ATM Device Class Interface; Programmer's Reference
Organization: DIN
Year: 2000
Status: Inactive
DIN V ENV ISO 14819-3
Title: Traffic and traveller information (TTI) - TTI Messages via traffic message coding - Part 3: Location referencing for ALERT-C (ISO/TS 14819-3:2000); English version ENV ISO 14819-3:2000
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 60297-3-101
Title: Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19-in) series - Part 3-101: Subracks and associated plug-in units (IEC 48D/255/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 61800-7-3
Title: Adjustable speed electrical power drive systems - Part 7-3: Generic interface and use of profiles for power drive systems - Mapping of profiles to network technologies (IEC 22G/154/CD:2005), text i...
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 47D/198/CD
Title: SVP-(Surface Vertical package), 0,65 mm pitch family (IEC 47D/198/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 94/100/CD
Title: Electromechanical all-or-nothing relays - Part 50: Sectional specification; electromechanical all-or-nothing telecom relays of assessed quality (IEC 94/100/CD:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN EN 60749-20
Title: Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German ...
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 47D/255/CDV
Title: Semiconductor devices, mechanical standardization - Common package unit design guide for packages with gull-wing lead (IEC 47D/255/CDV:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 91/197/CD
Title: Test 5E02: Surface insulation resistance, assemblies (IEC 91/197/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 65C/244/CD
Title: Digital data communication for measurement and control - Fieldbus for use in industrial control systems - Part 3: Data link protocol specification; Amendement 1 (IEC 65C/244/CD:2000; text in Englisch)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 52/645/CD
Title: Amendment 3 to IEC 61189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (IEC 52/645/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN 50435
Title: Testing of semiconductor materials; determination of the radial resistivity variation of silicon or germanium slices by means of the four-probe/direct current method
Organization: DIN
Year: 1988
Status: Inactive
DIN IEC 65C/246/CD
Title: Digital data communication for measurement and control - Fieldbus for use in industrial control systems - Part 5: Application layer service definition; Amendment A1 (IEC 65C/246/CD:2000, text in En...
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47A(Sec)338
Title: Essential ratings - Characteristics and functional specifications of Pogrammable Logic Devices (PLD) (IEC 47A(Sec)338:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 62149-3-1
Title: Basic standard for discrete/integrated optoelectronic semiconductor devices for fibre optic communications including hybrid devices - Package interface standards - Part 3-1: Fibre optic transceiver...
Organization: DIN
Year: 2001
Status: Inactive
DIN EN ISP 12062-4
Title: Information technology - International Standardized Profiles AMH2n, message handling systems, interpersonal messaging - Part 4: AMH23-IPM requirements for MTS Access (P3) (ISO/IEC ISP 12062-4:1995)...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60191-6-11
Title: General design guideline for rectangular FBGA packages (IEC 47D/394/CDV:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 60512-22-1
Title: Connectors for electronic equipment - Tests and measurements - Part 22-1: Capacitance tests - Test 22a: Capacitance (IEC 48B/1868/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 60384-6-1
Title: Fixed capacitors for use in electronic equipment - Part 6-1: Blank detail specification - Fixed metallized polycarbonate film dielectric d.c. capacitors - Assessment level E (IEC 40/1417/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN V ENV 12005
Title: Information technology - Procedure for European registration of cultural elements; English version ENV 12005:1996
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 40(Sec)672
Title: Revision of IEC 60738-1; Identical with IEC 40(Secretariat)672
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 47D/169/CDV
Title: Semiconductor devices - Mechanical standardization - General rules for TSOP (Thin small outline package) Type I (IEC 47D/169/CDV:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN ISO/IEC 10741-1
Title: Information technology - User system interfaces; dialogue interaction - Part 1: Cursor control for text editing (ISO/IEC 10741-1:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 48B/847/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11-12: Climatic tests; test 11m: Damp heat, cyclic (IEC 48B/847/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 65C/174/CDV
Title: Fieldbus standard for use in industrial control systems - Part 5: Application layer service definition (IEC 65C/174/CDV:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 47A(Sec)296
Title: Essential ratings and characteristics and functional specifications of Application Specific Integrated Circuits (ASICs) (IEC 47A(Sec)296:1992)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 62088
Title: Nuclear instrumentation - Photodiodes for scintillation detectors - Test procedures (IEC 45/453/CD:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 52(Sec)477
Title: IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test E08: PTH resistance change, thermal cycling (IEC 52(Secretariat)477:1994)
Organization: DIN
Year: 1994
Status: Inactive
DIN EN 60749-19
Title: Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength test (IEC 47/1590/CDV:2001); German version prEN 60749-19:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 61188-5-4
Title: Printed boards and printed board assemblies - Design and use - Part 5-4: Sectional requirements - Attachment (land/joint) consideration - Components with J leads on two sides (IEC 91/464/CDV:2004);...
Organization: DIN
Year: 2004
Status: Inactive
DIN 66379-2
Title: Information technology - High-performance parallel interface (HIPPI) - Part 2: Framing protocol (HIPPI-FP) (ISO/IEC CD 11518-2:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 61249-4-11
Title: Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Non-halogenated ...
