Standards Library

1-500 of 725 results for "IPC"

TM-650 2.3.34.1B
Title: Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder
Organization: IPC
Year: 1995
Status: Active
TM-650 2.4.26
Title: Tape Test for Additive Printed Boards
Organization: IPC
Year: 1979
Status: Active
TM-650 2.4.6
Title: Hot Oil
Organization: IPC
Year: 1973
Status: Active
TM-650 2.5.24
Title: Conductor Resistance, Flexible Flat Cable
Organization: IPC
Year: 1979
Status: Inactive
PE-74 SECTION 11
Title: Etching
Organization: IPC
Status: Inactive
7711 3.8.5
Title: J-Lead Removal Hot Gas Reflow System
Organization: IPC
Year: 1998
Status: Inactive
PE-74 SECTION 9
Title: Imaging
Organization: IPC
Status: Inactive
TM-650 5.1.418
Title: Analysis of Epoxy Resins for Volatile Content
Organization: IPC
Year: 1975
Status: Inactive
TM-650 1.4A
Title: Reporting, General
Organization: IPC
Year: 2003
Status: Active
7721 6.2.1
Title: Jumper Wires, BGA Components, Foil Jumper Method
Organization: IPC
Year: 1999
Status: Inactive
TM-650 2.3.8.1
Title: Flammability of Flexible Printed Wiring
Organization: IPC
Year: 1988
Status: Inactive
TM-650 5.5.4.1
Title: Ten Layer Qualification Board
Organization: IPC
Year: 1998
Status: Inactive
TM-650 1.9A
Title: Measurement Precision Estimation for Variables Data
Organization: IPC
Year: 2003
Status: Active
TM-650 5.5.4.17
Title: Via Test
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.4
Title: Metric Conversion Tables
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.33
Title: Measurement of Electrical Overstress from Soldering Hand Tools
Organization: IPC
Year: 1998
Status: Active
7711 3.10.2
Title: PLCC Socket Removal Solder Wrap Method
Organization: IPC
Year: 1998
Status: Inactive
7711 3.6.3
Title: Gull Wing Removal (Two-Sided) Flux Application Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.1.102
Title: Analysis of Copper Pyrophosphate Electroplating Solutions
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.6.13
Title: Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring
Organization: IPC
Year: 1985
Status: Active
TM-650 2.2.18
Title: Determination of Thickness of Laminates by Mechanical Measurement
Organization: IPC
Year: 1994
Status: Active
TM-650 2.3.14
Title: Print, Etch and Plate Test
Organization: IPC
Year: 1973
Status: Active
TM-650 2.4.8.4
Title: Carrier Release, Thin Copper
Organization: IPC
Year: 1990
Status: Active
TM-650 2.3.34C
Title: Solids Content, Flux
Organization: IPC
Year: 2004
Status: Active
7721 2.4.1
Title: Coating Replacement, Solder Resist
Organization: IPC
Year: 1998
Status: Inactive
100043 REVISION A
Title: Master Drawing for 10 Layer Multilayer Printed Boards
Organization: IPC
Year: 1989
Status: Inactive
TM-650 5.3
Title: Recommended Method for Indicating Values
Organization: IPC
Year: 1973
Status: Inactive
TM-650 2.5.5.4
Title: Dielectric Constant and Dissipation Factor of Printed Wiring Board Material-Micrometer Method
Organization: IPC
Year: 1985
Status: Inactive
7711 3.8.4
Title: J-Lead Removal Flux & Tin Tip Only
Organization: IPC
Year: 1998
Status: Inactive
7711 3.8.2
Title: J-Lead Removal (Four-Sided) Solder Wrap Method - Tweezer
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.23
Title: Soldering Resistance of Laminate Materials
Organization: IPC
Year: 1979
Status: Active
7711 4.1.3
Title: Surface Solder Removal Braid Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.6.3.6
Title: Surface Insulation Resistance - Fluxes - Telecommunications
Organization: IPC
Year: 2004
Status: Active
TM-650 5.5.4.9
Title: Test Coupon G - Via Resistivity
Organization: IPC
Year: 1998
Status: Inactive
7711 3.7.4
Title: Gull Wing Removal (Four-Sided) Bridge Fill Method - Tweezer
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.24.3
Title: Glass Transition Temperature of Organic Films - TMA Method
Organization: IPC
Year: 1995
Status: Active
TM-650 2.1.10A
Title: Visual Inspection for Undissolved Dicyandiamide
Organization: IPC
Year: 1994
Status: Active
TM-650 5.1.205
Title: Analysis of Ammonium Persulfate with/Without Sulfuric Acid Cleaning Solutions
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.5.11
Title: Insulation Resistance, Multilayer Printed Wiring (Within a Layer)
Organization: IPC
Year: 1973
Status: Inactive
7711 3.7.2.1
Title: Gull Wing Removal (Four-Sided) Solder Wrap Method - Surface Tension
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.1.150
Title: Analysis of Tin-Lead Fluoborate Electroplating Solutions
Organization: IPC
Year: 1975
Status: Inactive
A-22
Title: Test Pattern Artwork & Sample Preparation for Underwriters' Laboratories Standard U.L. 796 and U.L. 746
Organization: IPC
Year: 1991
Status: Inactive
TM-650 2.4.42
Title: Torsional Strength of Chip Adhesives
Organization: IPC
Year: 1988
Status: Active
7721 4.4.1
Title: Lifted Land Repair, Epoxy Method
Organization: IPC
Year: 1998
Status: Inactive
7711 3.9.1
Title: BGA/CSP Removal
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.1.6
Title: Adhesion, Polymer Coating
Organization: IPC
Year: 1995
Status: Active
TM-650 5.5.2
Title: IPC-TM-650 Artwork
Organization: IPC
Year: 1998
Status: Inactive
TM-650 1.2A
Title: Calibration
Organization: IPC
Year: 2003
Status: Active
7711 2.4.6
Title: Coating Removal Micro Blasting Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.18.3
Title: Tensile Strength, Elongation, and Modulus
Organization: IPC
Year: 1995
Status: Active
7721 2.3.5
Title: Coating Removal, Grinding/Scraping Method
Organization: IPC
Year: 1998
Status: Inactive
7711 3.5.3
Title: SOT Removal Hot Air Pencil
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.2.5
Title: Test Method 2.4.3.1 - Flexural Fatigue and Ductility
Organization: IPC
Year: 1998
Status: Inactive
TM-650 1.9 GUIDE
Title: Measurement Precision Calculator Users Guide For Use with Test Method 1.9, Measurement Systems Analysis for Variables Data
Organization: IPC
Year: 2003
Status: Inactive
TM-650 2.3.5B
Title: Density Insulation Material
Organization: IPC
Year: 1997
Status: Inactive
TM-650 5.7.2
Title: Incoming Acceptance Testing of Epoxy Resins
Organization: IPC
Year: 1973
Status: Inactive
TM-650 2.5.5.5C
Title: Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band
Organization: IPC
Year: 1998
Status: Active
TM-650 2.4.24.4
Title: Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias - DMA Method
Organization: IPC
Year: 1998
Status: Active
TM-650 2.4.7A
Title: Machinability, Printed Wiring Materials
Organization: IPC
Year: 1975
Status: Active
TM-650 2.4.28B
Title: Adhesion, Solder Mask (Non-Melting Metals)
Organization: IPC
Year: 1997
Status: Inactive
TM-650 2.2.12A
Title: Thickness of Copper by Weight
Organization: IPC
Year: 1976
Status: Active
TM-650 2.6.6B
Title: Temperature Cycling, Printed Wiring Board
Organization: IPC
Year: 1987
