Standards Library

7,001-7,500 of 21,454 results for "Electronics"

DIN 41548-1
Title: All glass tube with 9-17
Organization: DIN
Status: Inactive
DIN 44431-1
Title: B 8 H, base - Supply dimensions
Organization: DIN
Status: Inactive
DIN IEC 47(CO)1187
Title: Semiconductor devices; amendment of testgroups B5, C5 and C7 of IEC 747-11; identical with IEC 47(Central Office)1187
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 60747-8
Title: Semiconductor devices - Discrete devices - Field-effect transistors; Identical with IEC 60747-8:1984
Organization: DIN
Year: 1989
Status: Inactive
DIN IEC 40(Sec)615
Title: Fixed resistors for use in electronic equipment; detail specification: fixed precision wirewound; resistors with solderable axial wire leads; stability class 0,1%; assessment level E; identical wit...
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 40(Sec)616
Title: Potentiometers for use in electronic equipment; detail specification: lead-screw actuated preset potentiometers; stability class 5%; assessment level E; identical with IEC 40(Secretariat)616
Organization: DIN
Year: 1992
Status: Inactive
DIN 45921-301
Title: Harmonized system of quality assessment for electronic components - Blank detail specification: fixed precision resistors
Organization: DIN
Year: 1987
Status: Inactive
DIN IEC 25/214/CDV
Title: Amendments to IEC 60027-2, 60027-2A, and 60027-2B concerning matrices for linear two-port and n-port networks (IEC 25/214/CDV:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 47D/316A/CD
Title: Proposal for 60 and 90 Pin P-FBGA (Plastic Fine pitch Ball Grid Array) 0,8 mm (IEC 47D/316A/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 61360-1/A1
Title: Standard data element types with associated classification scheme for electric components - Part 1: Definitions; Principles and methods; Amendment 1 (IEC 3D/82/CD:2001)
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 50170/A1
Title: Universelles Feldkommunikationssystem; Aenderung A1; Deutsche Fassung EN 50170/A1:2002, Text Englisch
Organization: DIN
Year: 2002
Status: Inactive
VDI 2880 Blatt 2
Title: Speicherprogrammierbare Steuerungsgeraete; Prozess- und Datenschnittstellen
Organization: VDI
Year: 1985
Status: Inactive
NF EN 60603-7-71
Title: Connectors for electronic equipment - Part 7-71 : detail specification for 8-way, shielded, free and fixed connectors, for data transmission with frequencies up to 1 000 MHz
Organization: AFNOR
Year: 2011
Status: Active
DIN EN 29171-1
Title: Information technology; 130 mm optical disk cartridge, write once, for information interchange; part 1: unrecorded optical disk cartridge (ISO/IEC 9171-1:1990); English version EN 29171-1:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 60384-3-1
Title: Fixed capacitors for use in electronic equipment; part 3: blank detail specification: fixed tantalum chip capacitors; assessment level E; identical with IEC 60384-31:1989
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 60512-8
Title: Electromechanical components for electronic equipment; basic testing procedures and measuring methods; part 8: connector tests (mechanical) and mechanical tests on contacts and terminations; identi...
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 91/159/CD
Title: IEC 61192-3: Printed board assemblies - Part 3: Sectional specification: Workmanship requirements for through-hole mount soldered assemblies (IEC 91/159/CD:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 47A/497/CDV
Title: Amendments to IEC 60748-11:1990 and to its Amendment 1:1995 (IEC 47A/497/CDV:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 25/202/CD
Title: Conventions concerning electric and magnetic circuits (IEC 25/202/CD:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 60081/A401
Title: Double-capped fluorescent lamps - Performance specifications (IEC 34A/1262/CD:2007)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 60384-8
Title: Fixed capacitors for use in electronic equipment; part 8: sectional specification: fixed capacitors of ceramic dielectric, class 1; identical with IEC 60384-8:1988
Organization: DIN
Year: 1993
Status: Inactive
DIN 44028-2
Title: Conditions for measurements of photo-multiplier
Organization: DIN
Status: Inactive
DIN ISO 7638-2
Title: Road vehicles - Electrical connectors for braking systems - Part 2: Connectors for 12 V nominal supply voltage (ISO 7638-2:1997)
Organization: DIN
Year: 2001
Status: Inactive
DIN 41432
Title: Fixed resistors; wirewound, vitreous enamelled, lug terminals
Organization: DIN
Year: 1985
Status: Inactive
DIN CWA 14174-8
Title: Financial transactional IC card reader (FINREAD) - Part 8: FINREAD client application programming interfaces (APIs); English version CWA 14174-8:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 47E(Sec)5
Title: Semiconductor devices; supplement to IEC 60747-7: bipolar transistors, pulse methods for collector-base cutt-off current and emitter-base cutt-off current (IEC 47E(Secretariat)5:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 47D/331/CDV
Title: Semiconductor devices, mechanical standardization - QFN-outline drawings to the outline family 119E (IEC 47D/331/CDV:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47(CO)1237
Title: Semiconductor devices; recommended values for QFP semiconductor outlines, form E (surface mounted outlines); identical with IEC 47(Central Office)1237:1990
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 47D(Sec)31
Title: Semiconductor devices, mechanical standardization - Devices with terminals disposed in three or more rows in each orthogonal direction (IEC 47D(Sec)31:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 61076-3
Title: Connectors for electronic equipment - Part 3: Rectangular connectors - Sectional specification (IEC 48B/1358/CD:2003)
Organization: DIN
Year: 2004
Status: Inactive
DIN EN 60249-2-15
Title: Base materials for printed circuits - Part 2: Specifications; specification No. 15: Flexible copper-clad polyimide film, of defined flammability (IEC 60249-2-15:1987 + A1:1993); German version EN 6...
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 15D/47/CD
Title: Specification for the protection of electronic devices - Part y: General requirements (IEC 15D/47/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 60249-2-10
Title: Base materials for printed circuits - Part 2: Specifications; Specification No. 10: Epoxide non woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning te...
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 47D/314A/CD
Title: Tape ball grid array package, 0,6 mm ball diameter family (IEC 47D/314A/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 60384-4-2
Title: Fixed capacitors for use in electronic equipment; blank detail specification: aluminium electrolytic capacitors with solid electrolyte, assessment level E; identical with IEC 60384-4-2:1985
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 47A(Sec)256
Title: Integrated circuits; family specific essential ratings and characteristics and functions for digital interface circuits in IEC 60748-2; identical with IEC 47A(Secretariat)256
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC CMC/530/CD
Title: Quality assessment system for electronic components (IECQ) - Amendment to the Basic Rules IEC QC 001001 (IEC CMC/530/CD:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN 49864
Title: Ballasts for fluorescent lamps; dimensions of cross-section
Organization: DIN
Status: Inactive
DIN IEC 48B/780/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 25: Section 3: Rise time degradation test procedure (IEC 48B/780/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 48B/784/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 25: Section 4: Propagation delay test procedure (IEC 48B/784/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN 50456-1
Title: Testing of materials for semiconductor technology - Method for the characterisation of moulding compounds for electronic components - Determination of the thermo-mechanical dilatation of epoxy resi...
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 40(CO)702
Title: Potentiometers for use in electronic equipment; blank detail specification; single-turn rotary low-power potentiometers; assessment level E; identical with IEC 40(CentralOffice)702
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 62415
Title: Constant Current Electromigration Test (IEC 47/1954/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 48B/785/CD
Title: Detail specification for rectangular connectors with non-removable ribbon cable contacts on 1,25 mm pitch single row used with high speed serial data connector (HSSDC) (IEC 48B/785/CD:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 60749-24
Title: Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance; Unbiased HAST (IEC 47/1646/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 60862-1
Title: Surface acoustic wave (SAW) filters; part 1: general information, standard values and test conditions; chapter I: general information and standard values; chapter II: test conditions; identical wit...
Organization: DIN
Year: 1992
Status: Inactive
DIN 49820-11
Title: Projection lamps; single ended halogen lamps for stage lighting
Organization: DIN
Year: 1978
Status: Inactive
DIN EN 131801
Title: Blank detail specification: Fixed polypropylen film dielectric metal foil d.c. capacitors - Assessment level E; German version EN 131801:1997
Organization: DIN
Year: 1998
Status: Inactive
DIN 41539-1
Title: Miniature pipes with 9 pins - Nine-pin tubes, external dimensions
Organization: DIN
Status: Inactive
DIN EN ISP 11183-1
Title: Information technology; International Standardized Profiles AOM1n OSI Management - Management Communications - Part 1: Specification of ACSE, presentation and session protocols for the use by ROSE ...
Organization: DIN
Year: 1995
Status: Inactive
VDI 2880 Blatt 5
Title: Speicherprogrammierbare Steuerungsgeraete; Sicherheitstechnische Grundsaetze
Organization: VDI
Year: 1985
Status: Inactive
VDI 2880 Blatt 1
Title: Speicherprogrammierbare Steuerungsgeraete; Definitionen und Kenndaten
Organization: VDI
Year: 1985
Status: Inactive
VDI/VDE 3552
Title: Use of field bus systems in water supply plants
Organization: VDI
Year: 2006
Status: Inactive
VDI/VDE/ATV 3552 Blatt 1
Title: Einsatz von Feldbus-Systemen in der Wasserwirtschaft - Spezifikationen von Funktionen und Parametern in Feldgeraeten und Analysatoren fuer kommunale und industrielle Abwasserbehandlungs- und Wasser...
Organization: VDI
Year: 2002
Status: Inactive
DIN IEC 47D/301/CD
Title: Mechanical standardization of semiconductor devices, common package unit design guide for 1,50 mm, 1,27 mm and 1,00 mm ball-grid-terminal-packages (IEC 47D/301/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
VDI 3729 Blatt 1
Title: Emissionskennwerte technischer Schallquellen; Geraete der Buero- und Informationstechnik; Rahmen-Richtlinie
Organization: VDI
Year: 1992
Status: Inactive
VDI/VDE/ATV 3552 Blatt 3
Title: Einsatz von Feldbus-Systemen in der Wasserwirtschaft - Spezifikationen von Funktionen und Parametern in Feldgeraeten und Analysatoren fuer kommunale und industrielle Abwasserbehandlungs- und Wasser...
Organization: VDI
Year: 2002
Status: Inactive
VDI/VDE 3911
Title: Electrical construction elements; variable resistors; construction catalog
Organization: VDI
Year: 1984
Status: Inactive
EN 60255-22-5
Title: Measuring relays and protection equipment - Part 22-5: Electrical disturbance tests - Surge immunity test
Organization: CENELEC
Year: 2011
Status: Inactive
DS/ISO/IEC 19761
Title: Software engineering - COSMIC: a functional size measurement method
Organization: DS
Year: 2011
Status: Active
EN 60130-9
Title: Connectors for frequencies below 3 MHz - Part 9: Circular connectors for radio and associated sound equipment
Organization: CENELEC
Year: 2011
Status: Active
DS/IEC/PAS 62707-1
Title: LED - Binning - Part 1: General requirements and white grid
Organization: DS
Year: 2011
Status: Inactive
DIN IEC 60384-17
Title: Fixed capacitors for use in electronic equipment; part 17: sectional specification: fixed metallized polypropylene film dielectric a.c. and pulse capacitors; identical with IEC 60384-17:1987
Organization: DIN
Year: 1991
Status: Inactive
DIN CWA 13937-8
Title: J/eXtensions for Financial Service (J/XFS) for the Java Platform - Part 8: Sensors and Indicators Unit Device Class Interface; Programmer's Reference
Organization: DIN
Year: 2000
Status: Inactive
DIN 44434-1
Title: Base 13-17 for tubes and valves - Connecting dimensions
Organization: DIN
Status: Inactive
DIN EN 150015
Title: Blank detail specification - Unidirectional transient overvoltage suppressor diodes; German version EN 150015:1992
Organization: DIN
Year: 1996
Status: Inactive
DIN EN ISO/IEC 11172-3
Title: Information technology - Coding of moving pictures and associated audio for digital storage media at up to about 1,5 Mbit/s - Part 3: audio (ISO/IEC 11172-3:1993); English version EN ISO/IEC 11172-...