Organization: DIN
Year: 2003
Status: Inactive
DIN EN 62351
Title: Hybrid Fibre Coax Outside Plant Status Monitoring - Media Access Control (MAC) Layer Specification (IEC 100/577/CDV:2002); German version prEN 62351:2002, text in English
Organization: DIN
Year: 2003
Status: Inactive
DIN ETS 300805-2
Title: Private Integrated Services Network (PISN) - Inter-exchange signalling protocol, Circuit mode basic services, Network Layer (NL) - Part 2: Abstract Test Suite (ATS) specification; English version E...
Organization: DIN
Year: 1998
Status: Inactive
DIN 50441-4
Title: Determining the dimensions of semiconductor wafers - Diameter and diameter variation, and flat diameter, length and depth
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 60384-24-1
Title: Fixed capacitors for use in electronic equipment - Part 24-1: Blank detail specification - Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolyte - Assessmen...
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 34A(Sec)554
Title: High-pressure sodium vapour lamps - Amendment to IEC 60662 (IEC 34A(Sec)554:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN EN ISP 12063-3
Title: Information technology - International standardized profiles AMH3n - Message handling systems, EDI messaging - Part 3: AMH32 EDIMG, requirements for message transfer (P1) (ISO/IEC ISP 12063-3:1995)...
Organization: DIN
Year: 1996
Status: Inactive
DIN ETS 300805-1
Title: Private Integrated Services Network (PISN) - Inter-exchange signalling protocol, Circuit mode basic services, Network Layer (NL) - Part 1: Test Suite Structure and Test Purposes (TSS&TP); English v...
Organization: DIN
Year: 1998
Status: Inactive
DIN EN ISP 10611-5
Title: Information technology - International standardized profiles AMH1n - Message handling systems; common messaging - Part 5: AMH13-MS access (P7) (ISO/IEC ISP 10611-5:1994); English version EN ISP 106...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN ISO/IEC 11172-4
Title: Information technology - Coding of moving pictures and associated audio for digital storage media at up to about 1,5 Mbit/s - Part 4: Compliance testing (ISO/IEC 11172-4:1995); English version EN I...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47A(Sec)259
Title: Integrated circuits; sectional specification for film integrated circuits and hybrid film integrated circuits; qualification approval procedure; identical with IEC 47A(Secretariat)259
Organization: DIN
Year: 1992
Status: Inactive
DIN EN 50346
Title: Information technology - Cabling installation - Testing of installed cabling; German version prEN 50346-:2001
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 60749-30
Title: Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 47/1682/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 47E/38/CDV-II
Title: Draft IEC 747-6: Semiconductor devices - Discrete devices and integrated circuits - Part 6: Thyristors (IEC 47E/38/CDV-II:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 62137
Title: IEC 62127, Ed.1: Test 5N01: Temperature cycling test for soldering loint (includes also 5D01, 5D02, 5D03, 5M01, 5P01, 5P02) (IEC 91/227/CD:2001)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 60749-35
Title: Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for non-hermetic encapsulated electronic components (IEC 47/1769/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 52(Sec)365
Title: Printed board electronic data description and transfer; part 7: bare board electronic test information in digital form; identical with IEC 52(Secretariat)365:1992
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 52/574/CD
Title: Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements; attachment (Land/joint) considerations; Section 3: Components with Gull-wing leads on ...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN ISP 10612-4
Title: Information technology - International Standardized Profile RD, Relaying the MAC service using transparent bridging - Part 4: Profil RD51.51 (CSMA/CD-LAN-CSMA/CD-LAN) (ISO/IEC ISO 10612-4:1995); En...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 60061-4
Title: Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 4: Guidelines and general information (IEC 60061-4:1990 + supplements A:1992, B:1994, C:1994, D:19...
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 47C/100/CD
Title: Semiconductor devices - Essential ratings and characteristics of duplexer modules with pigtail (IEC 47C/100/CD:1995)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 52/578/CD
Title: Design and use of printed boards and printed boards assemblies - Part 5: Sectional design and use requirements - Attachment (Land/joint) considerations; section 7: Components with Post (DIP) mounti...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 62258-2
Title: Semiconductor die products - Part 2: Exchange data formats (IEC 47/1651/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 60286-2
Title: Packing of components for automatic handling - Part 2: Tape packing of components with unidirectional leads on continuous tapes. (IEC 40/1744/CD:2006)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 48B/744/CD
Title: Connectors with assessed quality, for use in d.c. and low-frequency analogue and in digital high-speed data applications - Part 4: Printed board connectors; Section 111: Detail specification for tw...
Organization: DIN
Year: 1999
Status: Inactive
DIN EN ISO/IEC 13818-9
Title: Information technology - Generic coding of moving pictures and associated audio information - Part 9: Extension for real time interface for systems decoders (ISO/IEC 13818-9:1996); English version ...