Status: Inactive
TM-650 2.2.14.3
Title: Determination of Maximum Solder Powder Particle Size
Organization: IPC
Year: 1995
Status: Active
TM-650 2.4.51
Title: Self Shimming Thermally Conductive Adhesives
Organization: IPC
Year: 1995
Status: Active
TM-650 2.4.20
Title: Terminal Bond Strength, Flexible Printed Wiring
Organization: IPC
Year: 1973
Status: Inactive
7711 3.9.2
Title: BGA Removal Vacuum Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 3.15
Title: Fungus Resistance, Connectors
Organization: IPC
Year: 1979
Status: Inactive
7721 4.7.1
Title: Surface Mount Pad Repair, Epoxy Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.8.3A
Title: Peel Strength of Metallic Clad Laminate at Elevated Temperature (Hot Air Method)
Organization: IPC
Year: 1994
Status: Active
7711 5.6.2
Title: J-Lead Installation Point-to-Point Method
Organization: IPC
Year: 1998
Status: Inactive
PE-74 SECTION 6
Title: Hole Preparation
Organization: IPC
Status: Inactive
7711 3.7.3
Title: Gull Wing Removal (Four-Sided) Flux Application Method - Vacuum Cup
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.9.2
Title: Bonding Process
Organization: IPC
Year: 1998
Status: Active
TM-650 5.5.4.19
Title: Conductor Test
Organization: IPC
Year: 1998
Status: Inactive
7711 5.6.3
Title: J-Lead Installation Solder Paste Method/Hot Air Pencil
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.2.4
Title: Test Method 2.4.9 - Peel Strength
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.4
Title: Current Carrying Capacity, Multilayer Printed Wiring
Organization: IPC
Year: 1973
Status: Inactive
TM-650 2.5.27
Title: Surface Insulation Resistance of Raw Printed Wiring Board Material
Organization: IPC
Year: 1979
Status: Active
TM-650 2.3.35.1A
Title: Fluorides by Spot Test, Fluxes - Qualitative
Organization: IPC
Year: 2004
Status: Active
7721 4.5.2
Title: Land Repair, Film Adhesive Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.33D
Title: Presence of Halides in Flux, Silver Chromate Method
Organization: IPC
Year: 2004
Status: Active
TM-650 2.3.11
Title: Glass Fabric Construction
Organization: IPC
Year: 1973
Status: Active
7721 6.1
Title: Jumper Wires
Organization: IPC
Year: 1999
Status: Inactive
TM-650 2.4.21.1C
Title: Bond Strength, Surface Mount Lands Perpendicular Pull Method
Organization: IPC
Year: 1991
Status: Inactive
TM-650 2.4.18B
Title: Tensile Strength and Elongation, Copper Foil
Organization: IPC
Year: 1980
Status: Active
TM-650 2.5.12
Title: Interconnection Resistance, Multilayer Printed Wiring
Organization: IPC
Year: 1973
Status: Active
PE-74 SECTION 4
Title: Raw Materials
Organization: IPC
Status: Inactive
TM-650 2.5.4.1A
Title: Conductor Temperature Rise Due to Current Changes in Conductors
Organization: IPC
Year: 1997
Status: Active
TM-650 3.1A
Title: Contact Resistance, Connectors
Organization: IPC
Year: 1975
Status: Inactive
7721 2.6
Title: Epoxy Mixing and Handling
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.6
Title: Miscellaneous
Organization: IPC
Year: 1998
Status: Inactive
7711 3.8.1
Title: J-Lead Removal (Four-Sided) Bridge Fill Method - Tweezer
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.31
Title: Current Leakage (Through Overglaze Films)
Organization: IPC
Year: 1987
Status: Inactive
TM-650 5.5.1.3
Title: IPC-B-25 - Multipurpose Test Board - Side 1 and Side 2
Organization: IPC
Year: 1998
Status: Inactive
7711 5.5.3
Title: Gull Wing Installation Point-to-Point Method
Organization: IPC
Year: 1998
Status: Inactive
7721 4.2.2
Title: Conductor Repair, Foil Jumper, Film Adhesive Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.2.2B
Title: Optical Dimensional Verification
Organization: IPC
Year: 1997
Status: Active
TM-650 2.6.8E
Title: Thermal Stress, Plated-Through Holes
Organization: IPC
Year: 2004
Status: Active
TM-650 2.5.5.1B
Title: Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 1 MHz (Contacting Electrode Systems)
Organization: IPC
Year: 1986
Status: Inactive
7711 3.1.1
Title: Through-hole Desoldering Continuous Vacuum Method
Organization: IPC
Year: 1998
Status: Inactive
7721 2.1
Title: Handling Electronic Assemblies
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.1.7.1
Title: Thread Count, Organic Fibers
Organization: IPC
Year: 1987
Status: Active
TM-650 2.6.4B
Title: Outgassing, Printed Boards
Organization: IPC
Year: 2004
Status: Active
TM-650 5.5.1.5
Title: IPC-A-27 - Multilayer Test Pattern - Six or Ten Layer
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.2.18.1
Title: Determination of Thickness of Metallic Clad Laminates, Cross- Sectional
Organization: IPC
Year: 1994
Status: Active
TM-650 5.5.1.17
Title: IPC-A-48 - Surface Mount Air Force Mantech Artwork
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.1.1.1
Title: Microsectioning, Ceramic Substrate
Organization: IPC
Year: 1987
Status: Inactive
TA-723
Title: Technology Assessment of Surface Mounting
Organization: IPC
Year: 1991
Status: Inactive
TM-650 3.7A
Title: Low Level Circuit Connectors
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.1.6.1
Title: Weight of Fabric Reinforcements
Organization: IPC
Year: 1994
Status: Active
TM-650 5.5.4.10
Title: Test Coupon H - Capacitance and Current Density
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.10.1
Title: Flammability of Soldermask on Printed Wiring Laminate
Organization: IPC
Year: 1998
Status: Active
CD-49C
Title: Interactive CD: The Seven Sins of Hand Soldering with Training Certification
Organization: IPC
Status: Inactive
7721 2.7.3
Title: Legend/Marking, Stencil Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.35
Title: Solder Paste - Slump Test
Organization: IPC
Year: 1995
Status: Active
TM-650 2.5.5.5.1
Title: Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHz
Organization: IPC
Year: 1998
Status: Active
M-106
Title: Technology Reference for Design Manual
Organization: IPC
Status: Inactive
7721 3.4.2
Title: Key and Slot Repair, Transplant Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.33.1
Title: Measurement of Electrical Overstress from Soldering Hand Tools - Ground Measurements
Organization: IPC
Year: 1998
Status: Active
TM-650 3.11A
Title: Thermal Shock, Connectors
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.2.14.2
Title: Solder Powder Particle Size Distribution - Optical Image Analyzer Method
Organization: IPC
Year: 1995
Status: Active
7721 5.1
Title: Plated Hole Repair, No Inner Layer Connection
Organization: IPC
Year: 1998
Status: Inactive
7711 5.6.4
Title: J-Lead Installation Multi-Lead Method
Organization: IPC
Year: 1998
Status: Inactive
7721 4.2.7
Title: Conductor Repair, Inner Layer Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.50
Title: Thermal Conductivity, Polymer Films
Organization: IPC
Year: 1995
Status: Active
TM-650 2.4.24.1