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 91/119/CD
Title: IEC 61761: Generic specification - Capability approval for surface mount technologies (IEC 91/119/CD:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 60512-1-100
Title: Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications (IEC 48B/1421/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN EN 100015-2
Title: Basic specification - Protection of electrostatic sensitive devices - Part 2: Requirements for low humidity conditions; German version EN 100015-2:1993
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 60384-17-1
Title: Fixed capacitors for use in electronic equipment; part 17: blank detail specification: fixed metallized polypropylene film dielectric a.c. and pulse capacitors; assessment level E; identical with I...
Organization: DIN
Year: 1991
Status: Inactive
DIN 45910-16
Title: Harmonized system of quality assessment for electronic components; sectional specification: fixed capacitors of ceramic dielectric, class 1
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 48B/828/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 2-6: Electrical continuity and contact resistance tests; Tests 2f: Housing (shell) elec...
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 61811-10
Title: Electromechanical elementary relays of assessed quality - Part 10: Relays for industrial application; Sectional specification (IEC 94/119/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 34A(CO)692
Title: Filament lamps for road vehicles - Performance requirements - Amendment 1: Performance requirements (IEC 34A(CO)692:1994)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 48B(Sec)246
Title: Detail specification for circular power connectors for low frequencies, for use with loudspeakers, amplifiers and sound equipment; identical with IEC 48B(Secretariat)246
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 47A(CO)260
Title: Integrated circuits; terms, definitions and letter symbols for latch-up characteristics; identical with IEC 47A(Central Office)260
Organization: DIN
Year: 1992
Status: Inactive
DIN 50432
Title: Pruefung halbleitender anorganischer Stoffe - Bestimmung des Leitungstyps von Silicium oder Germanium mittels Richttest oder Thermosonde
Organization: DIN
Year: 1980
Status: Inactive
DIN V ENV ISO 14819-3
Title: Traffic and traveller information (TTI) - TTI Messages via traffic message coding - Part 3: Location referencing for ALERT-C (ISO/TS 14819-3:2000); English version ENV ISO 14819-3:2000
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 52/675/CD
Title: IEC 62326-2-1: Printed boards - Part 2: Rigid single and double-sided printed boards without interlayer connections; Section 1: Capability detail specification; performance level A, B und C (IEC 52...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 47(CO)1050
Title: IEC quality assessment system for electronic components; family specification for complementary MOS digital integrated circuits; series 4000 B and 4000 UB; identical with IEC 47(Central Office)1050
Organization: DIN
Year: 1988
Status: Inactive
DIN IEC 40(CO)724
Title: Fixed capacitors for use in electronic equipment to IEC 60384-8; sectional specification: fixed capacitors of ceramic dielectric, class 1 to IEC 60384-8-1; blanc detail specification: fixed capacit...
Organization: DIN
Year: 1991
Status: Inactive
EN 60384-26-1
Title: Fixed capacitors for use in electronic equipment - Part 26-1: Blank detail specification - Fixed aluminum electrolytic capacitors with conductive polymer solid electrolyte - Assessment level EZ
Organization: CENELEC
Year: 2010
Status: Active
EN 61347-2-12
Title: Lamp controlgear Part 2-12: Particular requirements for d.c. or a.c. supplied electronic ballasts for discharge lamps (excluding fluorescent lamps)
Organization: CENELEC
Year: 2005
Status: Active
EN 62047-4
Title: Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
Organization: CENELEC
Year: 2010
Status: Active
DIN IEC 47D/198/CD
Title: SVP-(Surface Vertical package), 0,65 mm pitch family (IEC 47D/198/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN EN 60512 Beiblatt 1
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - List of tests currently envisaged and their arrangement
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 62149-3-3
Title: Basic standard for discrete/integrated optoelectronic semiconductor devices for fibre optic communications including hybrid devices - Package interface standards - Part 3-3: Fibre optic transceiver...
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 62113
Title: Semiconductors Product - Discontinuance notification for semiconductors (IEC 47/1777A/CDV:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 48B/823/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1-2: General examination; Test 1b: Examination of dimension and mass (IEC 48B/823/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 60191-6-19
Title: Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage (IEC 47D/709/CD:2007)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 47A(CO)189
Title: Semiconductor devices; family specification for HCMOS digital integrated circuits, series 54/74HC, 54/74HCT, 54/74HCU; identical with IEC 47A(Central Office)189
Organization: DIN
Year: 1990
Status: Inactive
DIN IEC 40/1043/CDV
Title: Amendment 1 to IEC 60115-8:1989 - Fixed resistors for use in electronic equipment - Part 8: Sectional specification; fixed chip resistors (IEC 40/1043/CDV:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 60384-24
Title: Fixed capacitors for use in electronic equipment - Part 24: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolyte (IEC 40/1428/CD:...
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 60748-2
Title: Semiconductor devices; integrate circuits; part 2: digital integrated circuits; identical with IEC 60748-2:1985
Organization: DIN
Year: 1990
Status: Inactive
DIN IEC 47D/170/CDV
Title: Semiconductor devices - Mechanical standardization - General rules for TSOP (Thin small outline package) Type II (IEC 47D/170/CDV:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 47(Sec)1246
Title: Semiconductor devices; category of assessed quality; term and definition; identical with IEC 47(Secretariat)1246
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 62421
Title: Electronic Modules - Generic standard (IEC 91/546/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN EN 50254
Title: High efficiency communication subsystem for small data packages; German version of EN 50254:1998, text in English
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 61163-3
Title: Reliability stress screening - Part 3: Reliability screening of repairable single items (IEC 56/951/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC CMC/462/CD
Title: Draft - Revised rules of procedure - Part 1: Administration (IEC CMC/462/CD:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 3B/195/CD
Title: Industrial systems, installations and equipment and industrial products - Structuring principles and reference designations - Part 2: Classification of objects and codes for classes (IEC 3B/195/CD:...
Organization: DIN
Year: 1997
Status: Inactive
DIN 41215
Title: Electrical communication engineering; electromagnetic relays, definitions
Organization: DIN
Year: 1974
Status: Inactive
DIN IEC 40(Sec)685
Title: Detail specification: fixed tantalum chip capacitors for surface mounting with solid electrolyte and porous anode, style I, assessment level E (IEC 40(Sercretariat)685:1993)
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 60384-25
Title: Fixed capacitors for use in electronic equipment - Part 25: Sectional specification - Surface mount fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte (IEC 40/1430/CD...
Organization: DIN
Year: 2004
Status: Inactive
DIN 32748-1
Title: Office machines; personal computer; concepts and classification
Organization: DIN
Year: 1987
Status: Inactive
DIN IEC 34A(Sec)528
Title: Method of measurement of centre beam intensity and beam angle(s) of reflector lamps (IEC 34A(Sec)528:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN EN 61249-2-36
Title: Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheets of defined flammability (vertical b...
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 34A/767/CDV
Title: Miscellaneous lamps; Amendment 2 to IEC 61549:1996 (IEC 34A/767/CDV:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 47A(Sec)312
Title: Amendment to sectional specification for semiconductor integrated circuits, excluding hybrid circuits (IEC 47A(Sec)312:1993)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 60512-14-2
Title: Connectors for electronic equipment - Basic testing and measurements: Part 14-2: Test 14b: Sealing; Fine air leakage (IEC 48B/1267/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 61076-3-116
Title: Connectors for electronic equipment - Part 3-116: Rectangular connectors - Protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 600 MHz for industrial env...
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 62137-1-5
Title: Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test (IEC 91/695/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 60512-20-3
Title: Connectors for electronic equipment - Tests and measurements - Part 20-3: Fire hazard tests - Test 20c: Flammability, glow-wire (IEC 48B/1866/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 52/757/CDV
Title: IEC 61249-2-19: Materials for interconnection structures - Part 2: Sectional specification set for reinforced base materials clad and unclad; section 19: High temperature epoxide cross-plied cohere...
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 60384-18-2
Title: Fixed capacitors for use in electronic equipment - Part 18-2: Blank detail specification: Fixed aluminium electrolytic surface mount capacitors with non solid electrolyte - Assessment level EZ (IEC...
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 60512-12-1
Title: Connectors for electronic equipment - Basic testing and measurements - Part 12-1: Test 12a: Solderability, wetting, solder bath method (IEC 48B/1259/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 61760-2
Title: Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 91/461/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 91(Sec)25
Title: Test methods of resistance to force; identical with IEC 91(Secretariat)25:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN EN 28632-1/A1
Title: Information technology - Computer graphics, metafile for the storage and transfer of picture description information - Part 1: Functional specification, Amendment A1: Rules for profiles (ISO/IEC 86...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN ISP 12061-6
Title: Information technology - Open Systems Interconnection - International standardized profiles: OSI distributed transaction processing - Part 6: Application supported transactions, sheared control (AT...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 60749-17
Title: Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation (IEC 47/1588/CDV:2001); German version prEN 60749-17:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 48B/832/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 4-3:Voltage stress tests; test 4c: Voltage proof of pre-insulated crimp barrels (IEC 48...
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 48B/768/CD
Title: Connectors with assessed quality, for use in d.c. and low frequency analogue and in digital application with high speed data rates - Part 4: Sectional specification for the definition and approval ...
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 60191-6-14
Title: Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for packa...
Organization: DIN
Year: 2007
Status: Inactive
DIN EN 60512-1-100
Title: Draft IEC 60512-1-100: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1-100: General; applicable publications (IEC 48B/808/CDV:1999); ...
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 61249-2-42
Title: Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of...
Organization: DIN
Year: 2008
Status: Inactive
DIN EN ISP 12061-4
Title: Information technology - Open Systems Interconnection - International standardized profiles: OSI distributed transaction processing - Part 4: Support of session, presentation and ACSE PDUs (ISO/IEC...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 52/577/CD
Title: Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements; attachment (Land/joint) considerations; section 6: Components with J leads on four sid...
Organization: DIN
Year: 1996
Status: Inactive
VDI/VDE/ATV 3552 Blatt 2
Title: Einsatz von Feldbus-Systemen in der Wasserwirtschaft - Spezifikationen von Funktionen und Parametern in Feldgeraeten und Analysatoren fuer kommunale und industrielle Abwasserbehandlungs- und Wasser...