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 60512-16-5
Title: Connectors for electronic equipment - Tests and measurements - Part 16-5: Mechanical tests on contacts and terminations - Test 16e: Gauge retention force (resilient contacts) (IEC 48B/1565/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 48D/151/CDV
Title: Electromagnetic shielding performance tests for cabinets, racks and subracks (IEC 48D/151/CDV:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 34A/763/CD
Title: Tungsten filament lamps for domestic and similar general lighting purposes - Performance requirements; Amendment 1 to IEC 60064:1993 (IEC 34A/763/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 65C/178/CDV
Title: Fieldbus standard for use in industrial control systems - Part 3: Data link layer service definition (IEC 65C/178/CDV:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN EN ISP 10607-6
Title: Information technology - International Standardized Profiles AFTnn; file transfer, access and management - Part 6: AFT3, file management service (ISO/IEC ISP 10607-6:1995); English version EN ISP 1...
Organization: DIN
Year: 1997
Status: Inactive
DIN 50452-2
Title: Particle analysis of liquids for use in semiconductor technology using optical particle counters
Organization: DIN
Year: 1991
Status: Inactive
DIN EN ISP 11183-2
Title: Information technology; International Standardized Profiles AOM1n OSI Management - Management Communications - Part 2: CMISE/ROSE for AOM12; Enhanced Management Communications (ISO/IEC ISP 11183-2:...
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 61076-3-107
Title: Connectors for electronic equipment - Detail specification for shielded rectangular connectors for universal serial bus plus power connectors, series A (IEC 48B/1209/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 62A/245/CD
Title: Graphical symbols for use on equipment - Amendment to IEC 60417 and revision (or new edition) of IEC 60878; radiological equipment and patient support (IEC 62A/245/CD:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN EN 61076-4-115
Title: Connectors for electronic equipment - Part 4-115: Backplane connectors for Infiniband<sup>TM</sup> equipment (IEC 48B/1062/CDV:2001); German version prEN 61076-4-115:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 60384-13-1
Title: Fixed capacitors for use in electronic equipment - Part 13-1: Blank detail specification: Fixed polypropylene film dielectric metal foil d.c. capacitors (IEC 40/1419/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN 50449-1
Title: Testing of materials for semiconductor technology - Determination of impurity content in semiconductors by infrared absorption - Part 1: Carbon in gallium arsenide
Organization: DIN
Year: 1997
Status: Inactive
DIN EN 50173-5
Title: Information technology - Generic cabling systems - Part 5: Data centers; German version prEN 50173-5:2005
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 47(Sec)1137
Title: Semiconductor devices, mechanical standardization; proposal for addition of a dual in line package with 56 terminals to the outline family 101G (IEC 47(Secretariat)1137:1991)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 61968-4
Title: System interfaces for distribution management - Part 4: Interface standard for records and asset management (IEC 57/701/CD:2004), text in English
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 60512-26-100
Title: Connectors for electronic equipment - Tests and measurements - Part 26-100: Measurement setup, test and reference arrangements and measurements for interoperability and backward compatibility tests...
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 40(Sec)680
Title: Fixed capacitors for use in electronic equipment; part XX: sectional specification: fixed capacitors of ceramic dielectric, class 3 (IEC 40(Secretariat)680:1993)
Organization: DIN
Year: 1993
Status: Inactive
DIN EN 61966-5
Title: Multimedia systems and equipment - Colour measurement and management - Part 5: Equipment using plasma display panels (IEC 100/1295/CDV:2007); German version prEN 61966-5:2007
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 40(CO)692
Title: Potentiometers; sectional specification: rotary precision potentiometers; selection of test and general requirements; adaptation of the standard to the requirements for quality assessment systems f...
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 47D/109/CD
Title: Semiconductor devices, mechanical standardization - Plastic Thin Shrink Small Outline Package (TSSOP/HTSSOP), 1,00 mm lead length, outline family, R-PDSO-G (IEC 47D/109/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN 66376-6
Title: Information technology - Fibre Distributed Data Interface (FDDI) - Part 6: Station Management (SMT) (ISO/IEC CD 9314-6:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN EN 28632-4/A1
Title: Information technology - Computer graphics, metafile for the storage and transfer of picture description information - Part 4: Clear text encoding, Amendment A1: Rules for profiles (ISO/IEC 8632-4:...
Organization: DIN
Year: 1996
Status: Inactive
DIN-Fachbericht 65
Title: Mikrosystemtechnik
Organization: DIN
Year: 1997
Status: Inactive
DIN EN ISO 10202-6
Title: Financial transaction cards - Security architecture of financial transaction systems using integrated circuit cards - Part 6: Cardholder verification (ISO 10202-6:1994); English version EN ISO 1020...
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 48B/825/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 2-2: Electrical continuity and contact resistance test; Test 2b: Contact resistance, sp...
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 34A/764/CD
Title: Double capped fluorescent lamps - Performance specifications; Amendment to IEC 60081, 5. edition (IEC 34A/764/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 60384-25
Title: Fixed capacitors for use in electronic equipment - Part 25: Sectional specification - Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte (IEC 40/1430/CD...
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 40(Sec)696
Title: Amendment to IEC 60384-4-1(1985); fixed capacitors for use in electronic equipment; part 4: blank detail specification: aluminium electrolytic capacitors with non-solid electrolyte; assessment leve...