Title: Time to Delamination (TMA Method)
Organization: IPC
Year: 1994
Status: Active
TM-650 2.2.8
Title: Location of Holes
Organization: IPC
Year: 1973
Status: Inactive
7711 4.3.1
Title: SMT Land Tinning Using Blade Tip
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.8A
Title: Flammability, Flexible Insulating Materials
Organization: IPC
Year: 1982
Status: Inactive
TM-650 5.5.4.2
Title: Ten Layer Qualification Board - Layer 1
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.2.6
Title: Test Method 2.4.3 - Flexural Endurance
Organization: IPC
Year: 1998
Status: Inactive
TM-650 1.3A
Title: Ambient Conditions
Organization: IPC
Year: 2003
Status: Active
TM-650 2.5.6.2A
Title: Electric Strength of Printed Wiring Material
Organization: IPC
Year: 1997
Status: Active
TM-650 4.0
Title: Section Four Table of Contents
Organization: IPC
Status: Inactive
TM-650 2.4.36C
Title: Rework Simulation, Plated-Through Holes for Leaded Components
Organization: IPC
Year: 2004
Status: Active
TM-650 2.5.13A
Title: Resistance of Copper Foil
Organization: IPC
Year: 1976
Status: Active
PE-74 SECTION 14
Title: Process Specifics
Organization: IPC
Status: Inactive
TM-650 5.1.110
Title: Analysis of Gold, Acid and Neutral Electroplating Solutions
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.3.3A
Title: Chemical Resistance of Insulated Materials
Organization: IPC
Year: 1978
Status: Inactive
TM-650 5.1.122
Title: Analysis of Nickel Chloride/Sulfate Electroplating Solutions
Organization: IPC
Year: 1975
Status: Inactive
7721 4.3.1
Title: Conductor Cut, Surface Conductors
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.5.8
Title: Low Frequency Dielectric Constant and Loss Tangent, Polymer Films
Organization: IPC
Year: 1995
Status: Inactive
7721 4.2.1
Title: Conductor Repair, Foil Jumper, Epoxy Method
Organization: IPC
Year: 1999
Status: Inactive
TM-650 2.6.14.1
Title: Electrochemical Migration Resistance Test
Organization: IPC
Year: 2000
Status: Active
FC-219
Title: Environmentally Sealed Flat Cable Connectors for Use in Aerospace Applications
Organization: IPC
Year: 1984
Status: Inactive
TM-650 5.8.2
Title: Flexible Multilayer Test Pattern
Organization: IPC
Year: 1973
Status: Inactive
TM-650 1.1C
Title: Introduction
Organization: IPC
Year: 2003
Status: Active
TM-650 2.5.5.2A
Title: Dielectric Constant and Dissipation Factor of Printed Wiring Board Material - Clip Method
Organization: IPC
Year: 1987
Status: Active
7711 7.1.1
Title: Epoxy Mixing and Handling
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.4.5
Title: Test Coupon C - Circuit Continuity, Temperature Cycling, Thermal Cycling, and Construction Integrity
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.17E
Title: Volume Resistivity and Surface Resistance of Printed Wiring Materials
Organization: IPC
Year: 1998
Status: Active
TM-650 5.1.100
Title: Analysis of Copper Fluoborate Electroplating Solutions
Organization: IPC
Year: 1975
Status: Inactive
PE-74 SECTION 2
Title: Documentation
Organization: IPC
Status: Inactive
PE-74 SECTION 12
Title: Innerlayer Fabrication
Organization: IPC
Status: Inactive
TM-650 5.5.5.1
Title: British Qualification Boards
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.33.2
Title: Measurement of Electrical Overstress from Soldering Hand Tools - Transient Measurements
Organization: IPC
Year: 1998
Status: Active
TM-650 5.5.1.14
Title: IPC-A-42 - Double Sided Test Pattern
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.4.3
Title: Inches to Millimeter Conversion
Organization: IPC
Year: 1973
Status: Inactive
TM-650 2.4.13.1
Title: Thermal Stress of Laminates
Organization: IPC
Year: 1994
Status: Active
7711 2.2
Title: Cleaning
Organization: IPC
Year: 1998
Status: Inactive
7721 2.4.2
Title: Coating Replacement, Conformal Coatings/Encapsulants
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.4.15
Title: Test Pattern - Via Fill
Organization: IPC
Year: 1998
Status: Inactive
7711 6.1.3
Title: Removing Shorts Between Gull Wing Draw Off Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.2.16
Title: Artwork Master Evaluation by Use of a Drilled Panel
Organization: IPC
Year: 1987
Status: Inactive
TM-650 2.4.34.1
Title: Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centerpoise)
Organization: IPC
Year: 1995
Status: Active
TM-650 5.1.416
Title: Analysis of Epoxy Resins for Viscosity
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.3.12
Title: Glass Fabric Weight
Organization: IPC
Year: 1986
Status: Inactive
TM-650 5.1.424
Title: Analysis of Glass Fabrics for Silane Content
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.4.2.1D
Title: Flexural Fatigue and Ductility, Foil
Organization: IPC
Year: 1991
Status: Active
TM-650 5.5.1
Title: IPC Artwork
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.37.1A
Title: Evaluation of Hand Soldering Tools for Printed Wiring Board Applications
Organization: IPC
Year: 1991
Status: Inactive
TM-650 2.3.35C
Title: Halide Content, Quantitative (Chloride & Bromide)
Organization: IPC
Year: 2004
Status: Active
PE-74 SECTION 18
Title: Inspection and Test
Organization: IPC
Status: Inactive
7711 3.8.1.1
Title: J-Lead Removal Bridge Fill Method - Surface Tension
Organization: IPC
Year: 1998
Status: Inactive
TM-650 3.4B
Title: Durability, Connectors
Organization: IPC
Year: 1983
Status: Inactive
TM-650 2.4.24.2
Title: Glass Transition Temperature of Organic Films - DMA Method
Organization: IPC
Year: 1995
Status: Active
7721 3.3.1
Title: Hole Repair, Epoxy Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.1.3
Title: Adhesion, Resistors (Hybrid Circuits)
Organization: IPC
Year: 1987
Status: Inactive
TM-650 2.4.27.2A
Title: Solder Mask Abrasion (Pencil Method)
Organization: IPC
Year: 1988
Status: Inactive
TM-650 2.4.1.1B
Title: Adhesion, Marking Paints and Inks
Organization: IPC
Year: 1988
Status: Inactive
7711 3.7.6
Title: Gull Wing Removal (Four-Sided) Flux Application Method - Tweezer
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.41
Title: Coefficient of Linear Thermal Expansion of Electrical Insulating Materials
Organization: IPC
Year: 1986
Status: Active
TM-650 2.4.42.2
Title: Die Shear Strength
Organization: IPC
Year: 1998
Status: Inactive
HF-318A
Title: Microwave End Product Board Inspection and Test
Organization: IPC
Year: 1991
Status: Inactive
TM-650 5.5.5
Title: British Qualification
Organization: IPC
Year: 1998
Status: Inactive
7711 2.4.4
Title: Coating Removal Thermal Method
Organization: IPC
Year: 1998
Status: Inactive
7721 3.4.1
Title: Key and Slot Repair, Epoxy Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.1B
Title: Arc Resistance of Printed Wiring Material
Organization: IPC
Year: 1986
Status: Active
7711 2.1
Title: Handling Electronic Assemblies
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.26A