Organization: VDI
Year: 2002
Status: Inactive
DIN EN ISP 10607-1
Title: Information technology - International Standardized Profiles AFTnn; file transfer, access and management - Part 1: Specification of ACSE, presentation and session protocols for the use by FTAM (ISO...
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 62433
Title: Models of Integrated Circuits for EMI behavioural simulation (IEC 47A/726/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN EN 61360 Beiblatt 1
Title: Standard data element types with associated classification scheme for electric components - Maintenance and validation procedures (German translation IEC 61360-3:1995)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 47C(Sec)37
Title: Optoelectronic semiconductor devices; blank detail specification for liquid cristal display cells (IEC 47C(Secretariat)37:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 60512-19-1
Title: Connectors for electronic equipment - Tests and measurements - Part 19-1: Chemical resistance tests - Test 19a: Fluid resistance of pre-insulated crimp barrels (IEC 48B/1864/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN EN 12626
Title: Laser processing machines - Safety requirements (ISO 11553:1996, modified)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 62215-2
Title: Integrated circuits - Measurement of impulse immunity - Part 2: Fast Impulse Injection method (IEC 47A/730/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 47C/229/CD
Title: Liquid crystal and solid-state display devices - Part 1: Generic specification (IEC 47C/229/CDV:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN EN 29318-3
Title: Information technology - Intelligent peripheral interface - Part 3: device generic command set for magnetic and optical disk drives (ISO/IEC 9318-3:1990); English version EN 29318-3:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN 19632
Title: Mechanical filters for drinking water installations; requirements, testing (DVGW code of practice)
Organization: DIN
Year: 1987
Status: Inactive
DIN IEC 48B/503/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Test 23c: Shielding effectiveness, from 10 kHz to 1000 MHz, of connectors with cables affixe...
Organization: DIN
Year: 1996
Status: Inactive
DIN 51079-2
Title: Testing of ceramic materials - Chemical analysis of silicon carbide used as raw material and as constituent in materials - Part 2: Pressure decomposition with acid
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 60917-2-3
Title: Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification; Interface co-ordination dimensions for the 25 mm equipment practice;...
Organization: DIN
Year: 2003
Status: Inactive
DIN EN 60749-5
Title: Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady state temperature humidity bias life test (IEC 47/1600/CDV:2002); German version prEN 60749-5:2002
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 61337-1
Title: Filters using waveguide type dielectric resonators of assessed quality - Part 1: Generic specification (IEC 49/583/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC CMC/463/CD
Title: Draft - Revised rules of procedure - Part 2: Documentation; clause 1: Standards and specifications for qualification approval and capability approval (IEC CMC/463/CD:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN EN ISP 10608-2
Title: Information technology; International Standardized Profile TAnnnn - connection-mode transport service over connectionless-mode network service - Part 2: TA51 profile including subnetwork-dependent ...
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 48B/829/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 3-1: Insulation tests; Test 3a: Insulation resistance (IEC 48B/829/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47E/43/CDV
Title: Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs) (IEC 47E/43/CDV:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 140101-806
Title: Detail specification: Fixed low power film resistors - Metal film resistors on high grade ceramic, conformal coated or molded, axial or preformed leads; German version prEN 140101-806:2006
Organization: DIN
Year: 2006
Status: Inactive
DIN ISO/IEC 8802-5
Title: Information technology - Local and Metropolitan Area Networks - Part 5: Token Ring access method and physical layer specifications; identical with ISO/IEC 8802-5:1995
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 60749-16
Title: Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND) test (IEC 47/1584/CDV:2001); German version prEN 60749-16:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 94/102/CD
Title: Electromechanical all-or-nothing telecom relays - Part 52: Blank detail specification; electromechanical all-or-nothing telecom relays of assessed quality; two change over contacts, 20 mm x 10 mm b...
Organization: DIN
Year: 1999
Status: Inactive
DIN EN ISP 11185-5
Title: Information technology - International standardized profiles FVT2nn - Virtual terminal basic class; register of control object type definitions - Part 5: FVT218; logical image control object; Engli...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 61076-3-108
Title: Connectors for electronic equipment - Detail specification for shielded rectangular connectors for universal serial bus plus power connectors, series B (IEC 48B/1210/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 28806-4
Title: Information technology - Computer graphics - Graphical kernel system for three dimensions (GKS-3D) language bindings - Part 4: C (ISO/IEC 8806-4:1991); German version EN 28806-4:1993
Organization: DIN
Year: 1994
Status: Inactive
DIN 66387-5
Title: Microprocessor systems - Futurebus+ - Part 5: Profile M (military) (ISO/IEC DIS 14536:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN EN 62246
Title: Generic specification - Reed contact units (IEC 94/124/CDV:2000); German version prEN 62246:2000
Organization: DIN
Year: 2001
Status: Inactive
DIN EN ISP 10612-9
Title: Information technology - International standardized profile RD; relaying the MAC service using transparent bridging - Part 9: Profile RD53.54 (Token Ring LAN - FDDI LAN) (ISO/IEC ISP 10612-9:1995);...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 61606-4
Title: Audio and audiovisual equipment - Digital audio parts - Basic measurements methods of audio characteristics - Part 4: Personal computer (IEC 100/733/NP:2003)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 47A/422/CD
Title: QML for integrated circuits - Guide 1: Demonstration vehicles (IEC 47A/422/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 61076-3-110
Title: Connectors for electronic equipment - Part 3-110: Rectangular connectors; Detail specification for 8-way, shielded, free and fixed connectors for data transmission with frequencies up to 600 MHz (I...
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 40/1088/CDV
Title: Amendment 2 to IEC 60384-8:1988: Fixed capacitors for use in electronic equipment - Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, class 1 (IEC 40/1088/CDV:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 65C/155/CDV
Title: Field bus standard for use in industrial control systems - Part 2: Physical layer specification and service definition (IEC 65C/155/CDV:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47A(Sec)324
Title: Integrated circuits - Configuration for semiconductor memory circuits (IEC 47A(Secretariat)324:1994)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 48B/869/CD
Title: Return loss test procedure for electrical connectors, sockets, cable assemblies or interconnection devices (IEC 48B/869/CD:2000)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47D/199/CD
Title: Semiconductor devices, mechanical standardization - SON (Small Outline Non-Leaded Packages), 0,50 mm pitch family (IEC 47D/199/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 52/569/CD
Title: IEC 61189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures (IEC 52/569/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN EN ISP 10608-13
Title: Information technology - International Standardized Profile TAnnnn; connection-mode transport service over connectionless-mode network service - Part 13: MAC sublayer and physical layer dependent r...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 61969-1
Title: Design guide outdoor enclosures (IEC 48D/178/CDV:1998); German version prEN 61969-1:1998
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 47D/195/CD
Title: Fin-pitch Ball-Grid-Array- and Land-Grid-Array 0,80 mm, 0,65 mm, 0,50 mm or 0,40 mm pitch family (IEC 47D/195/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN EN 60399
Title: Standard sheets for barrel thread for E14 and E27 lampholders with shade holder ring (IEC 60399:1972 + A1:1997 + A2:1999); German version EN 60399:1993 + A1:1997 + A2:1999
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 61076-2-105
Title: Connectors for electronic equipment - Part 2-105: Detail specification for circular connectors M5 with screw-locking for low voltage applications (IEC 48B/1601/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN CWA 14050-6
Title: Extensions for financial services (XFS) interface specification - Release 3.0 - Part 6: PIN keypad device class interface (English Version CWA 14050-6:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 60384-6
Title: Fixed capacitors for use in electronic equipment - Part 6: Sectional specification: Fixed metallized polycarbonate film dielectric d.c. capacitors (IEC 40/1416/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 62453-309
Title: Field device tool interface specification - Part 309: Communication profile integration - IEC 61784 CPF 9 (IEC 65C/445/CD:2006), text in English
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 61163-3
Title: Reliability stress screening - Part 3: Reliability screening of repairable single items (IEC 56/951/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 48D/143/CD
Title: Detail specification for cabinets - Outdoor enclosures (IEC 48D/143/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN CWA 13937-2
Title: J/eXtensions for Financial Service (J/XFS) for the Java Platform - Part 2: Pin Keypad Device Class Interface; Programmer's Reference
Organization: DIN
Year: 2000
Status: Inactive
DIN EN ISP 12061-5
Title: Information technology - Open Systems Interconnection - International standardized profiles: OSI distributed transaction processing - Part 5: Application supported transactions, polarized control (...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 62418
Title: Metallization stress void test (IEC 47/1963/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 60384-17
Title: Fixed capacitors for use in electronic equipment - Part 17: Sectional specification: Fixed metallized polypropylene film dielectric a.c. and pulse capacitors (IEC 40/1391/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 40(Sec)695
Title: Amendment to IEC 60384-4(1985); fixed capacitors for use in electronic equipment; part 4: sectional specification: aluminium electrolytic capacitors with solid and non-solid electrolyte (IEC 40(Sec...
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 40(Sec)697
Title: Amendment to IEC 60384-4-2(1985); fixed capacitors for use in electronic equipment; part 4: blank detail specification: aluminium electrolytic capacitors with solid electrolyte; assessment level E ...
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 62A/246/CD
Title: Graphical symbols for use on equipment - Amendment to IEC 60417 and revision (or new edition) of IEC 60878; graphical symbols for general use on medical equipment (IEC 62A/246/CD:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN ISO/IEC 8208
Title: Data communications - ITU-T X.25 packet layer protocol for data terminal equipment; Identical with ISO/IEC 8208:1995
Organization: DIN
Year: 1996
Status: Inactive
DIN CWA 14174-4
Title: Financial transactional IC card reader (FINREAD) - Part 4: Architectural overview; English version CWA 14174-4:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 29171-1
Title: Information technology; 130 mm optical disk cartridge, write once, for information interchange; part 1: unrecorded optical disk cartridge (ISO/IEC 9171-1:1990); English version EN 29171-1:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 60512-21-1
Title: Connectors for electronic equipment - Tests and measurements - Part 21-1: R.F. resistance tests - Test 21a: R.F. shunt resistance (IEC 48B/1867/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 60384-4
Title: Fixed capacitors for use in electronic equipment - Part 4: Sectional specification - Aluminium electrolytic capacitors with solid (MnO2) and non-solid electrolyte (IEC 40/1610/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN ETS 300147
Title: Transmission and Multiplexing (TM) - Synchronous Digital Hierarchy (SDH) - Multiplexing structure; English version ETS 300147:1997
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 52/575/CD
Title: Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements; attachment (Land/joint) considerations; section 4: Components with J leads on two side...
Organization: DIN
Year: 1996
Status: Inactive
DIN 66388
Title: Information technology; standard control and status register architecture for microcomputer buses (CSR architecture); identical with ISO/IEC DIS 13213:1992
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 47E/38/CDV-I
Title: Draft IEC 60747-6: Semiconductor devices - Discrete devices and integrated circuits - Part 6: Thyristors (IEC 47E/38/CDV-I:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN EN ISP 10613-1
Title: Information technology - International Standardized Profile RA; relaying the connectionless-mode network service - Part 1: Subnetwork-independent requirements (ISO/IEC ISP 10613-1:1994); English ve...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 40(Sec)677
Title: Fixed capacitors for radio interference suppression; subclause 4.18: active flammability test; identical with IEC 40(Secretariat)677:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 61337-2
Title: Filters using waveguide type dielectric resonators - Part 2: Guide to the use (IEC 49/544/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN EN ISO/IEC 9945-2
Title: Information technology - Portable Operating System Interface (POSIX) - Part 2: Shell and utilities (ISO/IEC 9945-2:1993); English version EN ISO/IEC 9945-2:1995
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 65C/245/CD
Title: Digital data communication for measurement and control - Fieldbus for use in industrial control systems - Part 2: Physical layer specification and service definition; Edition 3 (IEC 65C/245/CD:2000...