Organization: DIN
Year: 1994
Status: Inactive
DIN EN 61249-2-10
Title: Materials for printed boards and other interconnection structures - Part 2-10: Sectional specification set for reinforced base materials, clad and unclad; Cyanate ester, brominated epoxide modified...
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 34A(Sec)512
Title: Filament lamps for road vehicles; amendment to IEC 60809; addition of data sheets for the category H35W lamps (IEC 34A(Secretariat)512:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN EN ISP 10612-7
Title: Information technology - International standardized profile RD; relaying the MAC service using transparent bridging - Part 7: Profile RD51.53 (CSMA/CD LAN - Token Ring LAN) (ISO/IEC ISP 10612-6:199...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47D/145/CDV
Title: Semiconductor devices, mechanical standardization - Tape ball grid array outline package (TBGA) family (IEC 47D/145/CDV:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 3A(Sec)340
Title: Graphical symbols for diagrams; amendment to IEC 60617-11, section 17 (new): factory built wiring systems; identical with IEC 3A(Secretariat)340:1993
Organization: DIN
Year: 1994
Status: Inactive
DIN EN 50173-2
Title: Information technology - Generic cabling systems - Part 2: Office premises; German version prEN 50173-2:2005
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 48B/842/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11-5: Climatic tests; tests 11e: Mould Growth (IEC 48B/842/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 60191-2-45
Title: Dual-In-Line memory module family, 184 Pin DDR, 1,27 mm contact center package (IEC 47D/393/CDV:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 40/1186/CD
Title: Passive components - An overview of the emerging technologies (IEC 40/1186/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 61189-3/A2
Title: Amendment 2 to IEC 61189-3: Test methods for electrical material, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (IEC 91/314/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 62453-306
Title: Field Device Tool Interface Specification - Part 306: Communication profile integration - IEC 61784 CPF 6; English version IEC 65E/11/CD:2007
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 61300-2-49
Title: Basic test and measurement procedures - Part 2-49: Tests - Connector Installation Test (IEC 86B/1942/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 61760-1
Title: Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) (IEC 91/380/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN 66376-4
Title: Information technology - Fibre Distributed Data Interface (FDDI) - Part 4: Single-Mode Fibre Physical Layer Medium Dependent (SMF-PMD); identical with ISO/IEC CD 9314-4
Organization: DIN
Year: 1992
Status: Inactive
DIN EN 60191-6-10
Title: General rules for the dimensions of P-VSON (IEC 47D/422/CDV:2001); German version prEN 60191-6-10:2001
Organization: DIN
Year: 2001
Status: Inactive
DIN ISO/IEC 14763-3
Title: Information technology - Implementation and operation of customer premises cabling - Part 3: Testing of optical fibre cabling (ISO/IEC FCD 14763-3:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 62453-302
Title: Field Device Tool Interface Specification - Part 302: Communication profile integration - IEC 61784 CPF 2; English version IEC 65E/8/CD:2007
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 40(Sec)685
Title: Detail specification: fixed tantalum chip capacitors for surface mounting with solid electrolyte and porous anode, style I, assessment level E (IEC 40(Sercretariat)685:1993)
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 60512-10-4
Title: Connectors for electronic equipment - Test and measurements - Part 10: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests; Section 4: Test 10d:...
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 61988-5
Title: Plasma Display Panels - Part 5: Generic specification (IEC 110/80/CD:2006)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 47E/37/CDV
Title: Amendment to IEC 60747-8: Field-effect transistors (IEC 47E/37/CDV:1996)
Organization: DIN
Year: 2000
Status: Inactive
DIN EN 140401-803
Title: Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2; German version prEN 140401-803:2006
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 62433
Title: Models of Integrated Circuits for EMI behavioural simulation (IEC 47A/726/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 52/644/CD
Title: Amendment 3 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 52/644/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47A(Sec)261
Title: Integrated circuits; sectional specification for film integrated circuits and hybrid film integrated circuits, capability approval procedure; identical with IEC 47A(Secretariat)261
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 60512-16-7
Title: Connectors for electronic equipment - Tests and measurements - Part 16-7: Mechanical tests on contacts and terminations - Test 16g: Measurement of contact deformation after crimping (IEC 48B/1567/C...
Organization: DIN
Year: 2006
Status: Inactive
DIN EN 140101
Title: Blank detail specification: Fixed low power film resistor; German version prEN 140101:2006
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 94/101/CD
Title: Electromechanical all-or-nothing telecom relays - Part 51: Blank detail specification; electromechanical all-or-nothing telecom relays of assessed quality; non standardized types and construction (...
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 62150-3-1
Title: Basic standards for discrete/integrated optoelectronic semiconductor devices for fibre optic communications including hybrid devices - Performance standards - Part 3-1: Fibre optic transceivers; Pe...