Title: Ionizable Detection of Surface Contaminants (Dynamic Method)
Organization: IPC
Year: 1994
Status: Inactive
TM-650 3.8A
Title: Mechanical Shock, Connectors
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.4.19C
Title: Tensile Strength and Elongation, Flexible Printed Wiring Materials
Organization: IPC
Year: 1998
Status: Active
TM-650 3.14
Title: High Temperature Life, Connectors
Organization: IPC
Year: 1975
Status: Inactive
TM-650 5.5.4.7
Title: Test Coupon E - Insulation Resistance
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.2.20
Title: Solder Paste Metal Content by Weight
Organization: IPC
Year: 1995
Status: Active
7711 3.7.2
Title: Gull Wing Removal (Four-Sided) Solder Wrap Method - Vacuum Cup
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.27.1
Title: Rosin Flux Residue Analysis - HPLC Method
Organization: IPC
Year: 1995
Status: Inactive
FC-220C
Title: Specification for Flat Cable, Flat Conductor, Unshielded
Organization: IPC
Year: 1985
Status: Inactive
7711 7.3.1
Title: Coating Replacement Conformal Coatings/Encapsulants
Organization: IPC
Year: 1998
Status: Inactive
7711 3.7.1.1
Title: Gull Wing Removal (Four-Sided) Bridge Fill Method - Surface Tension
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.27.1B
Title: Abrasion (Taber Method) Solder Mask and Conformal Coating
Organization: IPC
Year: 1995
Status: Active
TM-650 2.5.19.1A
Title: Propagation Delay of Flat Cables Using Dual Trace Oscilloscope
Organization: IPC
Year: 1984
Status: Active
FC-203
Title: Specification for Flat Cable, Round Conductor, Ground Plane
Organization: IPC
Year: 1985
Status: Inactive
TM-650 2.3.16B
Title: Resin Content of Prepreg, by Burn-Off
Organization: IPC
Year: 1994
Status: Active
7711 3.4.2
Title: Leadless Component Removal Flux Application Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.9D
Title: Flammability of Prepreg and Thin Laminate
Organization: IPC
Year: 1997
Status: Active
PE-74 SECTION 8
Title: Cleaning Procedures
Organization: IPC
Status: Inactive
TM-650 2.3.29
Title: Flammability, Flexible Flat Cable
Organization: IPC
Year: 1988
Status: Inactive
TM-650 2.1.8B
Title: Workmanship
Organization: IPC
Year: 1994
Status: Active
TM-650 2.4.11
Title: Shear Strength Flexible Dielectric Materials
Organization: IPC
Year: 1973
Status: Inactive
PE-74 SECTION 1
Title: General Introduction
Organization: IPC
Status: Inactive
TM-650 2.4.33C
Title: Flexural Fatigue and Ductility, Flat Cable
Organization: IPC
Year: 1991
Status: Inactive
7711 3.6.5
Title: Gull Wing Removal (Two-Sided) Solder Wrap Method - Tweezer
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.35.2A
Title: Fluoride Concentration, Fluxes - Quanitative
Organization: IPC
Year: 2004
Status: Active
TM-650 5.5.4.3
Title: Test Coupon A - Bondability, Weldability, Solderability and Shorts
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.36
Title: Acid Acceptance of Chlorinated Solvents
Organization: IPC
Year: 1985
Status: Active
TM-650 2.4.31A
Title: Folding, Flexible Flat Cable
Organization: IPC
Year: 1986
Status: Inactive
TM-650 1.10
Title: Review Boards
Organization: IPC
Year: 1973
Status: Inactive
PE-74 SECTION 7
Title: Plated-Through Hole
Organization: IPC
Status: Inactive
TM-650 2.6.23
Title: Test Procedure for Steam Ager Temperature Repeatability
Organization: IPC
Year: 1993
Status: Active
TM-650 2.2.19.1
Title: Length, Width and Perpendicularity of Laminate and Prepreg Panels
Organization: IPC
Year: 1994
Status: Active
TM-650 2.5.10A
Title: Insulation Resistance, Multilayer Printed Wiring (Between Layers)
Organization: IPC
Year: 1987
Status: Inactive
7721 4.2.3
Title: Conductor Repair, Welding Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.4.1A
Title: Flexural Strength of Laminates (at Elevated Temperature)
Organization: IPC
Year: 1994
Status: Active
TM-650 5.4.5
Title: Volume Conversions
Organization: IPC
Year: 1973
Status: Inactive
TM-650 3.13A
Title: Withstanding Voltage, Connectors
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.4.12A
Title: Solderability, Edge Dip Method
Organization: IPC
Year: 1991
Status: Active
TM-650 5.5.1.7
Title: IPC-A-31 - Flexible Material Group C Test Pattern
Organization: IPC
Year: 1998
Status: Inactive
7711 7.2.1
Title: Coating Replacement Solder Resist
Organization: IPC
Year: 1998
Status: Inactive
TM-650 1.6A
Title: Numerical Reporting
Organization: IPC
Year: 2003
Status: Active
7721 2.7.1
Title: Legend/Marking, Stamping Method
Organization: IPC
Year: 1998
Status: Inactive
7711 8.1.3
Title: Hook Splice
Organization: IPC
Year: 1998
Status: Inactive
7721 3.5.2
Title: Base Material Repair, Area Transplant Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.1.5A
Title: Surface Examination, Unclad and Metal Clad Material
Organization: IPC
Year: 1982
Status: Active
7711 5.5.4
Title: Gull Wing Installation Hot Air Pencil/Solder Paste Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.34.3
Title: Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
Organization: IPC
Year: 1995
Status: Active
TM-650 2.1.1.2A
Title: Microsectioning-Semi or Automatic Technique Microsection Equipment (Alternate)
Organization: IPC
Year: 2004
Status: Inactive
TM-650 2.4.39A
Title: Dimensional Stability, Glass Reinforced Thin Laminates
Organization: IPC
Year: 1986
Status: Active
TM-650 2.2.9
Title: Overhang and Undercut Measurement
Organization: IPC
Year: 1973
Status: Inactive
TM-650 3.12A
Title: Vibration, Connectors
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.4.2A
Title: Ductility of Copper Foil
Organization: IPC
Year: 1976
Status: Active
TM-650 5.5.1.11
Title: IPC-A-38 - High Density Circuit Test Pattern
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.1.7C
Title: Thread Count of Glass Fabric
Organization: IPC
Year: 1994
Status: Active
TM-650 5.9
Title: Refractive Index Table for Epoxy Resins
Organization: IPC
Year: 1973
Status: Inactive
TM-650 5.1
Title: Related Test Methods
Organization: IPC
Year: 1976
Status: Inactive
TM-650 2.6.16.1
Title: Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel)
Organization: IPC
Year: 1998
Status: Active
7721 2.3.4
Title: Coating Removal, Thermal Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.6.1
Title: Solder Mask Coated Standard Test Pattern
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.4.11
Title: Test Coupon J and K - Conductor Resistivity
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.49
Title: Solder Pool Test
Organization: IPC
Year: 1995
Status: Active
TM-650 2.2.11
Title: Registration, Terminal Pads (Layer to Layer)
Organization: IPC
Year: 1973
Status: Inactive
TM-650 2.4.38A
Title: Prepreg Scaled Flow Testing
Organization: IPC
Year: 1991
Status: Active
TM-650 2.4.34
Title: Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipoise)
Organization: IPC
Year: 1995