Organization: DIN
Year: 2000
Status: Inactive
DIN EN 60191-2-52
Title: Mechanical standardization for semiconductor devices - Plastic enhanced thin profile quad flatpack (HTQFP) - Outline family, heat slug down (IEC 47D/408/CDV:2001); German version prEN 60191-2-52:2001
Organization: DIN
Year: 2001
Status: Inactive
DIN EN 61076-3-104
Title: Connectors with assessed quality for use in d.c., low frequency analogue and in digital high speed data applications - Part 3-104: 8 way connectors for frequencies up to 600 MHz (Category 7 Detail ...
Organization: DIN
Year: 2001
Status: Inactive
DIN EN 61188-5-3
Title: Printed boards and printed board assemblies - design and use - Part 5-3: Sectional requirements - attachment (land/joint) considerations - components with gull-wing leads on two sides (IEC 91/463/C...
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 47C(Sec)35
Title: Optoelectronic semiconductor devices; blank detail specification (BDS) for liquid cristal display (LCD) modules (IEC 47C(Secretariat)35:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 1/1684/CD-445
Title: International Electrotechnical Vocabulary - Chapter 445: Specified time all-or-nothing relays (Revision of IEV Chapter 446: Electrical relays) (IEC 1/1684/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 60512-14-6
Title: Connectors for electronic equipment - Basic testing and measurements: Part 14-6: Test 14f: Immersion-low (air) pressure-interfacial (IEC 48B/1270/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 65C/177/CDV
Title: Fieldbus Standard for use in industrial control systems - Part 1: Introductory guide (IEC 65C/177/CDV:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 47D/81/CD
Title: Semiconductor devices, mechanical standardization - Wire-ended diode package (small signal diode) (modification of A54) and power package outline (IEC 47D/81/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47E/27/CDV
Title: Semiconductor devices - Discrete devices - Blank detail specification for microwave field-effect transistors (IEC 47E/27/CDV:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 60191-6
Title: Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 47D/392/CDV:2000); German v...
Organization: DIN
Year: 2001
Status: Inactive
DIN EN ISP 12061-2
Title: Information technology - Open Systems Interconnection - International standardized profiles: OSI distributed transaction processing - Part 2: Support of OSI TP APDUs (ISO/IEC ISP 12061-2:1995); Eng...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 61883-8
Title: Consumer audio/video equipment - Digital interface - Part 8: Transmission of ITU-R BT.601 style digital video data (IEC 100/1342/CDV:2008); German version FprEN 61883-8:2008
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 61249-2-26
Title: Materials for interconnection structures - Part 2-26: Sectional specification set for reinforced base materials, clad and unclad; Section 26: Non-halogenated epoxide non-woven/woven E-glass reinfor...
Organization: DIN
Year: 2003
Status: Inactive
DIN EN 61967-5
Title: Integrated circuits - Measurement of electromagnetic emissions 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions, workbench Faraday cage method (IEC 47A/567A/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 40(Sec)643
Title: Complete filter units for radio interference suppression; part 2: sectional specification: selection for methods of test and general requirements; amendment to IEC 60939-2:1988; identical with IEC ...
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 61158-6
Title: Digital data communication for measurement and control - Fieldbus for use in industrial control systems - Part 6: Application Layer Protocol specification (IEC 65C/266/CDV:2001, text in English)
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 62326-1
Title: Printed boards - Part 1: Generic specification (IEC 52/792/CDV:1998); German version prEN 62326-1:1998
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 60384-4-1
Title: Fixed capacitors for use in electronic equipment - Part 4-1: Blank detail specification - Fixed aluminium electrolytic capacitors with non-solid electrolyte - Assessment level EZ (IEC 40/1611/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 60748-2-20
Title: Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits (IEC 47A/755/CD:2006)
Organization: DIN
Year: 2006
Status: Inactive
DIN EN 29318-2
Title: Information technology - Intelligent peripheral interface - Part 2: device specific command set for magnetic disk drives (ISO/IEC 9318-2:1990); English version EN 29318-2:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN EN 61249-2-37
Title: Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined...
Organization: DIN
Year: 2007
Status: Inactive
DIN EN ISP 12061-1
Title: Information technology - Open Systems Interconnection - International standardized profiles: OSI distributed transaction processing - Part 1: Introduction to the transaction processing profiles (IS...
Organization: DIN
Year: 1996
Status: Inactive
DIN EN ISP 10607-3
Title: Information technology - International Standardized Profiles AFTnn; file transfer, access and management - Part 3: AFT11, simple file transfer service (unstructured) (regional variant of ISO/IEC IS...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 61988-2-2
Title: Plasma display panels - Part 2-2: Measuring methods (II) (IEC 47C/260/CD:2001)
Organization: DIN
Year: 2002
Status: Inactive
DIN 50454-2
Title: Determining etch pit density in single crystals of III-V compound semiconductors
Organization: DIN
Year: 1994
Status: Inactive
DIN EN 60749-27
Title: Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM) (IEC 47/1804/CDV:2005); German version prEN 60749-27:2005
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 60050-521
Title: International Electrotechnical Vocabulary - Chapter 521: Semiconductor devices and integrated circuits (IEC 60050-521:1984 and IEC 1/1775/CDV:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 60512-12-4
Title: Connectors for electronic equipment - Basic testing and measurements: Part 12-4: Test 12d: Resistance to soldering heat, solder bath method (IEC 48B/1262/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN EN ISP 12062-1
Title: Information technology - International Standardized Profiles AMH2n, message handling systems, interpersonal messaging - Part 1: IPM MHS service support (ISO/IEC ISP 12062-1:1995); English version E...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 48B/742/CD
Title: Connectors with assessed quality, for use in d.c., low frequency analogue and in digital high speed data applications - Part 2: Circular connectors; Section 001: Blank detail specification (IEC 48B...
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 34A/681/CDV
Title: Double capped fluorescent lamps - Performance specifications; Amendment 1 to IEC 60081, edition 5 (IEC 34A/681/CDV:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN EN 140401-801
Title: Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1; German version prEN 140401-801:2006
Organization: DIN
Year: 2007
Status: Inactive
DIN CWA 13937-4
Title: J/eXtensions for Financial Service (J/XFS) for the Java Platform - Part 4: Text Input/Output Device Interface; Programmer's Reference
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 62137-1-3
Title: Surface-mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test (IEC 91/614/CD:2006)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 34A/784/CD
Title: Double capped fluorescent lamps - Performance specifications; Amendment 2 to IEC 60081, 5nd edition (IEC 34A/784/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 40/1171/CD
Title: Fixed resistors for use in electronic equipment - Part 9: Sectional specification: Fixed surface mount resistor networks with individually measurable resistors (IEC 40/1171/CD:2000)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 40(Sec)698
Title: Fixed capacitors for use in electronic equipment; sectional specification: fixed metallized polyphenylene sulfide-film dielectric d.c. chip capacitors; identical with IEC 40(Secretariat)698:1994
Organization: DIN
Year: 1994
Status: Inactive
DIN EN 60901
Title: Single-capped fluorescent lamps - Performance specifications (IEC 60901:1996 + A1:1997 + A2:2000); German version EN 60901:1996 + A1:1997 + A2:2000
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 61967-3
Title: Integrated circuits - Measurement of electromagnetic emissions; 150 kHz to 1 GHz - Part 3: Measurement of radiated emissions - Surface scan method (IEC 47A/674/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 60384-2-1
Title: Fixed capacitors for use in electronic equipment - Part 2-1: Blank detail specification - Fixed metallized polyethylene-terephthalate film dielectric d.c. capacitors - Assessment levels E and EZ (I...
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 40(CO)759
Title: Fixed resistors for use in electronic equipment; blank detail specification: fixed power resistors, heat-sink types; assessment level H; identical with IEC 40(Central Office)759
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 49/419/CD
Title: IEC 61994-4-1: Glossary for piezoelectric and dielectric devices for frequency control and selection - Part 4-1: Piezoelectric materials; Glossary for synthetic quartz crystal (IEC 49/419/CD:1998)
Organization: DIN
Year: 1998
Status: Inactive
VDI/VDE 3689 Blatt 1
Title: PROFIBUS-Profil; Drehzahlveraenderbare Antriebe
Organization: VDI
Year: 1994
Status: Inactive
DIN IEC 60747-8-12
Title: Semiconductor devices - Discrete devices - Part 8-12: Metal-oxide-semiconductor field-effect transistors (MOSFETs) for power switching applications (IEC 47E/199/CD:2001)
Organization: DIN
Year: 2001
Status: Inactive
DIN 44434-3
Title: Base 13-17 for tubes and valves - Pin straightening tool
Organization: DIN
Status: Inactive
DIN 72601-333
Title: Lamps for road vehicles - Part 333: Auxiliary lamp
Organization: DIN
Year: 1998
Status: Inactive
DIN 49865-2
Title: Ballasts for fluorescent lamps; uncorrected power factor type for 220 V, 50 Hz, for mounting in luminaires
Organization: DIN
Year: 1975
Status: Inactive
DIN V ENV 12661
Title: Geographic information - Referencing - Geographic identifiers; German version ENV 12661:1998
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 48B/763/CD
Title: Solderless connections - Part 7: Spring clamps connections; general requirements, test methods and practical guidance (IEC 48B/763/CD:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN EN 61188-5-5
Title: Printed board and printed board assemblies - Design and use - Part 5-5: Sectional requirements - Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 91/465/C...
Organization: DIN
Year: 2004
Status: Inactive
DIN EN ISP 10611-1
Title: Information technology, International Standardized Profiles AMH1n - Message Handling Systems; common messaging - Part 1: MHS service support (ISO/IEC ISP 10611-1:1994); English version EN ISP 10611...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 52(Sec)476
Title: IEC 61189-3: Test methods for interconnection structures (Printed boards) - Test E07: Controlled impedance testing by Time Domain Reflectometry (TDR) (IEC 52(Secretariat)476:1994)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 91(Sec)28
Title: Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies; identical with IEC 91(Secretariat)28:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 62149-2
Title: Fibre optic active components and devices - Performance standards - Part 2:850 nm discrete vertical cavity surface emitting laser devices (IEC 86C/767/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN 66387
Title: Microprocessor systems; futurebus+; logical layer specifications; identical with ISO/IEC DIS 10857:1992
Organization: DIN
Year: 1992
Status: Inactive
DIN EN ISP 11185-1
Title: Information technology - International standardized profiles FVT2nn - Virtual terminal basic class; register of control object type definitions - Part 1: FVT211, FVT212; sequenced and unsequenced a...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 60747-7-5
Title: Semiconductor devices - Discrete devices - Part 7-5: Bipolar transistors (BTRs) for power switching applications (IEC 47E/234/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 61076-3-105
Title: Connectors for electronic equipment - Part 3-105: Detail specification for 4 pair balanced, individually shielded, fixed and free connectors with a characteristic impedance of 100 ohms, covering a ...