Organization: DIN
Year: 2001
Status: Inactive
DIN 50440
Title: Measurement of carrier lifetime in single-crystal silicon at low injection by the photoconductivity method
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 60512-16-3
Title: Connectors for electronic equipment - Tests and measurements - Part 16-3: Mechanical tests on contacts and terminations - Test 16c: Contact bending strength (IEC 48B/1563/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN CWA 14050-4
Title: Extensions for financial services (XFS) interface specification - Release 3.0 - Part 4: Identification card unit device class interface; (Englisch Version CWA 14050-4:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 62416
Title: Hot Carrier Test on MOS Transistors (IEC 47/1902/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN 50457-2
Title: Determination of components in dopant gas mixtures used in semiconductor technology (wet chemical method) - Part 2: Phosphine in nitrogen-phosphine mixtures
Organization: DIN
Year: 1999
Status: Inactive
DIN V ENV 41217
Title: Information technology - Functional standard for profile A/DI 31 - The directory; behavior of DUAs for distributed operations; English version ENV 41217:1993
Organization: DIN
Year: 1994
Status: Inactive
DIN EN 61249-4-16
Title: Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional...
Organization: DIN
Year: 2007
Status: Inactive
DIN CWA 14356
Title: Agreed requirements on multimodal tracking and tracing systems; English version CWA 14356:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 48B/827/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 2-5: Electrical continuity and contact resistance tests; Test 2e: Contact disturbance (...
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 61076-3-117
Title: Connectors for electronic equipment - Product Requirements - Part 3-117: Rectangular connectors: Protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 1000...
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 47E/36A/CDV
Title: Amendment to IEC 60747-7: Bipolar transistors (IEC 47E/36A/CDV:1996)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 60512-20-1
Title: Connectors for electronic equipment - Tests and measurements - Part 20-1: Fire hazard tests - Test 20a: Flammability, needle-flame (IEC 48B/1865/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 49/401/CD
Title: IEC 60679-3: Quartz crystal controlled oscillators - Part 3: Standard outlines and lead connections (IEC 49/401/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 48B/645/CD
Title: Connectors with assessed quality, for use in d.c. low-frequency analogue and in digital high speed data applications - Part 4: Printed boards connectors; Section 101: Detail specification for two-p...
Organization: DIN
Year: 1997
Status: Inactive
DIN 66379-6
Title: Information technology - High-performance parallel interface (HIPPI) - Part 6: Physical switch control (HIPPI-SC) (ISO/IEC CD 11518-6:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 61800-7-1
Title: Adjustable speed electrical power drive systems - Part 7-1: Generic interface and use of profiles for power drive systems - Interface definition (IEC 22G/152/CD:2005), text in English
Organization: DIN
Year: 2006
Status: Inactive
DIN EN 28632-2/A1
Title: Information technology - Computer graphics, metafile for the storage and transfer of picture description information - Part 2: Character encoding, Amendment A1: Rules for profiles (ISO/IEC 8632-2:1...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 61249-2-6
Title: Materials for printed boards and other interconnection structures - Part 2-6: Sectional specification set for reinforced base materials, clad and unclad; Brominated epoxide non-woven/woven E-glass ...
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 40/1093/CDV
Title: Amendment 1 to IEC 60384-4:1998: Fixed capacitors for use in electronic equipment - Part 4: Sectional specification: Aluminium electrolytic capacitors with solid and non-solid electrolyte (IEC 40/1...
Organization: DIN
Year: 1999
Status: Inactive
DIN ISO/IEC 2382-1
Title: Information technology - Vocabulary - Part 1: Fundamental terms (ISO/IEC 2382-1:1993)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 62417
Title: Mobile ion tests - Bias temperature stress (BTS) - Triangular voltage sweep (TVS) (IEC 47/1904/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 34A/782/CD
Title: Single-capped fluorescent lamps - Performance specifications; Amendment 2 to IEC 60901, 2nd edition (IEC 34A/782/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 3(Sec)455
Title: Product data representation and exchange - Printed circuit assembly product design (IEC 3(Sec)455:1993)
Organization: DIN
Year: 1995
Status: Inactive
DIN EN ISP 11185-6
Title: Information technology - International standardized profiles FVT2nn - Virtual terminal basic class; register of control object type definitions - Part 6: FVT219; status message control object; Engl...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 61158-4
Title: Digital data communication for measurement and control - Fieldbus for use in industrial control systems - Part 4: Data link protocol specification (IEC 65C/264/CDV:2001, text in English)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 61811-10
Title: Electromechanical elementary relays of assessed quality - Part 10: Relays for industrial application; Sectional specification (IEC 94/119/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN EN 61158-4
Title: Digital data communication for measurement and control - Fieldbus for use in industrial control systems - Part 4: Data link protocol specification (IEC 61158-4:2003 + corrigendum 2004); English ver...
Organization: DIN
Year: 2005
Status: Inactive
DIN ISO/IEC 14763-4
Title: Information technology - Implementation and operation of customer premises cabling - Part 4: Testing of balanced copper cabling in the horizontal sub-system (ISO/IEC PDTR 14763-4:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN 50445
Title: Contactless determination of the resistivity of homogeneously-doped semiconductor slices with the eddy current induction method
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 60297-3-102
Title: Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19-in) series - Part 3-102: Injector/extractor handle (IEC 48D/256/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 48B/844/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11-9: Climatic tests; tests 11i: Dry Heat (IEC 48B/844/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 62391-2-1
Title: Fixed electric double layer capacitors for use in electronic equipment - Part 2-1: Blank detail specification: Electric double layer capacitors for power application; Assessment level EZ (IEC 40/13...