Status: Active
CS-70
Title: Guidelines for Chemical Handling Safety in Printed Board Manufacturing
Organization: IPC
Year: 1988
Status: Inactive
TM-650 2.4.14.2A
Title: Liquid Flux Activity, Wetting Balance Method
Organization: IPC
Year: 2004
Status: Active
TM-650 2.2.21
Title: Planarity of Dielectrics for High Density Interconnection (HDI)/Microvia Technology
Organization: IPC
Year: 1998
Status: Active
TM-650 2.4.37.2
Title: Evaluation of Hand Soldering Tools on Heavy Thermal Loads
Organization: IPC
Year: 1993
Status: Inactive
TM-650 5.5.1.1
Title: IPC-A-22-Underwriters Laboratories
Organization: IPC
Year: 1998
Status: Inactive
7721 4.6.2
Title: Edge Contact Repair, Film Adhesive Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.17.2
Title: Volume Resistivity of Conductive Materials Used in High Density Interconnection (HDI) and Microvias, Two-Wire Method
Organization: IPC
Year: 1998
Status: Active
7721 2.3.1
Title: Coating Removal, Identification of Conformal Coating
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.16.2
Title: Treated Weight of Prepreg
Organization: IPC
Year: 1994
Status: Active
TM-650 5.4.6
Title: Weight Conversions
Organization: IPC
Year: 1973
Status: Inactive
TM-650 1.7A
Title: Reporting, Invalid Test Results
Organization: IPC
Year: 2003
Status: Active
TM-650 2.3.1.1B
Title: Chemical Cleaning of Metal Clad Laminate
Organization: IPC
Year: 1986
Status: Active
TM-650 2.3.32D
Title: Flux Induced Corrosion (Copper Mirror Method)
Organization: IPC
Year: 2004
Status: Active
7721 2.2
Title: Cleaning
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.6.1.1
Title: Fungus Resistance - Conformal Coating
Organization: IPC
Year: 2000
Status: Active
7711 3.6.1
Title: Gull Wing Removal (Two-Sided) Bridge Fill Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.2.15
Title: Cable Dimensions (Flat Cable)
Organization: IPC
Year: 1979
Status: Inactive
7711 8.1.1
Title: Mesh Splice
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.6.10A
Title: X-Ray (Radiography), Multilayer Printed Wiring Printed Board Test Methods
Organization: IPC
Year: 1997
Status: Active
TM-650 5.5.4.6
Title: Test Coupon D - Dielectric Withstanding Voltage and Outgassing
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.6.2
Title: Striped Solder Mask Coated Standard Test Pattern
Organization: IPC
Year: 1998
Status: Inactive
7711 3.7.5
Title: Gull Wing Removal (Four-Sided) Solder Wrap Method - Tweezer
Organization: IPC
Year: 1998
Status: Inactive
7711 3.6.6
Title: Gull Wing Removal (Two-Sided) Flux Application Method - Tweezer
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.1.5A
Title: Determination of Treatment Transfer
Organization: IPC
Year: 1995
Status: Active
PE-74 SECTION 17
Title: Component Preparation and Assembly
Organization: IPC
Status: Inactive
TM-650 2.3.24
Title: Porosity of Gold Plating (Chemical Method)
Organization: IPC
Year: 1978
Status: Active
7721 4.6.3
Title: Edge Contact Repair, Plating Method
Organization: IPC
Year: 1998
Status: Inactive
7711 2.4.5
Title: Coating Removal Grinding/Scraping Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.4.18
Title: Capacitance Test
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.4.14
Title: Test Pattern - Insulation Errors
Organization: IPC
Year: 1998
Status: Inactive
7721 4.7.2
Title: Surface Mount Pad Repair, Film Adhesive Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.37A
Title: Evaluation of Hand Soldering Tools for Terminal Connections
Organization: IPC
Year: 1991
Status: Inactive
TM-650 2.4.41.4
Title: Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates
Organization: IPC
Year: 1995
Status: Active
TM-650 2.4.8.2A
Title: Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)
Organization: IPC
Year: 1994
Status: Active
TM-650 2.4.15A
Title: Surface Finish, Metal Foil
Organization: IPC
Year: 1976
Status: Active
7711 6.1.2
Title: Removing Shorts on J-Leads Respread Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.1.410
Title: Analysis of Epoxy Resin for Activity
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.3.31
Title: Relative Degree of Cure in U.V. Curable Materials
Organization: IPC
Year: 1988
Status: Inactive
TM-650 2.6.20A
Title: Assessment of Plastic Encapsulated Electronic Components for Susceptibility to Moisture/Reflow Induced Damage
Organization: IPC
Year: 1995
Status: Inactive
TM-650 5.5.2.3
Title: Test Method 2.5.17 - Volume Resistivity and Surface Resistance
Organization: IPC
Year: 1998
Status: Inactive
7721 2.5
Title: Baking and Preheating
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.7.2A
Title: Alkaline Etching Method
Organization: IPC
Year: 1994
Status: Active
TM-650 2.5.10.1
Title: Insulation Resistivity for Adhesive Interconnection Bonds
Organization: IPC
Year: 1998
Status: Active
TM-650 5.7.3
Title: Incoming Acceptance Testing of Glass Cloth Pre-Pregs
Organization: IPC
Year: 1973
Status: Inactive
TM-650 2.5.3B
Title: Current Breakdown, Plated Through-Holes
Organization: IPC
Year: 1997
Status: Active
TM-650 1.8A
Title: Measurement Precision Estimation for Binary Data
Organization: IPC
Year: 2003
Status: Active
PE-74 SECTION 5
Title: Mechanical Operations
Organization: IPC
Status: Inactive
TM-650 2.3.17.2B
Title: Resin Flow of "No Flow" Prepreg
Organization: IPC
Year: 1997
Status: Active
7721 4.3.2
Title: Conductor Cut, Inner Layer Conductors
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.30A
Title: Solvent pH Determination in Anhydrous Fluorocarbon Solvents
Organization: IPC
Year: 1981
Status: Active
TM-650 3.6A
Title: Insulation Resistance, Connectors
Organization: IPC
Year: 1975
Status: Inactive
7711 3.6.4
Title: Gull Wing Removal (Two-Sided) Bridge Fill Method - Tweezer
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.1.6
Title: IPC-A-30 - Flexible Circuits Test Pattern
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.16.1C
Title: Resin Content of Prepreg, by Treated Weight
Organization: IPC
Year: 1994
Status: Active
TM-650 2.1.2A
Title: Pinhole Evaluation, Dye Penetration Method
Organization: IPC
Year: 1976
Status: Active
TM-650 5.5.1.2
Title: IPC-A-23 - IPC-TF-870 Qualification
Organization: IPC
Year: 1998
Status: Inactive
7711 2.3.1
Title: Baking and Preheating
Organization: IPC
Year: 1998
Status: Inactive
FC-225
Title: Flat Cable Design Guide
Organization: IPC
Year: 1975
Status: Inactive
TM-650 5.5.4.13
Title: Test Pattern - Bottom Conductors
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.2.14.1
Title: Solder Powder Particle Size Distribution - Measuring Microscope Method
Organization: IPC
Year: 1995
Status: Active
TM-650 3.16
Title: Fretting Corrosion, Connectors
Organization: IPC
Year: 1978
Status: Inactive
TM-650 2.5.33.3
Title: Measurement of Electrical Overstress from Soldering Hand Tools - Current Leakage Measurements