Organization: DIN
Year: 2003
Status: Inactive
DIN EN ISP 10613-9
Title: Information technology - International Standardized Profile RA; relaying the connectionless-mode network service - Part 9: Definition of profile RA51.1121, relaying the connectionless-mode network ...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47D/113/CD
Title: Semiconductor devices, mechanical standardization - Proposal for a plastic thin small package P-TSOP II, 7,62 mm body family (if approved to be included in IEC 60191-2) (IEC 47D/113/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47D/105/CD
Title: Semiconductor devices, mechanical standardization - Proposal for a plastic small outline package J-lead (P-SOJ), 10,16 mm body-family (IEC 47D/105/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47(Sec)1312
Title: Semiconductor devices; additional concepts for field-effect transistors; identical with IEC 47(Secretariat)1312:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN EN ISP 10612-1
Title: Information technology - International Standardized Profile RD, Relaying the MAC service using transparent bridging - Part 1: Subnetwork-independent requirements (ISO/IEC ISP 10612-1:1995); English...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60384-23
Title: Fixed capacitors for use in electronic equipment - Part 23: Sectional specification; Fixed metallized polyethylene naphthalate film dielectric d.c. chip capacitors (IEC 40/1231/NP:2001)
Organization: DIN
Year: 2002
Status: Inactive
DIN EN ISO/IEC 8651-4
Title: Information technology - Computer graphics - Graphical Kernel System (GKS) language bindings - Part 4: C (ISO/IEC 8651-4:1995); English version EN ISO/IEC 8651-4:1996
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60297-3-105
Title: Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19in) series - Part 3-105: Dimensions and design aspects for 1U chassis (IEC 48D/354/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN EN 27816-2
Title: Identification cards; integrated circuit(s) with contacts; part 2: dimensions and location of the contacts (ISO 7816-2:1988); english version EN 27816-2:1989
Organization: DIN
Year: 1992
Status: Inactive
DIN 66376-7
Title: Information technology - Fibre Distributed Data Interface (FDDI) - Part 7: Physical Layer Protocol-2 (PHY-2) (ISO/IEC CD 9314-7:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 47E/166/CDV
Title: Terminology, essential ratings and characteristics, and measuring methods for integrated circuit microwave frequency converters (IEC 47E/166/CDV:2000)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 15D/47/CD
Title: Specification for the protection of electronic devices - Part y: General requirements (IEC 15D/47/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47E(Sec)5
Title: Semiconductor devices; supplement to IEC 60747-7: bipolar transistors, pulse methods for collector-base cutt-off current and emitter-base cutt-off current (IEC 47E(Secretariat)5:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 60384-16
Title: Fixed capacitors for use in electronic equipment - Part 16: Sectional specification - Fixed metallized polypropylene film dielectric d.c. capacitors (IEC 40/1389/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN EN ISP 12062-3
Title: Information technology - International Standardized Profiles AMH2n, message handling systems, interpersonal messaging - Part 3: AMH22 - IPM requirements for message transfer (P1) (ISO/IEC ISP 12062...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47D(Sec)1
Title: Semiconductor devices, mechanical standardization; proposal for a SMD-diode outline; identical with IEC 47D(Secretariat)1
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 49/327/CD
Title: Piezoelectric filters - A specification in the IEC quality assessement system for electronic components (IECQ) - Generic specification (capability approval) (IEC 49/327/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 34A/830/CD
Title: Tungsten halogen lamps (non-vehicle); Amendment to IEC 60357 (IEC 34A/830/CD:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 47(Sec)1318
Title: Semiconductor devices; amendment to IEC 60747-11: sectional specification for discrete semiconductor devices (IEC 47(Secretariat)1318:1993)
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 48D/90/CD
Title: Seismic tests for cabinets and racks (IEC 48D/90/CD:1995)
Organization: DIN
Year: 1995
Status: Inactive
DIN CWA 14051-2
Title: Information technology - European generic locales - Part 2: Narrative cultural specifications, POSIX locales, and repertoiremap (English version CWA 14051-2:2001)
Organization: DIN
Year: 2001
Status: Inactive
DIN EN ISP 11188-1
Title: Information technology - International Standardized Profil - Common upper layer requirements - Part 1: Basic connection oriented requirements; English version EN ISP 11188-1:1996
Organization: DIN
Year: 1997
Status: Inactive
DIN EN ISP 10613-2
Title: Information technology - International Standardized Profile RA; relaying the connectionless-mode network service - Part 2: LAN subnetwork-dependent, media-independent requirements (ISO/IEC ISP 1061...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60384-3
Title: Fixed capacitors for use in electronic equipment - Part 3: Sectional specification: Fixed surface mount tantalum capacitors (IEC 40/1449/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN EN 61249-4-14
Title: Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E...
Organization: DIN
Year: 2007
Status: Inactive
DIN 50992-1
Title: Coating tickness measurement and characterization of surfaces using surface acoustic waves - Part 1: Determination of elastic constants, density and thickness of coatings using laser-induced surfac...
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 47A(Sec)356
Title: Semiconductor devices, integrated circuits - Part 5: Semicustom integrated circuits (IEC 47A(Sec)356:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN EN 30202-1
Title: Financial transaction cards; security architecture of financial transaction systems using integrated circuit cards; part 1: card life cycle (ISO 10202-1:1991); German version EN 30202-1:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN CWA 14536
Title: Functional specification of an open multimodal tracking & tracing system; English version CWA 14536:2002
Organization: DIN
Year: 2002
Status: Inactive
DIN EN 28632-2
Title: Information technology - Computer graphics; metafile for the storage and transfer of picture description information - Part 2: Character encoding (ISO/IEC 8632-2:1992); English version EN 28632-2:1994
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 62008
Title: Performance characteristcs and calibration methods for digital data acquisition systems and relevant software (IEC 85/231/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN EN 61747-5-3
Title: Liquid crystal display devices - Part 5-3: Glass strength and reliability measurement method (IEC 110/117/CDV:2007); German version prEN 61747-5-3:2007
Organization: DIN
Year: 2007
Status: Inactive
DIN EN 62328-1
Title: Multimedia home server systems - Interchangeable volume/file structure adaptation for broadcasting receivers - Part 1: General description and architecture (IEC 100/800/CDV:2004); German version pr...
Organization: DIN
Year: 2005
Status: Inactive
DIN EN ISP 11185-11
Title: Information technology - International Standardized Profiles FVT2nn - Virtual Terminal Basic Class; register of control object type definitions - Part 11: FVT232; FEPCO (Field Entry Pilot Control O...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 62391-2
Title: Fixed electric double layer capacitors for use in electronic equipment - Part 2: Sectional specification: Electric double layer capacitors for power application (IEC 40/1379/CD:2003)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 52/674/CD
Title: IEC 62326-2: Printed boards - Part 2: Rigid single and double-sided printed boards without interlayer connections; sectional specification (IEC 52/674/CD:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN EN 61158-3
Title: Digital data communication for measurement and control - Fieldbus for use in industrial control systems - Part 3: Data link service definition (IEC 61158-3:2003); English version EN 61158-3:2004
Organization: DIN
Year: 2005
Status: Inactive
DIN EN ISP 11185-8
Title: Information technology - International standardized profiles FVT2nn - Virtual terminal basic class; register of control object type definitions - Part 8: FVT221; forms FEICO (Field Entry Instructio...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 60512-12-3
Title: Connectors for electronic equipment - Basic testing and measurements: Part 12-3: Test 12c: Solderability, de-wetting (IEC 48B/1261/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN CWA 14174-5
Title: Financial transactional IC card reader (FINREAD) - Part 5: Download file format; English version CWA 14174-5:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 62258-6
Title: Semiconductor die products - Part 6: Requirements for information concerning thermal simulation (IEC 47/1808/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 61193-2
Title: Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages (IEC 91/509/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN CWA 13937-6
Title: J/eXtensions for Financial Service (J/XFS) for the Java Platform - Part 6: Printer Device Class Interface; Programmer's Reference
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 48B/822/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 1-1: General examination; Test 1a: Visual examination (IEC 48B/822/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 60384-20
Title: Fixed capacitors for use in electronic equipment - Part 20: Sectional specification: Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors (IEC 40/1767/CD:2006)
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 40(CO)701
Title: Potentiometers; sectional specification: single-turn rotary low-power wirewound and non-wirewound potentiometers; selection of test and general requirements; adaptation of the standard to the requi...
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 61014
Title: Programmes for reliability growth (IEC 56/743/CD:2001); text in English
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 40(CO)703
Title: Potentiometers for use in electronic equipment; blank detail specification; single-turn rotary low-power potentiometers; assessment level F; identical with IEC 40(Central Office)703
Organization: DIN
Year: 1991
Status: Inactive
DIN IEC 48B/779/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 25: Section 1: Crosstalk ratio test procedure (CEI 48B/779/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN EN ISP 10613-8
Title: Information technology - International Standardized Profile RA; relaying the connectionless-mode network service - Part 8: Definition of profile RA51.1111, relaying the connectionless-mode network ...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47E/28/CD
Title: Semiconductor devices - Discrete devices - Measuring methods of integrated circuit microwave amplifiers (IEC 47E/28/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN EN ISP 12063-1
Title: Information technology - International standardized profiles AMH3n - Message handling systems, EDI messaging - Part 1: EDIMG MHS service support (ISO/IEC ISP 12063-1:1995); English version EN ISP 1...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47D/256/CDV
Title: Semiconductor devices, mechanical standardization - Tape ball grid array 0,75 mm ball diameter family (IEC 47D/256/CDV:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN EN 50279
Title: Visual display units - Measuring methods for low frequency electric and magnetic fields; German version prEN 50279:1997
Organization: DIN
Year: 1998
Status: Inactive
DIN CWA 13937-1
Title: J/eXtensions for Financial Services (J/XFS) for the Java Platform - Part 1: Base Architecture; Programmer's Reference
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 91(Sec)27
Title: Test methods for soldering of surface mounting devices (SMDs); identical with IEC 91(Secretariat)27:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 60512-16-11
Title: Connectors for electronic equipment - Tests and measurements - Part 16-11: Mechanical tests on contacts and terminations - Test 16k: Stripping force, solderless wrapped connections (IEC 48B/1570/CD...