Organization: DIN
Year: 2004
Status: Inactive
DIN EN 60749-36
Title: Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration steady state (IEC 47/1585/CDV:2001); German version prEN 60749-36:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 60384-2
Title: Fixed capacitors for use in electronic equipment - Part 2: Sectional specification - Fixed metallized polyethylene-terephthalate film dielectric d.c. capacitors (IEC 40/1387/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN 50434
Title: Testing of materials for semiconductor technology; detection of crystal defects in monocrystalline silicon using etching techniques on {111} and {100} surfaces
Organization: DIN
Year: 1986
Status: Inactive
DIN ISO/IEC 11581-1
Title: Information technology - User-system, interfaces and symbols - Icon symbols and functions - Part 1: Icons - General (ISO/IEC DIS 11581-1:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 48B/784/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 25: Section 4: Propagation delay test procedure (IEC 48B/784/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 61189-2/A2
Title: Amendment 2 to IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 91/313/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 60749-23
Title: Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 47/1636/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 34A/788/CDV
Title: Maximum lamp outlines for incandescent lamps; Amendment 3 to IEC 60630 (IEC 34A/788/CDV:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 60512-16-16
Title: Connectors for electronic equipment - Tests and measurements - Part 16-16: Mechanical tests on contacts and terminations - Test 16p: Torsional strength, fixed male tabs (IEC 48B/1573/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 65C/243/CD
Title: Digital data communication for measurement and control - Fieldbus for use in industrial control systems - Part 3: Data link service definition; Amendment 1 (IEC 65C/243/CD:2000; text in Englisch)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47C(Sec)25
Title: Optoelectronic semiconductor devices; essential ratings and characteristics of laser diode modules for pumping an optical fibre amplifier (IEC 47C(Secretariat)25:1993)
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 47A(Sec)300
Title: Interface integrated circuits; measuring methods of linear ADC and DAC; identical with IEC 47A(Secretariat)300
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 62373
Title: Bias-Temperature Stability Test for MOSFET (IEC 47/1763/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN EN 61249-2-21
Title: Materials for printed boards and other interconnection structures - Part 2-21: Sectional specification set for reinforced base materials, clad and unclad; Non-halogenated epoxide woven E-glass rein...
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 48B(CO)185
Title: Detail specification for rectangular connectors for frequencies below 3 MHz with polarized guides or jackscrews size 16 (13 A) round contacts; identical with IEC 48B(Central Office)185
Organization: DIN
Year: 1990
Status: Inactive
DIN IEC 52/686/CDV
Title: IEC 61188-2: Design and use of printed boards and printed board assemblies - Part 2: Guide to the use of printed wiring board substrate materials; surface mount technology (IEC 52/686/CDV:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN EN 61249-2-18
Title: Materials for interconnection structures - Part 2-18: Sectional specification set for reinforced base materials clad and unclad; polyester non-woven fibreglass laminated sheet of defined flammabili...
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 62047-6
Title: Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 47/1900/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 60512-25-9
Title: Connectors for electrical equipment - Test and measurements - Part 25-9: Signal integrity tests - Test 25i: Alien crosstalk (IEC 48B/1536/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN EN 61967-6
Title: Integrated circuits - Measurement of electromagnetic emissions 150 kHz to 1 GHz - Part 6: Measurement of RF currents, magnetic probe method (IEC 47A/568/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 61249-4-2
Title: Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Multifunctional e...
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 95/22/CD
Title: Electrical relays - Reliability of measuring relays and protection equipment (IEC 95/22/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 62453-303-1
Title: Field Device Tool Interface Specification - Part 303-1: Communication profile integration - IEC 61784 CP 3/1 and CP 3/2; English version IEC 65E/9/CD:2007
Organization: DIN
Year: 2008
Status: Inactive
DIN 50438-1
Title: Determination of interstitial oxygen content of silicon intended for use in semiconductor technology by infrared absorption spectroscopy
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 48B/783/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 25: Section 2: Attenuation test procedure (IEC 48B/783/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47C/239/CD
Title: Plasma display panels - Part 2: Measuring methods (IEC 47C/239/CD:2000)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 3C(Sec)201
Title: 8 timer symbols; modification of already published symbols and new projects; identical with IEC 3C(Secretariat)201
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 62496-1
Title: Optical circuit boards - Part 1: General standard (IEC 86/271/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN EN ISO/IEC 9592-4
Title: Information processing systems - Computer graphics; Programmer's Hierarchical Interactive Graphics System (PHIGS) - Part 4: Plus Lumière and Surfaces, PHIGS PLUS (ISO/IEC 9592-4:1992, including Tec...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60512-13-5
Title: Connectors for electronic equipment - Basic testing and measurements: Part 13-5: Test 13e: Polarizing and keying method (IEC 48B/1266/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 60749-39
Title: Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits (IEC 47/1797/CD:2004)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 62150-3-2
Title: Basic standards for discrete/integrated optoelectronic semiconductor devices for fibre optic communications including hybrid devices - Performance standards - Part 3-2: Fibre optic transceivers; Pe...