Organization: IPC
Year: 1998
Status: Active
TM-650 2.4.3.2C
Title: Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics
Organization: IPC
Year: 1991
Status: Active
TM-650 2.6.7.1A
Title: Thermal Shock - Conformal Coating
Organization: IPC
Year: 2000
Status: Inactive
7711 8.1.2
Title: Wrap Slice
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.8.1
Title: Flexible Circuit Test Pattern
Organization: IPC
Year: 1973
Status: Inactive
TM-650 2.3.24.1
Title: Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method
Organization: IPC
Year: 1985
Status: Active
TM-650 2.5.7.1
Title: Dielectric Withstanding Voltage - Polymeric Conformal Coating
Organization: IPC
Year: 2000
Status: Active
7711 5.2.1
Title: PGA and Connector Installation Solder Fountain Method with PTH Prefilled
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.7.1
Title: Incoming Acceptance Testing of Copper Foil
Organization: IPC
Year: 1973
Status: Inactive
7711 4.1.1
Title: Surface Mount Land Preparation Individul Method
Organization: IPC
Year: 1998
Status: Inactive
PE-74 SECTION 10
Title: Electroplating
Organization: IPC
Status: Inactive
TM-650 2.5.19A
Title: Propagation Delay of Flat Cables Using Time Domain Reflectometer
Organization: IPC
Year: 1984
Status: Active
TM-650 2.3.7.1A
Title: Cupric Chloride Etching Method
Organization: IPC
Year: 1994
Status: Active
7721 4.3.4
Title: Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method
Organization: IPC
Year: 1998
Status: Inactive
7711 3.7.7
Title: Gull Wing Removal (Four-Sided) Hot Gas (Air) Reflow Method
Organization: IPC
Year: 1998
Status: Inactive
7711 5.7.1
Title: BGA/CSP Installation Using Wire Solder to Prefill Lands
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.42.1
Title: High Temperature Mechanical Strength Retention of Adhesives
Organization: IPC
Year: 1988
Status: Active
7721 3.5.3
Title: Base Material Repair, Edge Transplant Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.8C
Title: Peel Strength of Metallic Clad Laminates
Organization: IPC
Year: 1994
Status: Active
7711 3.5.2
Title: SOT Removal Flux Application Method - Tweezer
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.6.9B
Title: Vibration, Rigid Printed Wiring
Organization: IPC
Year: 2004
Status: Active
TM-650 2.4.47
Title: Flux Residue Dryness
Organization: IPC
Year: 1995
Status: Active
7711 6.1.1
Title: Removing Shorts on J-Leads Draw Off Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.4.8
Title: Test Coupon D - Resistance by Electromigration
Organization: IPC
Year: 1998
Status: Inactive
7711 3.4.1
Title: Leadless Component Removal Solder Wrap Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.2A
Title: Capacitance of Insulating Materials
Organization: IPC
Year: 1975
Status: Active
7721 3.5.1
Title: Base Material Repair, Epoxy Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.6.12
Title: Temperature Testing, Flexible Flat Cable
Organization: IPC
Year: 1979
Status: Inactive
TM-650 2.3.7A
Title: Etching Ferric Chloride Method
Organization: IPC
Year: 1975
Status: Active
TM-650 2.6.17
Title: Hydrolytic Stability, Flexible Printed Wiring Material
Organization: IPC
Year: 1982
Status: Inactive
TM-650 2.3.38C
Title: Surface Organic Contaminant Detection Test
Organization: IPC
Year: 2004
Status: Inactive
7721 4.2.4
Title: Conductor Repair, Surface Wire Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.45
Title: Solder Paste - Wetting Test
Organization: IPC
Year: 1995
Status: Active
7721 4.1.1
Title: Lifted Conductor Repair, Epoxy Seal Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.4.12
Title: Test Coupon L - Line Resistivity
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.1.440
Title: Analysis of Pre-Preg Materials for Gel Time
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.6.22
Title: Acoustic Microscopy for Plastic Encapsulated Electronic Components
Organization: IPC
Year: 1995
Status: Inactive
TM-650 2.4.32A
Title: Fold Temperature Testing, Flexible Flat Cable
Organization: IPC
Year: 1986
Status: Inactive
7721 2.3.2
Title: Coating Removal, Solvent Method
Organization: IPC
Year: 1998
Status: Inactive
7711 8.1
Title: Splicing
Organization: IPC
Year: 1998
Status: Inactive
7721 4.2.5
Title: Conductor Repair, Through Board Wire Method
Organization: IPC
Year: 1999
Status: Inactive
7711 2.4.3
Title: Coating Removal Peeling Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.6.19
Title: Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards
Organization: IPC
Year: 1987
Status: Inactive
TM-650 2.4.3.1C
Title: Flexural Fatigue and Ductility, Flexible Printed Wiring
Organization: IPC
Year: 1991
Status: Active
TM-650 3.2A
Title: Contact Retention, Connectors
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.5.30
Title: Balanced and Unbalanced Cable Attenuation Measurements
Organization: IPC
Year: 1987
Status: Active
TM-650 2.5.5.10
Title: High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials
Organization: IPC
Year: 2005
Status: Active
7721 4.3.3
Title: Deleting Inner Layer Connection at a Plated Hole, Drill Through Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.14A
Title: Resistivity of Copper Foil
Organization: IPC
Year: 1976
Status: Active
TM-650 2.2.19
Title: Measuring Hole Pattern Location
Organization: IPC
Year: 1987
Status: Inactive
TM-650 2.2.3
Title: Conductor Edge Definition
Organization: IPC
Year: 1973
Status: Inactive
TM-650 2.5.17.1A
Title: Volume and Surface Resistivity of Dielectric Materials
Organization: IPC
Year: 1994
Status: Active
7721 2.7.2
Title: Legend/Marking, Hand Lettering Method
Organization: IPC
Year: 1998
Status: Inactive
H-855
Title: Hybrid Microcircuit Design Guide
Organization: IPC
Year: 1982
Status: Inactive
AM-361
Title: Specification for Rigid Substrates for Additive Process Printed Boards
Organization: IPC
Year: 1982
Status: Inactive
7721 4.4.2
Title: Lifted Land Repair, Film Adhesive Method
Organization: IPC
Year: 1998
Status: Inactive
7711 3.8.2.1
Title: J-Lead Removal Solder Wrap Method - Surface Tension
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.23B
Title: Cure (Permanency) Thermally Cured Solder Masks
Organization: IPC
Year: 1988
Status: Inactive
TM-650 2.4.14
Title: Solderability of Metallic Surfaces
Organization: IPC
Year: 1973
Status: Inactive
TM-650 1.5A
Title: Reporting, Format
Organization: IPC
Year: 2003
Status: Active
TM-650 2.3.37B
Title: Volatile Content of Adhesive Coated Dielectric Films
Organization: IPC
Year: 1998
Status: Active
TM-650 1.8 GUIDE
Title: Measurement Precision Calculator Users Guide For Use with Test Method 1.8, Measurement Systems Analysis for Binary Data
Organization: IPC
Year: 2003
Status: Inactive
7711 3.3.3
Title: Chip Removal (Bottom Termination) Hot Air Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.46A