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 60749-20-1
Title: Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling, shipping and use of moisture/reflow sensitive surface mount devices (IEC 47/1775/CD:2004)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 62391-2
Title: Fixed electric double layer capacitors for use in electronic equipment - Part 2: Sectional specification: Electric double layer capacitors for power application (IEC 40/1379/CD:2003)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 56/486/CD
Title: IEC 60300-3-7: Dependability management - Part 3: Application guide; section 7: Reliability stress screening of electronic hardware (IEC 56/486/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 49/401/CD
Title: IEC 60679-3: Quartz crystal controlled oscillators - Part 3: Standard outlines and lead connections (IEC 49/401/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN 66387
Title: Microprocessor systems; futurebus+; logical layer specifications; identical with ISO/IEC DIS 10857:1992
Organization: DIN
Year: 1992
Status: Inactive
DIN 41814-2
Title: Cases for semiconductor devices; cases type 160 to 168, main dimensions
Organization: DIN
Year: 1976
Status: Inactive
DIN 50454-2
Title: Testing of materials for semiconductor technology - Determination of the dislocation etch pits density in monocrystals of III-V-compound semiconductors - Part 2: Indium phosphide
Organization: DIN
Year: 1994
Status: Inactive
DIN EN 123100-800
Title: Capability Detail Specification: single and double sided printed boards with plain holes; german version EN 123100-800:1992
Organization: DIN
Year: 1992
Status: Inactive
DIN EN ISP 10612-9
Title: Information technology - International standardized profile RD; relaying the MAC service using transparent bridging - Part 9: Profile RD53.54 (Token Ring LAN - FDDI LAN) (ISO/IEC ISP 10612-9:1995);...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60512-14-4
Title: Connectors for electronic equipment - Basic testing and measurements: Part 14-4: Test 14d: Immersion-waterproof (IEC 48B/1268/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 47A(Sec)288
Title: Integrated circuits; blank detail specification for integrated dynamic read-/write memories; identical with IEC 47A(Secretariat)288:1992
Organization: DIN
Year: 1992
Status: Inactive
DIN EN 61747-4-2
Title: Liquid crystal and solid-state display devices - Part 4-2: Matrix colour LCD modules; Essential rating and characteristics (IEC 47C/298/CDV:2003); German version prEN 61747-4-2:2003
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 3A/467/CD
Title: Graphical symbols for diagrams - New symbols for gas zone diagrams (IEC 3A/467/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN V 45688-1
Title: Criteria for accrediation and operation of testing laboratories and consulting companies in the field of sound and vibration - Part 1: General
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 47D/53/CD
Title: Pin 1 mark for identification in automatic handling systems (IEC 47D/53/CD:1994)
Organization: DIN
Year: 1995
Status: Inactive
DIN 45921-402
Title: Harmonized system of quality assessment for electronic components - Detail specification for fixed low power non-wirewound resistors - Chip resistors, high stability with low temperature coefficien...
Organization: DIN
Year: 1992
Status: Inactive
DIN EN ISP 10608-2
Title: Information technology; International Standardized Profile TAnnnn - connection-mode transport service over connectionless-mode network service - Part 2: TA51 profile including subnetwork-dependent ...
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 47A(Sec)324
Title: Integrated circuits - Configuration for semiconductor memory circuits (IEC 47A(Secretariat)324:1994)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 47D/255/CDV
Title: Semiconductor devices, mechanical standardization - Common package unit design guide for packages with gull-wing lead (IEC 47D/255/CDV:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN 49656-3
Title: Lampholder; lampholder G13 for surface mounting
Organization: DIN
Year: 1983
Status: Inactive
DIN EN 50170/1
Title: General purpose field communication system; English version EN 50170:1996 Volume 1/3 P-NET
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 39/239/CD
Title: Preparation of outline drawings for cathode ray tubes, their components, connection and gauges (IEC 39/239/CD:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 60384-23-1
Title: Fixed capacitors for use in electronic equipment - Part 23-1: Blank detail specification; Fixed metallized polyethylene naphthalate film dielectric d.c. chip capacitors, assessment level EZ (IEC 40...
Organization: DIN
Year: 2002
Status: Inactive
DIN CWA 14050-15
Title: Extensions for Financial Services (XFS) interface specification - Release 3.0 - Part 15: Cash in module device class interface (English Version CWA 14050-15:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 47A(CO)171
Title: Semiconductors devices; interface circuits; preferred nominal voltages for recommended operating conditions; identical with IEC 47A(Central Office)171
Organization: DIN
Year: 1988
Status: Inactive
DIN IEC 40/1183/CD
Title: Potentiometers for use in electronic equipment - Part 6-1: Blank detail specification: Surface mount preset potentiometers; Assessment level E (IEC 40/1183/CD:2000)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 47E/84/CD
Title: Integrated circuit microwave frequency prescalers (IEC 47E/84/CD:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 60384-22-1
Title: Fixed capacitors for use in electronic equipment - Part 22-1: Blank detail specification: Fixed surface mount multilayer capacitors of ceramic dielectric, class 2; Assessment level EZ (IEC 40/1226/...
Organization: DIN
Year: 2001
Status: Inactive
DIN EN ISP 10612-6
Title: Information technology - International standardized profile RD; relaying the MAC service using transparent bridging - Part 6: Profile RD54.54 (FDDI LAN - FDDI LAN) (ISO/IEC ISP 10612-6:1995); Engli...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 61188-5-8
Title: Printed board and printed board assemblies - Design and use - Part 5-8 : Sectional Requirement - Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 91/416/CD:...
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 47E/121/CDV
Title: Semiconductor devices - Discrete devices - Hall elements (IEC 47E/121/CDV:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 52/576/CD
Title: Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements; attachment (Land/joint) considerations; section 5: Components with Gull-wing leads on ...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 3D/64/CD
Title: Standard data element types with associated classification scheme for electronic components - Part 1: Definitions; principles and methods (IEC 3D/64/CD:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 91/159/CD
Title: IEC 61192-3: Printed board assemblies - Part 3: Sectional specification: Workmanship requirements for through-hole mount soldered assemblies (IEC 91/159/CD:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 60603-7-1
Title: Connectors for electronic equipment - Part 7-1: Detail specification for 8-way, shielded, free and fixed connectors (IEC 48B/1698/CD:2006)
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 61190-1-3
Title: Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non fluxed solid solder for electronic soldering applications (IEC 91/521/CD:...
Organization: DIN
Year: 2005
Status: Inactive
DIN EN 61249-2-1
Title: Materials for printed boards and other interconnection structures - Part 2-1: Sectional specification set for reinforced base materials, clad and unclad; Phenolic cellulose paper reinforced laminat...
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 61249-4-5
Title: Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Polyimide, modifi...
Organization: DIN
Year: 2003
Status: Inactive
DIN EN 61158-5
Title: Digital data communication for measurement and control - Fieldbus for use in industrial control systems - Part 5: Application layer service definition (IEC 61158-5:2003 + corrigendum 2004); English...
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 60748-4-3
Title: Semiconductors devices - Integrated circuits - Part 4-3: Interface integrated circuits; Dynamic criteria for Analogue-Digital Converters (ADC) (IEC 47A/667/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN ISO/IEC 8882-3
Title: Data communication - X.25 DTE conformance testing - Packet layer conformance test suite; identical with ISO/IEC 8882-3:1995 (status as of 1997-04)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 60747-16-4
Title: Discrete semiconductor devices - Part 16-4: Terminology, essential ratings and characteristics, and measuring methods for integrated circuit microwave switches (IEC 47E/185/CD:2001)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 48B/828/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 2-6: Electrical continuity and contact resistance tests; Tests 2f: Housing (shell) elec...
Organization: DIN
Year: 2000
Status: Inactive
DIN 50431
Title: Testing of semiconductor materials; measurement of the resistivity of silicon or germanium single crystals by means of the four probe/direct current method with collinear array
Organization: DIN
Year: 1988
Status: Inactive
DIN IEC 60512-16-9
Title: Connectors for electronic equipment - Tests and measurements - Part 16-9: Mechanical tests on contacts and terminations - Test 16i: Grounding contact spring holding force (IEC 48B/1569/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 62132-5
Title: Integrated circuits - Measurement of electromagnetic immunity - Part 5: Measurement of conducted immunity; Workbench faraday cage method (IEC 47A/631/CD:2001)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 48B/488/CD
Title: Amendment to IEC 60603-7: Detail specification for 8 way connectors, with assessed quality, including fixed and free connectors with common mating features - Test methods and related requirements f...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 48B/705/CD
Title: Connectors with assessed quality, for use in d.c. and low-frequency analogue applications and in digital applications with high-speed data rates - Part 4: Printed board connectors; section xxx: Det...
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 48B/704/CD
Title: Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 4: Printed board conectors; Section 100: Detail specification for two-pa...
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 60862-1
Title: Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification (IEC 49/485/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 61190-1-2
Title: Attachment materials for electronic assembly - Part 1-2 : Requirements for soldering paste for high-quality interconnects in electronics assembly (IEC 91/520/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 60399/A1
Title: Standard sheets for barrel thread for E14 and E27 lampholders with shade holder ring; Amendment 1 to IEC 60399, Edition 1.2 (IEC 34B/1108/CD:2003)
Organization: DIN
Year: 2004
Status: Inactive
DIN EN ISP 12061-10
Title: Information technology - Open Systems Interconnection - International standardized profiles: OSI distributed transaction processing - Part 10: Provider supported chained transactions, shared contro...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47C(Sec)26
Title: Optoelectronic semiconductor devices; blank detail specification for optocouplers with output transistor (IEC 47C(Secretariat)26:1993)
Organization: DIN
Year: 1993
Status: Inactive
DIN EN 61249-4-1
Title: Materials for interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined ...
Organization: DIN
Year: 2006
Status: Inactive
DIN EN ISP 10608-4
Title: Information technology - International Standardized Profile TAnnnn; connection-mode transport service over connectionless-mode network service - Part 4: Definition of profile TA53 operation over a ...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 48B/386/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Test 6e: Random vibration (IEC 48B/386/CD:1995)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 95/58/CD
Title: Electrical relays - Common format for transient data exchange for power systems (COMTRADE) (IEC 95/58/CD:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 48B/831/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 4-2: Voltages stress tests; tests 4b: Partial discharge (IEC 48B/831/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN ETS 300462-5
Title: Transmission and Multiplexing (TM) - Generic requirements for synchronization networks - Part 5: Timing characteristics of slave clocks suitable for operation in Synchronous Digital Hierarchy (SDH)...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 65C/191/CD
Title: Fieldbus standard for use in industrial control systems - Part 7: Network and system management, clause 2 (IEC 65C/191/CD:1998)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 48B/490/CD
Title: Detail specification for a two-part connector with assessed quality, for a basic grid of 2,0 mm, with free connectors for non-accessible insulation displacment termination (IEC 48B/490/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 60738-1-1
Title: Thermistors - Directly heated positive step-function temperature coefficient - Part 1-1: Blank detail specification - Current limiting application - Assessment level EZ (IEC 40/1829/CDV:2007); Germ...
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 48B/736/CD
Title: Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high speed data and bus applications - Part 4: Printed board connectors; Section 113: Detail specification f...
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 60384-4-2
Title: Fixed capacitors for use in electronic equipment - Part 4-2: Blank detail specification: Fixed aluminium electrolytic capacitors with solid (MnO2) electrolyte - Assessment level EZ (IEC 40/1612/CD:...
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 47D/331/CDV
Title: Semiconductor devices, mechanical standardization - QFN-outline drawings to the outline family 119E (IEC 47D/331/CDV:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 48B/780/CD
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 25: Section 3: Rise time degradation test procedure (IEC 48B/780/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN CWA 14174-8
Title: Financial transactional IC card reader (FINREAD) - Part 8: FINREAD client application programming interfaces (APIs); English version CWA 14174-8:2001
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 60512-16-18
Title: Connectors for electronic equipment - Tests and measurements - Part 16-18: Mechanical tests on contacts and terminations - Test 16r: Deflection of male contacts in a connector insert by simulation ...