Organization: DIN
Year: 2001
Status: Inactive
DIN EN ISP 12064-1
Title: Information technology - International Standardized Profile FOD112; Open document format: Image applications; Simple document structure; Raster graphics content architecture - Part 1: Document Appl...
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 47(Sec)1284
Title: Semiconductor devices; list of recommended subscripts in IEC 60747-1, partial revision; identical with IEC 47(Secretariat)1284
Organization: DIN
Year: 1993
Status: Inactive
DIN EN 60191-6-12
Title: General design guideline for rectangular FLGA packages (IEC 47D/395/CDV:2000); German version prEN 60191-6-12:2000
Organization: DIN
Year: 2001
Status: Inactive
DIN EN 62448
Title: Multimedia systems and equipment - Multimedia e-publishing and e-books - Generic format for e-publishing (IEC 100/1386A/CDV:2008); German version FprEN 62448:2008
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 48B/399/CD
Title: Sectional specification - In-line sockets with assessed quality, for use in d.c., low frequency analogue and digital high speed data rate applications (IEC 48B/399/CD:1995)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 60064/A5
Title: Tungsten filament lamps for domestic and similar general lighting purposes - Performance requirements (IEC 34A/1240/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 40/769/CD
Title: Amendment to IEC 60384-18: Fixed capacitors for use in electronic equipment - Part 18: Sectional specification: Fixed aluminium electrolytic chip capacitors with solid and non-solid electrolyte (IE...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN ISP 10613-4
Title: Information technology - International Standardized Profile RA; relaying the connection-mode network service - Part 4: FDDI LAN subnetwork-dependent, media-dependent requirements (ISO/IEC ISP 10613...
Organization: DIN
Year: 1996
Status: Inactive
TR 101 562
Title: PowerLine Telecommunications (PLT); MIMO PLT Universal Coupler, Operating Instructions - Description
Organization: ETSI
Year: 2011
Status: Active
DIN IEC 60747-16-3/A1
Title: Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters (IEC 47E/335/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 47A(Sec)282
Title: Integrated circuits; essential ratings and characteristics of ISDN-oriented modular circuits; identical with IEC 47A(Secretariat)282
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 47D/197/CD
Title: Semiconductor devices, mechanical standardization - Ceramic land grid array 1,0/0,8 mm pitch family (IEC 47D/197/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 47A(Sec)351
Title: Amendment to sub-clause 3.3.4.2 and B7 of IEC 60748-22 - Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures ...
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 65C/179/CDV
Title: Fieldbus standard for use in industrial control systems - Part 4: Data link layer protocol specification (IEC 65C/179/CDV:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN EN ISP 10607-2
Title: Information technology - International Standardized Profiles AFTnn; file transfer, access and management - Part 2: Definition of document types, constraint sets and syntaxes (ISO/IEC ISP 10607-2:19...
Organization: DIN
Year: 1997
Status: Inactive
DIN EN 50346/A1
Title: Information technology - Cabling installation - Testing of installed cabling; German version EN 50346:2002/prA1:2006
Organization: DIN
Year: 2006
Status: Inactive
DIN EN ISP 10612-3
Title: Information technology - International Standardized Profile RD; relaying the MAC service using transparent bridging - Part 3: Token Ring LAN subnetwork-dependent, media-dependent requirements (ISO/...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47A/373/CDV
Title: Procedure for manufacturer approval and quality management (IEC 47A/373/CDV:1995)
Organization: DIN
Year: 1995
Status: Inactive
DIN EN 62352
Title: Hybrid Fibre Coax Outside Plant Status Monitoring - Power Supply to Transponder Interface Bus (PSTIB) Specification (IEC 100/578/CDV:2002); German version prEN 62352:2002, text in English
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 47E(Sec)4
Title: Semiconductor devices; revised and additional measuring methods for microwave field effect transistors; amendment to IEC 47(Central Office)1261 (IEC 47E(Secretariat)4:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN EN 175101-809
Title: Detail specification: Two-part connectors for printed boards having a grid of 2,54 mm, short version in compliance with CECC 75101-801, with assessed quality; German version prEN 175101-809:2003
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 47D/53/CD
Title: Pin 1 mark for identification in automatic handling systems (IEC 47D/53/CD:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 60384-9-1
Title: Fixed capacitors for use in electronic epuipment - Part 9-1: Blank detail specification: Fixed capacitors of ceramic dielectric, class 2; Assessment level EZ (IEC 40/1318/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 60539-2
Title: Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification; Surface mount negative temperature coefficient thermistors (IEC 40/1246/CD:2001)
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 61249-2-38
Title: Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials clad and unclad - Non-halogenated epoxide woven E-glass laminated sheets of defined flammabi...