Title: Spread Test, Liquid, Paste or Solid Flux, or Flux Extracted from Solder Paste, Cored Wires or Preforms
Organization: IPC
Year: 2004
Status: Active
TM-650 2.4.48
Title: Spitting of Flux-Cored Wire Solder
Organization: IPC
Year: 1995
Status: Active
7721 2.3.6
Title: Coating Removal, Micro Blasting Method
Organization: IPC
Year: 1998
Status: Inactive
7711 3.10.1
Title: PLCC Socket Removal Bridge Fill Method
Organization: IPC
Year: 1998
Status: Inactive
7721 6.3
Title: Component Modifications and Additions
Organization: IPC
Year: 2001
Status: Inactive
7721 4.5.1
Title: Land Repair, Epoxy Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.41.3
Title: In-Plane Coefficient of Thermal Expansion, Organic Films
Organization: IPC
Year: 1995
Status: Active
TM-650 2.5.32
Title: Resistance Test, Plated Through Holes
Organization: IPC
Year: 1987
Status: Inactive
7721 5.3
Title: Plated Hole Repair, Inner Layer Connection
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.18B
Title: Characteristic Impedance Flat Cables (Unbalanced)
Organization: IPC
Year: 1984
Status: Active
TM-650 2.5.33.4
Title: Measurement of Electrical Overstress from Soldering Hand Tools - Shielded Enclosure
Organization: IPC
Year: 1998
Status: Active
TM-650 2.4.18.2
Title: Hot Rupture Strength, Foil
Organization: IPC
Year: 1989
Status: Active
7721 2.3.3
Title: Coating Removal, Peeling Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.2.1A
Title: Mechanical Dimensional Verification
Organization: IPC
Year: 1997
Status: Active
TM-650 5.4.2
Title: Conversion Tables
Organization: IPC
Year: 1973
Status: Inactive
TM-650 5.1.442
Title: Analysis of Pre-Preg Materials for Volatile Content
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.2.14
Title: Solder Powder Particle Size Distribution - Screen Method for Types 1-4
Organization: IPC
Year: 1995
Status: Active
TM-650 2.4.5
Title: Folding Endurance, Flexible Printed Wiring Materials
Organization: IPC
Year: 1973
Status: Inactive
7711 4.2.1
Title: Pad Releveling Using Blade Tip
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.13F
Title: Solder Float Resistance Flexible Printed Wiring Materials
Organization: IPC
Year: 1998
Status: Active
TM-650 2.3.21A
Title: Plating Quality Hull Cell Method
Organization: IPC
Year: 1997
Status: Active
PE-74 SECTION 3
Title: Photo Tooling
Organization: IPC
Status: Inactive
TM-650 2.4.41.1A
Title: Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method
Organization: IPC
Year: 1997
Status: Active
PE-74 SECTION 16
Title: Nonmetallic Protective Coatings
Organization: IPC
Status: Inactive
TM-650 2.6.15C
Title: Corrosion, Flux
Organization: IPC
Year: 2004
Status: Active
TM-650 5.5.1.15
Title: IPC-A-43 - Ten Layer Test Pattern
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.2.1
Title: Test Method 2.6.18 - Low Temperature Flexibility
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.1.130
Title: Analysis of Rhodium Electroplating Solutions
Organization: IPC
Year: 1975
Status: Inactive
7711 5.5.2
Title: Gull Wing Installation Multi-Lead Method - Toe Tip
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.2.2
Title: Test Method 2.6.3.2 - Insulation and Moisture Resistance
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.8.3
Title: Peel Strength Test Pattern
Organization: IPC
Year: 1973
Status: Inactive
TM-650 2.4.41.2A
Title: Coefficient of Thermal Expansion-Strain Gage Method
Organization: IPC
Year: 2004
Status: Active
TM-650 2.3.17D
Title: Resin Flow Percent of Prepreg
Organization: IPC
Year: 1997
Status: Active
TM-650 2.6.8.1
Title: Thermal Stress, Laminate
Organization: IPC
Year: 1991
Status: Active
7711 3.7.3.1
Title: Gull Wing Removal (Four-Sided) Flux Application Method - Surface Tension
Organization: IPC
Year: 1998
Status: Inactive
TM-650 3.17
Title: Industrial Gas Test (Battelle Method), Connectors
Organization: IPC
Year: 1978
Status: Inactive
TM-650 5.7
Title: Subsection Table of Contents
Organization: IPC
Year: 1973
Status: Inactive
PE-74 SECTION 15
Title: Metallic Protective Coatings
Organization: IPC
Status: Inactive
TM-650 2.4.40
Title: Inner Layer Bond Strength of Multilayer Printed Circuit Boards
Organization: IPC
Year: 1987
Status: Active
TM-650 5.5.4.4
Title: Test Coupon B - Adhesion, Passivation, Dielectric Resistance, and Outgassing
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.24.2A
Title: Porosity of Metallic Coatings on Copper-Base Alloys and Nickel (Nitric Acid Vapor Test)
Organization: IPC
Year: 1997
Status: Active
TM-650 2.4.43
Title: Solder Paste - Solder Ball Test
Organization: IPC
Year: 1995
Status: Active
TM-650 5.5.1.13
Title: IPC-A-41 - Single-Sided Test Pattern
Organization: IPC
Year: 1998
Status: Inactive
7721 3.2
Title: Bow and Twist Repair
Organization: IPC
Year: 1998
Status: Inactive
7711 5.7.2
Title: BGA/CSP Installation Using Solder Paste to Prefill Lands
Organization: IPC
Year: 1998
Status: Inactive
7711 3.10.4
Title: PLCC Socket Removal Hot Air Pencil Method
Organization: IPC
Year: 1998
Status: Inactive
7711 4.4.1
Title: Cleaning SMT Lands Using Blade Tip and Solder Braid
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.1.112
Title: Analysis of Gold, Cyanide Electroplating Solutions
Organization: IPC
Year: 1975
Status: Inactive
7711 3.3.1
Title: Chip Component Removal Bifurcated Tip
Organization: IPC
Year: 1998
Status: Inactive
FC-222
Title: Specification for Flat Cable, Round Conductor, Unshielded
Organization: IPC
Year: 1980
Status: Inactive
TM-650 5.8.5
Title: Chemical Resistance Solvent Sensitivity Test Pattern
Organization: IPC
Year: 1973
Status: Inactive
TM-650 INTRO
Title: Test Methods Manual
Organization: IPC
Status: Inactive
TM-650 2.3.10B
Title: Flammability of Laminate
Organization: IPC
Year: 1994
Status: Active
TM-650 5.5.2.7
Title: Test Method 2.3.2 - Chemical Resistance of Flexible Printed Wiring Materials
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.24.5
Title: Glass Transition Temperature and Thermal Expansion of Materials Used in High Density Interconnection (HDI) and Microvias - TMA Method
Organization: IPC
Year: 1998
Status: Active
TM-650 2.4.5.1
Title: Flexibility - Conformal Coating
Organization: IPC
Year: 2000
Status: Active
FC-217
Title: General Document for Connectors, Electric, Header/Receptacle, Insulation Displacement for Use with Round Conductor Flat Cable
Organization: IPC
Year: 1982
Status: Inactive
TM-650 2.5.6B
Title: Dielectric Breakdown of Rigid Printed Wiring Material
Organization: IPC
Year: 1986
Status: Active
TM-650 2.4.4B
Title: Flexural Strength of Laminates (at Ambient Temperature)
Organization: IPC
Year: 1994
Status: Active
TM-650 2.3.40
Title: Thermal Stability
Organization: IPC
Year: 1995
Status: Active
TM-650 2.5.8A
Title: Dissipation Factor of Flexible Printed Wiring Material