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 48B(Sec)206/A1
Title: Detail specification for two-part connectors for printed boards, grid of 2,54 mm (0,1 in); common mounting features; amendment 1 to draft standard DIN IEC 48B(Secretariat)206
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 47D/82/CD
Title: Semiconductor devices, mechanical standardization - Pin 1 mark and lead-numbering convention for dual-in-line packages with standard and reverse-bendlead form (IEC 47D/82/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 94/105/CD
Title: Electromechanical all-or-nothing telecom relays - Part 55: Blank detail specification; electromechanical all-or-nothing telecom relays of assessed quality; 4. generation, two change over contacts, ...
Organization: DIN
Year: 1999
Status: Inactive
DIN EN 50346/A2
Title: Information technology - Cabling installation - Testing of installed cabling; German version EN 50346:2002/FprA2:2008
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 52/643/CD
Title: Amendment 1 to IEC 61189-1: Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology (IEC 52/643/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47A(Sec)288
Title: Integrated circuits; blank detail specification for integrated dynamic read-/write memories; identical with IEC 47A(Secretariat)288:1992
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 49/335/CD
Title: Filters using waveguide type dielectric resonators - Part 1: General information, standard values and test conditions; Section 2: Test conditions (IEC 49/335/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60915
Title: Preferred dimensions of shaft ends, bushes and for the mounting of single-hole, bush-mounted, shaft-operated electronic components (IEC 40/1592/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 65B/388/CDV
Title: IEC 62098: Evaluation methods for microprocessor-based instruments (IEC 65B/388/CDV:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 60512-9-5
Title: Connectors for electronic equipment - Tests and measurements - Part 9-5: Endurance tests - Test 9e: Current loading, cyclic (IEC 48B/1858/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN V ENV 1973
Title: Information technology - European subsets of ISO/IEC 10646-1; English version ENV 1973:1996
Organization: DIN
Year: 1996
Status: Inactive
DIN EN 61249-2-11
Title: Materials for printed boards and other interconnecion structures - Part 2-11: Sectional specification set for reinforced base materials, clad and unclad; Polyimide, brominated epoxide modified or u...
Organization: DIN
Year: 2002
Status: Inactive
DIN EN ISP 12070-1
Title: Information technology - International Standardized Profiles FCSnnn - Character set 8-bit code structure based on ISO/IEC 2022 - Part 1: FCS111 - 2022 option 1 (ISO/IEC ISP 12070-1:1996); German ve...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 60749-28
Title: Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing; Charged device model (CDM) (IEC 47/1658/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 60384-19
Title: Fixed capacitors for use in electronic equipment - Part 19: Sectional specification - Fixed metallized polyethylene-terephthalate film dielectric chip d.c. capacitors (IEC 40/1444/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN EN 140401-801/AA
Title: Detail Specification - Fixed low power non wire-wound surface mount (SMD) resistors - Rectangular; Stability classes 0,1; 0,25; 0,5; 1; Amendment AA; German version EN 140401-801:2002/prAA:2002
Organization: DIN
Year: 2002
Status: Inactive
DIN 66387-2
Title: Microprocessor systems - Futurebus+ - Physical layer and profile specification (ISO/IEC DIS 15057:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 62341-5
Title: Organic Light Emitting Diode Displays - Part 5: Environmental test methods (IEC 110/109/CD:2007)
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 62047-3
Title: Microelectromechanical devices - Part 3: Thin film standard test piece (IEC 47/1760/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 62150-3-3
Title: Basic standards for discrete/integrated optoelectronic semiconductor devices for fibre optic communications including hybrid devices - Performance standards - Part 3-3: Fibre optic transceivers; Pe...
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 94/23/CDV
Title: All-or-nothing electrical relays - Test and measurement procedures (IEC 94/23/CDV:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN CWA 13937-3
Title: J/eXtensions for Financial Service (J/XFS) for the Java Platform - Part 3: Magnetic Stripe & Chip Card Device Class Interface; Programmer's Reference
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 52/675/CD
Title: IEC 62326-2-1: Printed boards - Part 2: Rigid single and double-sided printed boards without interlayer connections; Section 1: Capability detail specification; performance level A, B und C (IEC 52...
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 60384-21-1
Title: Fixed capacitors for use in electronic equipment - Part 21-1: Blank detail specification: Fixed surface mount multilayer capacitors of ceramic dielectric, class 1; Assessment level EZ (IEC 40/1224/...
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 40/775/CD
Title: Amendment to IEC 60384-18-1: Fixed capacitors for use in electronic equipment - Part 18: Blank detail specification: Fixed aluminium electrolytic chip capacitors with solid electrolyte; assessment ...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47A/596/CD
Title: IEC 62113: Integrated circuits - Product discontinuance notification by suppliers and distributors (IEC 47A/596/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN EN 61967-4
Title: Integrated circuits - Measurement of electromagnetic emissions 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions 1 ohm/150 ohm; direct coupling method (IEC 47A/566/CD:1999)
Organization: DIN
Year: 2000
Status: Inactive
DIN EN ISO/IEC 11544
Title: Information technology - Coded representation of picture and audio information - Progressive bi-level image compression (ISO/IEC 11544:1993); English version EN ISO/IEC 11544:1995
Organization: DIN
Year: 1995
Status: Inactive
DIN 50457-1
Title: Determination of components in dopant gas mixtures used in semiconductor technology (wet chemical method) - Part 1: Diborante in hydrogen-diborane mixtures
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 40/1089/CDV
Title: Amendment 2 to IEC 60384-8-1:1988 - Fixed capacitors for use in electronic equipment; Part 8: Blank detail specification: Fixed capacitors of ceramic dielectric, class 1; assessment level E (IEC 40...
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 56/538/CD
Title: Presentation and specification of reliability data for electronic components (IEC 56/538/CD:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 62024-1
Title: High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor (IEC 51/881/CD:2006)
Organization: DIN
Year: 2007
Status: Inactive
DIN ISO/IEC 14575
Title: Microprocessor Systems - Standard for Heterogeneous InterConnect (HIC) (Low Cost Low Latency Scalable Serial Interconnect for Parallel Systeme Construction) (ISO/IEC CD 14575:1995)
Organization: DIN
Year: 1995
Status: Inactive
DIN EN 60603-7
Title: Connectors for electronic equipment - Part 7: Detail specification for 8-way, unshielded, free and fixed connectors (IEC 48B/1746/CDV:2007); German version prEN 60603-7:2007
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 47D/362/CD
Title: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Standard overall package height; Ame...
Organization: DIN
Year: 2000
Status: Inactive
DIN EN 175301-801
Title: Detail Specification: High density rectangular connectors, round removable crimp contacts; German version prEN 175301-801:2005
Organization: DIN
Year: 2005
Status: Inactive
DIN IEC 60191-6-15
Title: Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for packa...
Organization: DIN
Year: 2007
Status: Inactive
DIN CWA 13994
Title: X.500 Profile ADY12 - DUA Support of Distributed Operations
Organization: DIN
Year: 2000
Status: Inactive
DIN EN 27185
Title: Programming languages; Pascal (ISO/IEC 7185:1990); English version EN 27185:1992
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 60512-14-4
Title: Connectors for electronic equipment - Basic testing and measurements: Part 14-4: Test 14d: Immersion-waterproof (IEC 48B/1268/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN EN ISP 11185-7
Title: Information technology - International standardized profiles FVT2nn - Virtual terminal basic class; register of control object type definitions - Part 7: FVT2110; entry-control control object; Engl...
Organization: DIN
Year: 1997
Status: Inactive
DIN EN ISP 10607-5
Title: Information technology - International Standardized Profiles AFTnn; file transfer, access and management - Part 5: AFT22, positional file access service (flat) (regional variant of ISO/IEC ISP 1060...
Organization: DIN
Year: 1997
Status: Inactive
DIN 50448
Title: Testing of materials for semiconductor technology - Contactless determination of the electrical resistivity of semi-insulation semiconductor slices using a capacitive probe
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 61760-3
Title: Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering (IEC 91/777/CD:2008)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 62258-5
Title: Semiconductor die products - Part 5: Requirements for information concerning electrical simulation (IEC 47/1807/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN EN 60603-7-5
Title: Connectors for electronic equipment - Part 7-5: Detail specification for 8-way, shielded, free and fixed connectors, for data transmissions with frequencies up to 250 MHz (IEC 48B/2009/CDV:2009); G...
Organization: DIN
Year: 2009
Status: Inactive
DIN EN 28632-3
Title: Information technology - Computer graphics; metafile for the storage and transfer of picture description information - Part 3: Binary encoding (ISO/IEC 8632-3:1992); English version EN 28632-3:1994
Organization: DIN
Year: 1994
Status: Inactive
DIN EN ISP 12063-4
Title: Information technology - International standardized profiles AMH3n - Message handling systems, EDI messaging - Part 4: AMH33 EDIMG, requirements for MTS access (P3) (ISO/IEC ISP 12063-4:1995); Engl...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 47A(Sec)289
Title: Integrated circuits; blank detail specification for MOS ultra-violet light erasable electrically programmable read-only memories; identical with IEC 47A(Secretariat)289
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 60512-16-1
Title: Connectors for electronic equipment - Tests and measurements - Part 16-1: Mechanical tests on contacts and terminations - Test 16a: Probe damage (IEC 48B/1561/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 60747-9
Title: Semiconductor devices - Discrete devices - Part 9: Insulated gate bipolar transistors (IGBTs) (IEC 47E/258/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 60747-1
Title: Semiconductor devices - Part 1: General (IEC 47/1734/CD:2003)
Organization: DIN
Year: 2004
Status: Inactive
DIN EN ISO/IEC 9314-3
Title: Information processing systems - Fibre Distributed Data Interface (FDDI) - Part 3: Physical layer Medium Dependent (PMD) (ISO/IEC 9314-3:1990); English version EN ISO 9314-3:1995
Organization: DIN
Year: 1995
Status: Inactive
DIN 50447
Title: Testing of materials for semiconductor technology - Contactless determination of the electrical sheet resistance of semiconductor layers with the eddy-current method
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 60384-20-1
Title: Fixed capacitors for use in electronic equipment - Part 20-1: Blank detail specification: Fixed metallized polyphenylene sulfide film dielectric surface mount d.c. capacitors - Assessment level EZ ...
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 40/1092/CD
Title: Revision to IEC 60539-1:1976: Directly heated negative temperature coefficient thermistors - Part 1: Generic specification (IEC 40/1092/CD:1998)
Organization: DIN
Year: 1999
Status: Inactive
DIN EN 61249-2-35
Title: Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials clad and unclad - Modified epoxide woven E-glass laminated sheets of defined flammability (v...