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 47C/88/CD
Title: Blank detail specification for light emitting diodes for display application (IEC 47C/88/CD:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 47(Sec)1281
Title: Semiconductor devices; single ended package outline of form A; identical with IEC 47(Secretariat)1281
Organization: DIN
Year: 1992
Status: Inactive
DIN EN ISP 10607-4
Title: Information technology - International Standardized Profiles AFTnn; file transfer, access and management - Part 4: AFT12, positional file transfer service (flat) (regional variant of ISO/IEC ISP 10...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 61988-2-3
Title: Plasma Display Panels - Part 2-3: Measuring methods - Quality (IEC 110/52/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 61988-3
Title: Plasma display panels - Part 3: Guidelines of mechanical interface (IEC 47C/284/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 47(Sec)1252
Title: Semiconductor devices; new concepts and letter symbols for feld-effect transistors; identical with IEC 47(Secretariat)1252:1991
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 60384-19-1
Title: Fixed capacitors for use in electronic equipment - Part 19-1: Blank detail specification - Fixed metallized polyethylene-terephthalate film dielectric chip d.c. capacitors - Assessment level EZ (IE...
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 40(CO)761
Title: Fixed resistors for use in electronic equipment; sectional specification and blank detail specification: fixed power resistors; assessment level E; amendment to IEC 60115-4; identical with IEC 40(C...
Organization: DIN
Year: 1991
Status: Inactive
DIN EN 60749-26
Title: Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM) (IEC 47/1803/CDV:2005); German version prEN 60749-...
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 56/486/CD
Title: IEC 60300-3-7: Dependability management - Part 3: Application guide; section 7: Reliability stress screening of electronic hardware (IEC 56/486/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 61189-6
Title: Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in electronic assemblies (IEC 91/315/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 60512-16-17
Title: Connectors for electronic Equipment - Tests and measurements - Part 16-17: Mechanical tests on contacts and terminations - Test 16q: Tensile and compressive strength, fixed male tabs (IEC 48B/1574/...
Organization: DIN
Year: 2006
Status: Inactive
DIN CWA 13937-9
Title: J/eXtensions for Financial Service (J/XFS) for the Java Platform - Part 9: Depository Device Class Interface; Programmer's Reference
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47D(Sec)5
Title: Semiconductor devices; mechanical standardization; designation system for semiconductor outlines (IEC 47D(Secretariat)5:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN EN ISP 11183-1
Title: Information technology; International Standardized Profiles AOM1n OSI Management - Management Communications - Part 1: Specification of ACSE, presentation and session protocols for the use by ROSE ...
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 40(CO)702
Title: Potentiometers for use in electronic equipment; blank detail specification; single-turn rotary low-power potentiometers; assessment level E; identical with IEC 40(CentralOffice)702
Organization: DIN
Year: 1991
Status: Inactive
DIN CWA 14174-1
Title: Financial transactional IC card reader (FINREAD) - Part 1: Business requirements; English version CWA 14174-1:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN 19220
Title: Procedure for the declaration of materials in products of the electrotechnical and electronic industry
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 34A(Sec)527
Title: Miniature lamps; amendment to IEC 60983; 2nd edition (IEC 34A(Secretariat)527:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN 66376-13
Title: Information technology - Fibre Distributed Data Interface (FDDI) - Part 13: Conformance test; Protocol Implementation Conformance Statement Proforma (ISO/IEC CD 9314-13:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 40(Sec)693
Title: Packaging of components for automatic handling - Packaging of leadless components on continuous tapes; amendments to IEC Publication 60286-3 (1991); identical with IEC 40(Secretariat)693:1994
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 47C/98/CD
Title: Semiconductor devices - Measuring method for the second- and third-orderintermodulation distortions of an analogue pin-diode (IEC 47C/98/CD:1995)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 61076-3
Title: Connectors for electronic equipment - Part 3: Rectangular connectors - Sectional specification (IEC 48B/1358/CD:2003)
Organization: DIN
Year: 2004
Status: Inactive
DIN EN ISO/IEC 11172-2
Title: Information technology - Coding of moving pictures and associated audio for digital storage media at up to about 1,5 Mbit/s - Part 2: video (ISO/IEC 11172-2:1993); English version EN ISO/IEC 11172-...
Organization: DIN
Year: 1995
Status: Inactive
DIN EN 28632-1
Title: Information technology - Computer graphics; metafile for the storage and transfer of picture description information - Part 1: Functional specification (ISO/IEC 8632-1:1992); English version EN 286...
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 61192-5
Title: Product performance requirements - Part 5: Rework, modification and repair of soldered electronic assemblies (IEC 91/326/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 61967-6/A1
Title: Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic Probe method (IEC 47A/720/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 61249-2-23
Title: Materials for interconnection structures - Part 2-23: Sectional specification set for reinforced base materials, clad and unclad; Section 23: Non-halogenated phenolic cellulose paper reinforced lam...
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 47A/421/CDV
Title: QML for integrated circuits (IEC 47A/421/CDV:1996)
Organization: DIN
Year: 1996
Status: Inactive


Advertisement