Organization: IPC
Year: 1975
Status: Inactive
TM-650 3.18
Title: Mating and Unmating Force, Connectors
Organization: IPC
Year: 1983
Status: Inactive
TM-650 2.5.15A
Title: Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable
Organization: IPC
Year: 1986
Status: Active
TM-650 2.3.26.1
Title: Ionizable Detection of Surface Contaminants (Static Method)
Organization: IPC
Year: 1994
Status: Inactive
TM-650 5.4.1
Title: The Metric System
Organization: IPC
Year: 1973
Status: Inactive
TM-650 2.2.6A
Title: Hole Size Measurement, Drilled
Organization: IPC
Year: 1997
Status: Active
100001 REVISION A
Title: Universal Drilling and Profile Master Drawing
Organization: IPC
Year: 1989
Status: Inactive
TM-650 2.5.28A
Title: Q Resonance, Flexible Printed Wiring Materials
Organization: IPC
Year: 1988
Status: Inactive
TM-650 5.6
Title: Incoming Acceptance Testing
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.13A
Title: Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
Organization: IPC
Year: 2004
Status: Active
7711 3.8.3
Title: J-Lead Removal (Four-Sided) Flux Application Method - Tweezer
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.6.3.3B
Title: Surface Insulation Resistance, Fluxes
Organization: IPC
Year: 2004
Status: Active
TM-650 2.4.24C
Title: Glass Transition Temperature and Z-Axis Thermal Expansion by TMA
Organization: IPC
Year: 1994
Status: Active
TM-650 2.1.9
Title: Surface Scratch Examination Metal-Clad Foil
Organization: IPC
Year: 1986
Status: Active
TM-650 5.5
Title: Artwork
Organization: IPC
Year: 1998
Status: Inactive
7711 3.6.2
Title: Gull Wing Removal (Two-Sided) Solder Wrap Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.1.12
Title: IPC-A-39 - Small Hole reliability Test Pattern
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.21A
Title: Digital Unbalanced Crosstalk, Flat Cable
Organization: IPC
Year: 1984
Status: Active
TM-650 2.2.13.1A
Title: Thickness, Plating in Holes Micro-Ohms Method
Organization: IPC
Year: 1983
Status: Active
TM-650 2.2.7A
Title: Hole Size Measurement, Plated
Organization: IPC
Year: 1986
Status: Active
TM-650 2.5.5A
Title: Dielectric Constant of Printed Wiring Materials
Organization: IPC
Year: 1975
Status: Inactive
PE-74 SECTION 13
Title: Lamination
Organization: IPC
Status: Inactive
FC-213
Title: Performance Specification for Flat Undercarpet Telephone Cable
Organization: IPC
Year: 1984
Status: Inactive
TM-650 2.2.17A
Title: Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique)
Organization: IPC
Year: 2001
Status: Active
TM-650 2.3.22
Title: Copper Protective Coating Quality
Organization: IPC
Year: 1978
Status: Active
TM-650 2.5.16A
Title: Shorts, Internal on Multilayer Printed Wiring
Organization: IPC
Year: 1988
Status: Inactive
TM-650 2.2.16.1
Title: Artwork Master Evaluation by Overlay
Organization: IPC
Year: 1987
Status: Inactive
TM-650 2.4.18.1A
Title: Tensile Strength and Elongation, In-House Plating
Organization: IPC
Year: 2004
Status: Active
CC-110A
Title: Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications
Organization: IPC
Year: 1997
Status: Inactive
7721 3.3.2
Title: Hole Repair, Transplant Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.8.6
Title: IPC Multi-Purpose Test Board Pattern (IPC-B-25)
Organization: IPC
Year: 1979
Status: Inactive
AM-372
Title: Electroless Copper Film for Additive Printed Boards
Organization: IPC
Year: 1978
Status: Inactive
TM-650 2.5.25A
Title: Dielectric Withstand Voltage Flexible Flat Cable
Organization: IPC
Year: 1985
Status: Inactive
7721 5.2
Title: Plated Hole Repair, Double Wall Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.8A
Title: Subsection Table of Contents
Organization: IPC
Year: 1984
Status: Inactive
TM-650 2.2.5A
Title: Dimensional Inspections Using Microsections
Organization: IPC
Year: 1997
Status: Active
TM-650 5.5.1.9
Title: IPC-B-36 - Cleaning Alternatives Test Pattern
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.4.17
Title: Tear Strength (Propagation)
Organization: IPC
Year: 1973
Status: Active
TM-650 2.3.23.1A
Title: Cure (Permanency) UV Initiated Dry Film Solder Masks
Organization: IPC
Year: 1988
Status: Inactive
FC-218B
Title: General Specification for Connectors, Electrical Flat Cable Type
Organization: IPC
Year: 1976
Status: Inactive
TM-650 3.10A
Title: Solderability, Connectors
Organization: IPC
Year: 1975
Status: Inactive
TM-650 5.5.1.16
Title: IPC-A-44 - Four Layer Test Pattern
Organization: IPC
Year: 1998
Status: Inactive
7711 5.6.1
Title: J-Lead Installation Wire Solder Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.3.26.2
Title: Mobile Ion Content of Polymer Films
Organization: IPC
Year: 1995
Status: Inactive
TM-650 2.3.4.2A
Title: Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure
Organization: IPC
Year: 1994
Status: Active
TM-650 2.2.12.2
Title: Weight and Thickness of Copper Foils with Releasable Carriers
Organization: IPC
Year: 1989
Status: Active
TM-650 5.8.4A
Title: Rigid Multilayer Test Pattern
Organization: IPC
Year: 1978
Status: Inactive
7711 6.1.4
Title: Removing Shorts Between Gull Wing Respread Method
Organization: IPC
Year: 1998
Status: Inactive
TM-650 5.5.6.3
Title: Standard Insulation Resistance Test Pattern
Organization: IPC
Year: 1998
Status: Inactive
SF-818
Title: General Requirements for Electronic Soldering Fluxes
Organization: IPC
Year: 1988
Status: Inactive
TM-650 2.2.10A
Title: Hole Location and Conductor Location
Organization: IPC
Year: 1983
Status: Inactive
TM-650 5.4.4
Title: Special Conversions
Organization: IPC
Year: 1973
Status: Inactive
TM-650 2.3.1
Title: Chemical Processing, Suitable Processing Material
Organization: IPC
Year: 1973
Status: Active
7711 4.1.2
Title: Surface Mount Land Preparation Continuous Method
Organization: IPC
Year: 1998
Status: Inactive
7721 3.1
Title: Delamination/Blister Repair, Injection Method
Organization: IPC
Year: 1998
Status: Inactive
7711 5.3.1
Title: Chip Installation Solder Paste Method/Hot Air Pencil
Organization: IPC
Year: 1998
Status: Inactive
7711 5.5.6
Title: Gull Wing Installation Blade Tip With Wire
Organization: IPC
Year: 1998
Status: Inactive
TM-650 3.5A
Title: Humidity, Connectors
Organization: IPC
Year: 1975
Status: Inactive
7721 INTRO
Title: Repair and Modification of Printed Boards and Electronic Assemblies
Organization: IPC
Year: 1998
Status: Inactive
TM-650 2.5.26A
Title: Insulation Resistance, Flexible Flat Cable
Organization: IPC
Year: 1985
Status: Inactive
TM-650 3.3A
Title: Crimp Tensile Strength, Connectors
Organization: IPC
Year: 1975
Status: Inactive
TM-650 2.4.30
Title: Impact Resistance, Polymer Film
Organization: IPC
Year: 1986
Status: Active
7721 4.6.1
Title: Edge Contact Repair, Epoxy Method
Organization: IPC
Year: 1998
Status: Inactive


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