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 48B/468/CD
Title: Amendment to IEC 60603-7: Detail specification for connectors, 8-way, fixed and free connectors with common mating features, including shield mating (IEC 48B/468/CD:1995)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60194
Title: Printed Board Design, Manufacture and Assembly - Terms and Definitons (IEC 91/448/CDV:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 3B/256/CD
Title: IEC 60848, 2 nd Edition: Specification language GRAFCET for sequential function charts (IEC 3B/256/CD:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN EN ISP 10612-5
Title: Information technology - International Standardized Profile RD; relaying the MAC service using transparent bridging - Part 5: Profile RD51.54 (CSMA/CD LAN - FDDI LAN) (ISO/IEC ISP 10612-5:1995); En...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 34A(Sec)473
Title: Filament lamps for road vehicles; performance requirements; amendment to the 2nd edition of IEC 60810; identical with IEC 34A(Secretariat)473:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 60384-13
Title: Fixed capacitors for use in electronic equipment - Part 13: Sectional specification: Fixed polypropylene film dielectric metal foil d.c. capacitors (IEC 40/1418/CD:2004)
Organization: DIN
Year: 2004
Status: Inactive
DIN IEC 62453-1
Title: Field device tool interface specification - Part 1: Overview and guidance (IEC 65C/442/CD:2006), text in English
Organization: DIN
Year: 2007
Status: Inactive
DIN EN 61249-4-15
Title: Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional...
Organization: DIN
Year: 2007
Status: Inactive
DIN IEC 47D/114/CD
Title: Semiconductor devices, mechanical standardization - Proposal for a plastic small outline package P-TSOP II, 10,16 mm body family (intended for inclusion into IEC 60191-2) (IEC 47D/114/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 65C/241/CDV
Title: Signal polarity requirements for wire media (EC 65C/241/CDV:2000; text in English)
Organization: DIN
Year: 2000
Status: Inactive
DIN EN ISP 10613-5
Title: Information technology - International Standardized Profile RA; relaying the connectionless-mode network service - Part 5: Definition of profile RA51.51, relaying the connectionless-mode network se...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 60191-6-9
Title: Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guideline of integrate...
Organization: DIN
Year: 2002
Status: Inactive
DIN EN ISO/IEC 11172-3
Title: Information technology - Coding of moving pictures and associated audio for digital storage media at up to about 1,5 Mbit/s - Part 3: audio (ISO/IEC 11172-3:1993); English version EN ISO/IEC 11172-...
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 62047-1
Title: Semiconductor devices - Part 1: Microelectromechanical devices; Terms and definitions (IEC 47/1695A/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 1/1683/CD-444
Title: International Electrotechnical Vocabulary - Chapter 444: Non specified time all-or-nothing relays (elementary relays) (Revision of IEV Chapter 446: Electrical relays) (IEC 1/1683/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 40(Sec)617
Title: Fixed resistors for use in electronic equipment; detail specification: fixed power wirewound; resistors with solderable axial wire leads; stability class 1%; assessment level E; identical with IEC ...
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 60749-33
Title: Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance; Unbiased autoclave (IEC 47/1637/CD:2002)
Organization: DIN
Year: 2002
Status: Inactive
DIN 50992-2
Title: Coating tickness measurement and characterization of surfaces using surface waves - Part 2: Photothermal thickness measurement
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 61249-4-12
Title: Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards); Non-halogenated ...
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 49/329/CD
Title: Piezoelectric filters - A specification in the IEC quality assessement system for electronic components (IECQ) - Blank detail specification (capability approval) (IEC 49/329/CD:1996)
Organization: DIN
Year: 1996
Status: Inactive
DIN EN ISO/IEC 11172-1
Title: Information technology - Coding of moving pictures and associated audio for digital storage media at up to about 1,5 Mbit/s - Part 1: systems (ISO/IEC 11172-1:1993); English version EN ISO/IEC 1117...
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 62326-3
Title: Printed boards - Part 3: Safety certification of rigid printed circuit boards for electronic assemblies (IEC 91/384/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 47D/186/CDV
Title: Semiconductor devices, mechanical standardization - Power package - HSOP (IEC 47D/186/CDV:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN EN ISP 10613-7
Title: Information technology - International Standardized Profile RA; relaying the connectionless-mode network service - Part 7: PSDN subnetwork-dependent, media-dependent requirements for virtual calls ...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 40/776/CD
Title: Amendment to IEC 60384-18-2: Fixed capacitors for use in electronic equipment - Part 18: Blank detail specification: Fixed aluminium electrolytic chip capacitors with non solid electrolyte; assessm...
Organization: DIN
Year: 1996
Status: Inactive
DIN IEC 3A/458/CD
Title: Graphical symbols for diagrams - New symbols for devices used in building installations (IEC 3A/458/CD:1996)
Organization: DIN
Year: 1997
Status: Inactive
DIN 41607-2
Title: Super jumbo 4-pin base - Gauge
Organization: DIN
Status: Inactive
DIN IEC 65C/174/CDV
Title: Fieldbus standard for use in industrial control systems - Part 5: Application layer service definition (IEC 65C/174/CDV:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 48B/763/CD
Title: Solderless connections - Part 7: Spring clamps connections; general requirements, test methods and practical guidance (IEC 48B/763/CD:1999)
Organization: DIN
Year: 1999
Status: Inactive
DIN IEC 60512-16-14
Title: Connectors for electronic equipment - Tests and measurements - Part 16-14: Mechanical tests on contacts and terminations - Test 16n: Bending strength fixed male tabs (IEC 48B/1572/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 61360-1/A1
Title: Standard data element types with associated classification scheme for electric components - Part 1: Definitions; Principles and methods; Amendment 1 (IEC 3D/82/CD:2001)
Organization: DIN
Year: 2002
Status: Inactive
DIN IEC 60081/A401
Title: Double-capped fluorescent lamps - Performance specifications (IEC 34A/1262/CD:2007)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 62453-303-2
Title: Field Device Tool Interface Specification - Part 303-2: Communication profile integration - IEC 61784 CP 3/4, CP 3/5 and CP 3/6; English version IEC 65E/10/CD:2007
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 60512-14-5
Title: Connectors for electronic equipment - Basic testing and measurements: Part 14-5: Test 14e: Immersion-low (air) pressure (IEC 48B/1269/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 34A(CO)692
Title: Filament lamps for road vehicles - Performance requirements - Amendment 1: Performance requirements (IEC 34A(CO)692:1994)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 47C/99/CD
Title: Semiconductor devices - Essential ratings and characteristics of TO-can laser devices (IEC 47C/99/CD:1995)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 61968-9
Title: Application integration at electric utilities - System interfaces for distribution management - Part 9: Interface standard for meter reading and control, text in English (IEC 57/911/CD:2007)
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 40(Sec)650
Title: Fixed capacitors for radio interference suppression; proposal for an active flammability test; identical with IEC 40(Secretariat)650
Organization: DIN
Year: 1992
Status: Inactive
DIN IEC 65C/175/CDV
Title: Fieldbus standard for use in industrial control systems - Part 6: Application layer protocol specification (IEC 65C/175/CDV:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 47D/196/CD
Title: Semiconductor devices, mechanical standardization - 3-leaded SMD outline package (Body size D x E: 1,60 mm x 0,8 mm) (IEC 47D/196/CD:1997)
Organization: DIN
Year: 1998
Status: Inactive
DIN IEC 61076-1
Title: Connectors - Product requirements - Part 1: Generic specification (Ed. 2) (IEC 48B/880/CD:2000)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 60512-23-7
Title: Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 23-7: Screening and filtering tests; Test 23g: Measurement of effective transfer impeda...
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 60384-8-1
Title: Fixed capacitors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed capacitors of ceramic dielectric, class 1; Assessment level EZ (IEC 40/1316/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 60512-16-13
Title: Connectors for electronic equipment - Tests and measurements - Part 16-13: Mechanical tests on contacts and terminations - Test 16m: Unwrapping, solderless wrapped connections (IEC 48B/1571/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 61988-3-2
Title: Plasma Display Panels - Part 3-2: Electrical interface (IEC 110/63/CD:2005)
Organization: DIN
Year: 2006
Status: Inactive
DIN IEC 91/110/CD
Title: Registration and analysis of defects on printed board assemblies (IEC 91/110/CD:1997)
Organization: DIN
Year: 1997
Status: Inactive
DIN IEC 47D/147/CD
Title: Semiconductor devices, mechanical standardization - Proposed addition to the metric plastic quad flatpack family 1,0 - 133E, 0,80 - 134E und 0,65 - 135E (Intended for inclusion into IEC 60191-2) (I...
Organization: DIN
Year: 1997
Status: Inactive
DIN EN 61249-2-4
Title: Materials for interconnection structures - Part 2-4: Sectional specification set for reinforced base materials, clad and unclad; polyester non-wowen/woven fibreglass laminated sheet of defined flam...
Organization: DIN
Year: 2000
Status: Inactive
DIN IEC 60384-9
Title: Fixed capacitors for use in electronic equipment - Part 9: Sectional specification: Fixed capacitors of ceramic dielectric, class 2 (IEC 40/1317/CD:2003)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 60747-8-12
Title: Semiconductor devices - Discrete devices - Part 8-12: Metal-oxide-semiconductor field-effect transistors (MOSFETs) for power switching applications (IEC 47E/199/CD:2001)
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 47A(Sec)260
Title: Integrated circuits; blank detail specification for film integrated circuits and hybrid film integrated circuits; qualification approval procedure; identical with IEC 47A(Secretariat)260
Organization: DIN
Year: 1992
Status: Inactive
DIN EN 29171-2
Title: Information technology; 130 mm optical disk cartridge, write once, for information interchange; part 2: recording format (ISO/IEC 9171-2:1990); English version EN 29171-2:1993
Organization: DIN
Year: 1993
Status: Inactive
DIN IEC 47D(Sec)14
Title: Semiconductor devices; mechanical standardization; proposal for DAMBAR protusion and intrusion at terminals (IEC 47D(Secretariat)14:1993)
Organization: DIN
Year: 1994
Status: Inactive
DIN IEC 60368-1/A1
Title: Amendment 1 to IEC 60368-1: Piezoelectric filters of assessed quality - Part 1: General specification (IEC 49/565/CD:2002)
Organization: DIN
Year: 2003
Status: Inactive
DIN IEC 62149-3-3
Title: Basic standard for discrete/integrated optoelectronic semiconductor devices for fibre optic communications including hybrid devices - Package interface standards - Part 3-3: Fibre optic transceiver...
Organization: DIN
Year: 2001
Status: Inactive
DIN IEC 47D/72/CD
Title: Semiconductor devices, mechanical standardization - IEC 60191-3: Requirements for pin 1 mark function and location adding PLCC figure 19 and QFP figure 20 (IEC 47D/72/CD:1995)
Organization: DIN
Year: 1995
Status: Inactive
DIN IEC 62137-1-1
Title: Surface mount technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test (IEC 91/519/CD:2005)
Organization: DIN
Year: 2005
Status: Inactive
DIN EN 60352-2
Title: Solderless connections - Part 2: Solderless crimped connections - General requirements, test methods and practical guidance (IEC 48B/1474/CDV:2004); German version prEN 60352-2:2004
Organization: DIN
Year: 2005
Status: Inactive
DIN EN 140401
Title: Blank Detail Specification: Fixed low power non-wire-wound surface mount (SMD) resistors; German version FprEN 140401:2008
Organization: DIN
Year: 2008
Status: Inactive
DIN IEC 48B/381/CD
Title: Detail specification for a range of shielded connectors with trapezoidal shaped shells and non-removable ribbon contacts on a 1,27 mm double rows (IEC 48B/381/CD:1995)
Organization: DIN
Year: 1995
Status: Inactive


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